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公开(公告)号：US20240253176A1
公开(公告)日：2024-08-01
申请号：US18404443
申请日：2024-01-04
发明人： Yu-Chung SU , Hyunjin KIM
IPC分类号： B24B37/20 , B24B37/013
CPC分类号： B24B37/205 , B24B37/013
摘要： A polishing pad for chemical mechanical polishing comprising a porous polishing layer having a top polishing surface, a sub-pad located opposite from the top polishing surface, the sub-pad having a bottom sub-pad surface, and a window for transmitting a signal wave through the polishing pad to a substrate to be polished and back through the polishing pad for endpoint detection, the window having a top window surface, a bottom window surface, and side edges, wherein the top window surface is recessed from the top polishing surface, the bottom window surface is substantially coplanar with the bottom sub-pad surface, the window extending from the bottom sub-pad surface to the top window surface and the side edges are in contact with the polishing material and the sub-pad material and wherein the window is non-porous.
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公开(公告)号：US20240253177A1
公开(公告)日：2024-08-01
申请号：US18404519
申请日：2024-01-04
发明人： Yu-Chung SU , Lee Melbourne COOK , Hyunjin KIM
IPC分类号： B24B37/20
CPC分类号： B24B37/205
摘要： A polishing pad for chemical mechanical polishing comprises a polishing layer having a top polishing surface, a sub-pad located opposite from the top polishing surface, the sub-pad comprising a sub-pad material and having a bottom sub-pad surface defining a bottom surface of the polishing pad, and a window for transmitting a signal wave through the polishing pad to a substrate to be polished and back through the polishing pad for endpoint detection, the window having a top window surface, a bottom window surface, and side edges, wherein the top window surface is recessed from the top polishing surface, the bottom window surface is substantially coplanar with the bottom sub-pad surface, and the side edges are in contact with the polishing material and the sub-pad material.
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