公开(公告)号：US20040263290A1

公开(公告)日：2004-12-30

申请号：US10793574

申请日：2004-03-04

Applicant: Rohm and Haas Electronic Materials, L.L.C.

Inventor： David W. Sherrer ,  John J. Fisher

IPC: H01P003/06 ,  H01P003/08

CPC classification number: H01P3/06 ,  H01P1/08 ,  H01P3/00 ,  H01P5/103 ,  H01P5/183 ,  H01P11/002 ,  H01P11/003 ,  H01P11/005 ,  H05K1/0221 ,  H05K1/0272 ,  H05K3/4644 ,  H05K3/4685 ,  H05K2201/09809 ,  Y10T29/49117 ,  Y10T29/49123

Abstract: Provided are coaxial waveguide microstructures. The microstructures include a substrate and a coaxial waveguide disposed above the substrate. The coaxial waveguide includes: a center conductor; an outer conductor including one or more walls, spaced apart from and disposed around the center conductor; one or more dielectric support members for supporting the center conductor in contact with the center conductor and enclosed within the outer conductor; and a core volume between the center conductor and the outer conductor, wherein the core volume is under vacuum or in a gas state. Also provided are methods of forming coaxial waveguide microstructures by a sequential build process and hermetic packages which include a coaxial waveguide microstructure.

Abstract translation: 提供同轴波导微结构。 微结构包括设置在衬底上方的衬底和同轴波导。 同轴波导包括：中心导体; 包括一个或多个壁的外导体，与中心导体间隔开并设置在中心导体周围; 一个或多个电介质支撑构件，用于支撑与中心导体接触并封闭在外部导体内的中心导体; 以及中心导体和外部导体之间的芯体积，其中芯体积处​​于真空状态或气体状态。 还提供了通过顺序构建工艺形成同轴波导微结构的方法和包括同轴波导微结构的密封封装。