公开(公告)号：US10460989B2

公开(公告)日：2019-10-29

申请号：US15233657

申请日：2016-08-10

Applicant: ROHM CO., LTD.

Inventor： Hirofumi Takeda ,  Satoshi Kimoto

IPC: H01L33/62 ,  H01L21/768 ,  H01L29/04 ,  G01R33/00 ,  G01R33/02

Abstract: A semiconductor device includes a semiconductor element, a semiconductor substrate on which the semiconductor element is mounted, a conductive layer formed on the substrate, and a sealing resin covering the semiconductor element. The substrate is formed with a recess receding from a main surface of the substrate and including a bottom surface and first and second sloped surfaces spaced apart from each other in a first direction perpendicular to the thickness direction of the substrate. The conductive layer includes first conduction paths on the first sloped surface, second conduction paths on the second sloped surface and bottom conduction paths on the bottom surface. The second sloped surface includes exposed regions line-symmetrical to the first conduction paths with respect to a line perpendicular to both the thickness direction of the substrate and the first direction, and the second conduction paths are not disposed at the exposed regions.

公开(公告)号：US20190263141A1

公开(公告)日：2019-08-29

申请号：US16280791

申请日：2019-02-20

Applicant: Rohm Co., Ltd.

Inventor： Toshihiro Kimura ,  Akira Fujita ,  Kazuya Nakakubo ,  Satoshi Kimoto ,  Yasuhiro Yoshikawa ,  Tadashi Yamamoto

IPC: B41J2/335 ,  B41J2/34 ,  B41J2/345

Abstract: A thermal printhead includes a substrate, a resistor layer with heat generation portions supported by the substrate and aligned in a primary scanning direction, a wiring layer supported by the substrate to form a conductive path to the heat generation portions, an insulating layer interposed between the substrate and the resistor layer, and a reflection layer located opposite to the heat generation portions with respect to the insulating layer. The reflection layer overlaps with the heat generation portions as viewed in a thickness direction of the heat generation portions and has a greater heat reflectivity than the insulating layer.

公开(公告)号：US12077005B2

公开(公告)日：2024-09-03

申请号：US17915274

申请日：2021-03-26

Applicant: ROHM CO., LTD.

Inventor： Satoshi Kimoto

IPC: B41J2/335 ,  B41J2/34 ,  B41J2/345

CPC classification number: B41J2/3352 ,  B41J2/3351 ,  B41J2/33515 ,  B41J2/33525 ,  B41J2/3353 ,  B41J2/33535 ,  B41J2/3354 ,  B41J2/33545 ,  B41J2/3355 ,  B41J2/3357 ,  B41J2/3359 ,  B41J2/34 ,  B41J2/345

Abstract: A thermal print head includes a substrate, a resistor layer and a wiring layer. The substrate is made of a single crystal semiconductor and includes an obverse surface facing in one sense of a thickness direction. The resistive layer is supported by the substrate and includes a plurality of heat generating parts arranged side by side in a main scanning direction. The wiring layer is supported by the substrate and forms a conductive path to the plurality of heat generating parts. The wiring layer includes a conductive part and a heat generating sub-part for each of the plurality of heat generating parts, where the conductive part has a lower resistance value per unit length in a sub-scanning direction than the heat generating part, and where the heat generating sub-part has a resistance value per unit length in the sub-scanning direction that falls between the respective resistance values of the heat generating part and the conductive part. The substrate includes a ridge raised from the obverse surface and extending in the main scanning direction. The heat generating part, the heat generating sub-part and the conductive part are disposed on the ridge. The heat generating sub-part is located between the heat generating part and the conductive part in the sub-scanning direction.

公开(公告)号：US11926156B2

公开(公告)日：2024-03-12

申请号：US17723073

申请日：2022-04-18

Applicant: ROHM CO., LTD.

Inventor： Satoshi Kimoto

IPC: B41J2/14 ,  B41J2/16

CPC classification number: B41J2/14129 ,  B41J2/1601 ,  B41J2/1626

Abstract: The present disclosure provides a thermal print head and a method of fabricating the thermal print head. The thermal print head includes a substrate made of a semiconductor material and having a main surface and a convex portion, a resistor layer including a plurality of heat generating portions on the convex portion, and a wiring layer conducted to the plurality of heat generating portions and formed to contact the resistor layer. The convex portion has a top surface, a first inclined surface and a second inclined surface. At least one of two ends of the convex portion in the main scanning direction forms a third inclined surface connected to the main surface and the first inclined surface, and a fourth inclined surface connected to the main surface and the second inclined surface.