公开(公告)号：US09490043B2

公开(公告)日：2016-11-08

申请号：US13403943

申请日：2012-02-23

Applicant: Rongwei Zhang ,  Ching-Ping Wong

Inventor： Rongwei Zhang ,  Ching-Ping Wong

IPC: H01B1/22 ,  C09J9/00 ,  C09J9/02

CPC classification number: H01B1/22 ,  C09J9/02

Abstract: The present invention provides for a relatively simple method to decrease the electrical resistivity of conductive adhesives by in-situ nanoparticle formation and sintering using a reducing agent. The reducing agent was found to cause sintering within the conductive adhesive by facilitating the reduction of the silver salts of fatty acids on the surface of silver flakes, leading to the formation of nano-/submicron-silver necks. These silver necks bridge neighboring silver flakes, decreasing the contact resistance between flakes within the conductive adhesives. The reducing agent also removes at least a portion of the lubricant commonly found on silver flakes used in conductive adhesives, thus reducing the tunneling resistance between the silver flakes.

Abstract translation: 本发明提供了一种相对简单的方法，通过使用还原剂的原位纳米颗粒形成和烧结来降低导电粘合剂的电阻率。 发现还原剂通过促进银薄片表面上的脂肪酸的银盐的还原而导致导电粘合剂内的烧结，导致纳米/亚微米银颈部的形成。 这些银颈围绕相邻的银薄片，降低了导电胶粘剂中薄片之间的接触电阻。 还原剂还除去在导电粘合剂中使用的银薄片上通常发现的润滑剂的至少一部分，从而降低了银薄片之间的隧道阻力。

公开(公告)号：US20130056689A1

公开(公告)日：2013-03-07

申请号：US13403943

申请日：2012-02-23

Applicant: Rongwei Zhang ,  Ching-Ping Wong

Inventor： Rongwei Zhang ,  Ching-Ping Wong

IPC: H01B1/02

CPC classification number: H01B1/22 ,  C09J9/02

Abstract: The present invention provides for a relatively simple method to decrease the electrical resistivity of conductive adhesives by in-situ nanoparticle formation and sintering using a reducing agent. The reducing agent was found to cause sintering within the conductive adhesive by facilitating the reduction of the silver salts of fatty acids on the surface of silver flakes, leading to the formation of nano-/submicron-silver necks. These silver necks bridge neighboring silver flakes, decreasing the contact resistance between flakes within the conductive adhesives. The reducing agent also removes at least a portion of the lubricant commonly found on silver flakes used in conductive adhesives, thus reducing the tunneling resistance between the silver flakes.

Abstract translation: 本发明提供了一种相对简单的方法，通过使用还原剂的原位纳米颗粒形成和烧结来降低导电粘合剂的电阻率。 发现还原剂通过促进银薄片表面上的脂肪酸的银盐的还原而导致导电粘合剂内的烧结，导致纳米/亚微米银颈部的形成。 这些银颈围绕相邻的银薄片，降低了导电胶粘剂中薄片之间的接触电阻。 还原剂还除去在导电粘合剂中使用的银薄片上通常发现的润滑剂的至少一部分，从而降低了银薄片之间的隧道阻力。

公开(公告)号：US20140147353A1

公开(公告)日：2014-05-29

申请号：US13820358

申请日：2011-09-02

Applicant: Wei Lin ,  Ching P. Wong ,  Rongwei Zhang

Inventor： Wei Lin ,  Ching P. Wong ,  Rongwei Zhang

IPC: C22B7/00

CPC classification number: C22B7/006 ,  C22B3/0005 ,  C22B11/046 ,  C23F1/10 ,  C23F1/12 ,  C23F1/44 ,  Y02P10/214 ,  Y02P10/234

Abstract: Methods and compositions are described for preparing metal salts and selectively separating metals from substrates and other metals. The methods can include a thionyl reagent that reacts with a metal in a solution to produce a metal salt. The reaction can be controlled by varying reagents and conditions such that the method can be used to selectively separate one or more metals from another metal or from a substrate. The method can also be used for removing metals from a surface. Compositions produced by the method are also described.

Abstract translation: 描述了用于制备金属盐并选择性地从基材和其它金属分离金属的方法和组合物。 该方法可以包括与溶液中的金属反应产生金属盐的亚硫酰基试剂。 反应可以通过变化的试剂和条件来控制，使得该方法可用于选择性地将一种或多种金属与另一种金属或底物分离。 该方法也可用于从表面除去金属。 还描述了通过该方法产生的组合物。