公开(公告)号：US20240253177A1

公开(公告)日：2024-08-01

申请号：US18404519

申请日：2024-01-04

申请人： Rohm and Haas Electronic Materials CMP Holdings, Inc.

发明人： Yu-Chung SU ,  Lee Melbourne COOK ,  Hyunjin KIM

IPC分类号： B24B37/20

CPC分类号： B24B37/205

摘要： A polishing pad for chemical mechanical polishing comprises a polishing layer having a top polishing surface, a sub-pad located opposite from the top polishing surface, the sub-pad comprising a sub-pad material and having a bottom sub-pad surface defining a bottom surface of the polishing pad, and a window for transmitting a signal wave through the polishing pad to a substrate to be polished and back through the polishing pad for endpoint detection, the window having a top window surface, a bottom window surface, and side edges, wherein the top window surface is recessed from the top polishing surface, the bottom window surface is substantially coplanar with the bottom sub-pad surface, and the side edges are in contact with the polishing material and the sub-pad material.