公开(公告)号：US11097554B2

公开(公告)日：2021-08-24

申请号：US16911293

申请日：2020-06-24

Applicant: Rohm Co., Ltd.

Inventor： Goro Nakatani ,  Akira Fujita ,  Kazuya Nakakubo ,  Yasuhiro Fuwa

IPC: B41J2/335 ,  B41J2/34

Abstract: A thermal printhead includes a substrate, a protrusion formed on an obverse surface of the substrate and extending in a main scanning direction, a heat storage layer formed on a top surface of the protrusion, and a plurality of heat-generating parts arranged along the main scanning direction on the heat storage layer. The substrate and the protrusion are integrally formed from a single-crystal semiconductor.

公开(公告)号：US20190263141A1

公开(公告)日：2019-08-29

申请号：US16280791

申请日：2019-02-20

Applicant: Rohm Co., Ltd.

Inventor： Toshihiro Kimura ,  Akira Fujita ,  Kazuya Nakakubo ,  Satoshi Kimoto ,  Yasuhiro Yoshikawa ,  Tadashi Yamamoto

IPC: B41J2/335 ,  B41J2/34 ,  B41J2/345

Abstract: A thermal printhead includes a substrate, a resistor layer with heat generation portions supported by the substrate and aligned in a primary scanning direction, a wiring layer supported by the substrate to form a conductive path to the heat generation portions, an insulating layer interposed between the substrate and the resistor layer, and a reflection layer located opposite to the heat generation portions with respect to the insulating layer. The reflection layer overlaps with the heat generation portions as viewed in a thickness direction of the heat generation portions and has a greater heat reflectivity than the insulating layer.