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    Capacitive electrode system for detecting open solder joints in printed circuit assemblies
    3.
    发明授权
    Capacitive electrode system for detecting open solder joints in printed circuit assemblies 失效
    用于检测印刷电路组件中的开放焊点的电容电极系统

    公开(公告)号：US5498964A

    公开(公告)日：1996-03-12

    申请号：US308236

    申请日：1994-09-19

    申请人： Ronald K. Kerschner ,  David T. Crook ,  Lisa M. Kent

    发明人： Ronald K. Kerschner ,  David T. Crook ,  Lisa M. Kent

    IPC分类号： G01R1/06 ,  G01R31/02 ,  G01R31/28 ,  G01R31/302 ,  G01R31/312 ,  G01R31/08

    CPC分类号： G01R31/2812 ,  G01R31/312

    摘要： Disclosed is a system that determines whether input and output leads of semiconductor components are present and properly soldered to a printed circuit board. The system includes a signal source which is connected to a wiring trace on the printed circuit board, which is soldered to the lead being tested. A capacitive test probe is placed on top of the component and connected to a capacitance measuring device. The signal source signal is capacitively coupled through the lead of the integrated circuit package being tested to the capacitive test probe, so if a predetermined capacitance is measured by the capacitance measuring device, the lead is connected to the circuit assembly. As the capacitances being measured are small, the capacitive test probe may include an amplifier, a shield or a buffer circuit to reduce stray capacitance.

    摘要翻译： 公开了一种确定半导体部件的输入和输出引线是否存在并被适当地焊接到印刷电路板的系统。 该系统包括一个信号源，该信号源连接到印刷电路板上的布线，焊接到待测试的引线上。 将电容测试探头放置在组件的顶部并连接到电容测量装置。 信号源信号通过被测试的集成电路封装的引线电容耦合到电容测试探针，因此如果由电容测量装置测量预定的电容，则引线连接到电路组件。 由于测量的电容很小，电容测试探头可以包括放大器，屏蔽或缓冲电路，以减少杂散电容。