公开(公告)号：US20240253176A1

公开(公告)日：2024-08-01

申请号：US18404443

申请日：2024-01-04

申请人： Rohm and Haas Electronic Materials CMP Holdings, Inc.

发明人： Yu-Chung SU ,  Hyunjin KIM

IPC分类号： B24B37/20 ,  B24B37/013

CPC分类号： B24B37/205 ,  B24B37/013

摘要： A polishing pad for chemical mechanical polishing comprising a porous polishing layer having a top polishing surface, a sub-pad located opposite from the top polishing surface, the sub-pad having a bottom sub-pad surface, and a window for transmitting a signal wave through the polishing pad to a substrate to be polished and back through the polishing pad for endpoint detection, the window having a top window surface, a bottom window surface, and side edges, wherein the top window surface is recessed from the top polishing surface, the bottom window surface is substantially coplanar with the bottom sub-pad surface, the window extending from the bottom sub-pad surface to the top window surface and the side edges are in contact with the polishing material and the sub-pad material and wherein the window is non-porous.

公开(公告)号：US20240253175A1

公开(公告)日：2024-08-01

申请号：US18404415

申请日：2024-01-04

申请人： Rohm and Haas Electronic Materials CMP Holdings, Inc.

发明人： Yu-Chung SU

IPC分类号： B24B37/20

CPC分类号： B24B37/205

摘要： A polishing pad for chemical mechanical polishing comprising a polishing layer having a top polishing surface, a bottom surface and a thickness. The polishing layer comprises a porous polishing material and a window region. An exposed top surface of the transparent window is recessed from the top polishing surface. The transparent window extends from the recess region to the bottom surface of the polishing pad. The transparent window is non-porous and a portion of the top surface of the peripheral portion adjacent to the transparent window is coplanar with the top surface of the transparent window and the exposed bottom surface of the transparent window is coplanar with the bottom surface of the polishing layer.

公开(公告)号：US20240253177A1

公开(公告)日：2024-08-01

申请号：US18404519

申请日：2024-01-04

申请人： Rohm and Haas Electronic Materials CMP Holdings, Inc.

发明人： Yu-Chung SU ,  Lee Melbourne COOK ,  Hyunjin KIM

IPC分类号： B24B37/20

CPC分类号： B24B37/205

摘要： A polishing pad for chemical mechanical polishing comprises a polishing layer having a top polishing surface, a sub-pad located opposite from the top polishing surface, the sub-pad comprising a sub-pad material and having a bottom sub-pad surface defining a bottom surface of the polishing pad, and a window for transmitting a signal wave through the polishing pad to a substrate to be polished and back through the polishing pad for endpoint detection, the window having a top window surface, a bottom window surface, and side edges, wherein the top window surface is recessed from the top polishing surface, the bottom window surface is substantially coplanar with the bottom sub-pad surface, and the side edges are in contact with the polishing material and the sub-pad material.