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公开(公告)号：US09490043B2
公开(公告)日：2016-11-08
申请号：US13403943
申请日：2012-02-23
Applicant: Rongwei Zhang , Ching-Ping Wong
Inventor： Rongwei Zhang , Ching-Ping Wong
Abstract: The present invention provides for a relatively simple method to decrease the electrical resistivity of conductive adhesives by in-situ nanoparticle formation and sintering using a reducing agent. The reducing agent was found to cause sintering within the conductive adhesive by facilitating the reduction of the silver salts of fatty acids on the surface of silver flakes, leading to the formation of nano-/submicron-silver necks. These silver necks bridge neighboring silver flakes, decreasing the contact resistance between flakes within the conductive adhesives. The reducing agent also removes at least a portion of the lubricant commonly found on silver flakes used in conductive adhesives, thus reducing the tunneling resistance between the silver flakes.
Abstract translation: 本发明提供了一种相对简单的方法，通过使用还原剂的原位纳米颗粒形成和烧结来降低导电粘合剂的电阻率。 发现还原剂通过促进银薄片表面上的脂肪酸的银盐的还原而导致导电粘合剂内的烧结，导致纳米/亚微米银颈部的形成。 这些银颈围绕相邻的银薄片，降低了导电胶粘剂中薄片之间的接触电阻。 还原剂还除去在导电粘合剂中使用的银薄片上通常发现的润滑剂的至少一部分，从而降低了银薄片之间的隧道阻力。
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2.发明授权Structures including carbon nanotubes, methods of making structures, and methods of using structures 有权包括碳纳米管的结构，制造结构的方法和使用结构的方法公开(公告)号：US08702897B2
公开(公告)日：2014-04-22
申请号：US12800934
申请日：2010-05-26
Applicant: Wei Lin , Ching Ping Wong
Inventor： Wei Lin , Ching Ping Wong
Abstract: Embodiments of the present disclosure include structures including a layer of carbon nanotubes, methods of making structures including a layer of carbon nanotubes, and the like.
Abstract translation: 本公开的实施例包括包括碳纳米管层的结构，制造包括碳纳米管层的结构的方法等。
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公开(公告)号：US20130056689A1
公开(公告)日：2013-03-07
申请号：US13403943
申请日：2012-02-23
Applicant: Rongwei Zhang , Ching-Ping Wong
Inventor： Rongwei Zhang , Ching-Ping Wong
IPC: H01B1/02
Abstract: The present invention provides for a relatively simple method to decrease the electrical resistivity of conductive adhesives by in-situ nanoparticle formation and sintering using a reducing agent. The reducing agent was found to cause sintering within the conductive adhesive by facilitating the reduction of the silver salts of fatty acids on the surface of silver flakes, leading to the formation of nano-/submicron-silver necks. These silver necks bridge neighboring silver flakes, decreasing the contact resistance between flakes within the conductive adhesives. The reducing agent also removes at least a portion of the lubricant commonly found on silver flakes used in conductive adhesives, thus reducing the tunneling resistance between the silver flakes.
Abstract translation: 本发明提供了一种相对简单的方法，通过使用还原剂的原位纳米颗粒形成和烧结来降低导电粘合剂的电阻率。 发现还原剂通过促进银薄片表面上的脂肪酸的银盐的还原而导致导电粘合剂内的烧结，导致纳米/亚微米银颈部的形成。 这些银颈围绕相邻的银薄片，降低了导电胶粘剂中薄片之间的接触电阻。 还原剂还除去在导电粘合剂中使用的银薄片上通常发现的润滑剂的至少一部分，从而降低了银薄片之间的隧道阻力。
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公开(公告)号：US08173525B2
公开(公告)日：2012-05-08
申请号：US11454334
申请日：2006-06-16
Applicant: Samuel Graham, Jr. , William P. King , Ching-ping Wong
Inventor： Samuel Graham, Jr. , William P. King , Ching-ping Wong
CPC classification number: G03F7/0002 , B81C1/00031 , B81C2201/0185 , B82Y10/00 , B82Y30/00 , B82Y40/00 , Y10S977/707 , Y10S977/887
Abstract: Systems and methods of nanomaterial transfer are described. A method of nanomaterial transfer involving fabricating a template and synthesizing nanomaterials on the template. Subsequently, the nanomaterials are transferred to a substrate by pressing the template onto the substrate. In some embodiments, the step of transferring the nanomaterials involves pressing the template onto the substrate such that the nanomaterials are embedded below a surface layer of the substrate. In some embodiments, the temperature of the plurality of nanomaterials is raised to assist the transfer of the nanomaterials to the substrate.
Abstract translation: 描述纳米材料转移的系统和方法。 纳米材料转移的方法涉及制作模板并在模板上合成纳米材料。 随后，通过将模板压在衬底上，将纳米材料转移到衬底。 在一些实施方案中，转移纳米材料的步骤包括将模板压在衬底上，使得纳米材料嵌入在衬底的表面层下面。 在一些实施方案中，提高多个纳米材料的温度以辅助将纳米材料转移到基底。
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公开(公告)号：US07722951B2
公开(公告)日：2010-05-25
申请号：US10966963
申请日：2004-10-15
Applicant: Jun Li , Lianhua Fan , Ching-Ping Wong , Franklin Cook Lambert
Inventor： Jun Li , Lianhua Fan , Ching-Ping Wong , Franklin Cook Lambert
IPC: B32B15/00
CPC classification number: H01B3/306 , H01B3/441 , H01B3/445 , Y10T428/2927 , Y10T428/2933 , Y10T428/294 , Y10T428/2976 , Y10T428/2978
Abstract: The present invention is a method of applying Lotus Effect materials as a (superhydrophobicity) protective coating for external electrical insulation system applications, as well as the method of fabricating/preparing Lotus Effect coatings. Selected inorganic or polymeric materials are applied on the insulating material surface, and stable superhydrophobic coatings can be fabricated. Various UV stabilizers and UV absorbers can be incorporated into the coating system to enhance the coating's UV stability.
Abstract translation: 本发明是将莲花效应材料应用于外部电绝缘系统应用的（超疏水性）保护涂层的方法以及制备/制备莲花效应涂层的方法。 选择的无机或聚合物材料被施加在绝缘材料表面上，并且可以制造稳定的超疏水涂层。 可以将各种UV稳定剂和UV吸收剂掺入涂料体系中以增强涂料的UV稳定性。
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Patent Agency Ranking
公开(公告)号：US20090011222A1
公开(公告)日：2009-01-08
申请号：US11610111
申请日：2006-12-13
Applicant: Yonghao Xiu , Lingbo Zhu , Dennis W. Hess , Ching Ping Wong , Fei Xiao , Robert N. Hampton , Franklin C. Lambert
Inventor： Yonghao Xiu , Lingbo Zhu , Dennis W. Hess , Ching Ping Wong , Fei Xiao , Robert N. Hampton , Franklin C. Lambert
CPC classification number: C23C24/00 , C23C18/00 , Y10T428/25 , Y10T428/31504
Abstract: The present invention is a method of applying Lotus Effect materials as a (superhydrophobicity) protective coating for various system applications, as well as the method of fabricating/preparing Lotus Effect coatings.
Abstract translation: 本发明是将Lotus Effect材料应用于各种系统应用的（超疏水性）保护涂层的方法以及制备/制备莲花效应涂层的方法。
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公开(公告)号：US20080307909A1
公开(公告)日：2008-12-18
申请号：US12082161
申请日：2008-04-09
Applicant: Kenneth S. Watkins, JR. , Shelby J. Morris , Daniel D. Masakowski , Ching Ping Wong , Shijian Luo
Inventor： Kenneth S. Watkins, JR. , Shelby J. Morris , Daniel D. Masakowski , Ching Ping Wong , Shijian Luo
IPC: G01N33/44
CPC classification number: G01R31/1227 , G01N17/00 , G01N27/041 , G01N33/445
Abstract: An electrical condition monitoring method utilizes measurement of electrical resistivity of a conductive composite degradation sensor to monitor environmentally induced degradation of a polymeric product such as insulated wire and cable. The degradation sensor comprises a polymeric matrix and conductive filler. The polymeric matrix may be a polymer used in the product, or it may be a polymer with degradation properties similar to that of a polymer used in the product. The method comprises a means for communicating the resistivity to a measuring instrument and a means to correlate resistivity of the degradation sensor with environmentally induced degradation of the product.
Abstract translation: 电气状况监测方法利用导电复合材料降解传感器的电阻率的测量来监测聚合物产品（例如绝缘电线和电缆）的环境诱导的降解。 降解传感器包括聚合物基质和导电填料。 聚合物基质可以是在产物中使用的聚合物，或者它可以是具有与产物中使用的聚合物相同的降解性质的聚合物。 该方法包括用于将电阻率传递到测量仪器的装置以及将降解传感器的电阻率与产品的环境诱导的降解相关联的手段。
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公开(公告)号：US20080272344A1
公开(公告)日：2008-11-06
申请号：US12077812
申请日：2008-03-21
Applicant: HongJin Jiang , Kyoung-sik Moon , Yi Li , Ching Ping Wong
Inventor： HongJin Jiang , Kyoung-sik Moon , Yi Li , Ching Ping Wong
IPC: H01B1/22
CPC classification number: H01B1/22 , H01L2224/16 , H01L2224/29339 , H01L2224/8384 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H05K3/321 , H05K2201/0245 , H05K2201/0257
Abstract: The present invention relates generally to conductive polymer composites, electrically conductive adhesives, and methods of producing the same. The conductive polymer composites and electrically conductive adhesives may be used for electronic component interconnects, flip chip interconnections, electrical connections to circuit boards, jumper connections, or similar uses. The method of forming a conductive polymer composite includes mixing conductive metal flakes, functionalized conductive metal nanoparticles, and a polymer precursor and curing the polymer precursor to form a composite. In one embodiment, the conductive polymer composites may be composed of microparticles of silver flake and sintered silver nanoparticles between the silver flakes. The polymer composites have an electrical conductivity of less than 10−5 Ω·cm.
Abstract translation: 本发明一般涉及导电聚合物复合材料，导电粘合剂及其制备方法。 导电聚合物复合物和导电粘合剂可用于电子元件互连，倒装芯片互连，到电路板的电连接，跳线连接或类似用途。 形成导电聚合物复合材料的方法包括混合导电金属薄片，官能化导电金属纳米颗粒和聚合物前体，并固化聚合物前体以形成复合材料。 在一个实施方案中，导电聚合物复合材料可以由银薄片的微粒和银薄片之间的烧结银纳米颗粒组成。 聚合物复合材料具有小于10 -5Ω·cm的电导率。
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公开(公告)号：US06989433B2
公开(公告)日：2006-01-24
申请号：US10141334
申请日：2002-05-08
Applicant: Ching Ping Wong , Jiali Wu
Inventor： Ching Ping Wong , Jiali Wu
IPC: C08G59/02
CPC classification number: C09D163/00 , Y10T428/31511 , C08L21/00 , C08L75/04 , C08L83/04
Abstract: The present invention provides low stress non-hermetic conformal coatings for the protection of microelectronic devices, such as a Microelectromechanical system (MEMS) based multichip module from adverse environments. The induced stress from these two coatings due to the thermal cycling and manufacture processing will not cause any influence on sensing accuracy of the piezopressure sensor or similar functional MEMS devices. Furthermore, the conformal coatings have the merits of low glass transition temperature, good elongation, low moisture uptake and mobile ion permeation, room temperature curability and good contamination resistance to the jet fume, which promise a high reliability for the aerospace and avionics application. One conformal coating comprises a composition/formulation containing a rubber, siloxane or urethane oligomer modified epoxy and an organic hardener, and optionally an organic diluent and a curing catalyst. Another conformal coating comprises a composition/formulation containing a silicone elastomer or gel and a metal chelate catalyst, and optionally a silica filler, a diluent and an adhesion promoter or coupling agent.
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10.发明申请Poly(arylene ether)s bearing grafted hydroxyalkyls for use in electrically conductive adhesives 有权用于导电粘合剂的聚（亚芳基醚）载体接枝羟烷基公开(公告)号：US20050014921A1
公开(公告)日：2005-01-20
申请号：US10621022
申请日：2003-07-16
Applicant: William Burgoyne , Ching-Ping Wong , Silvia Liong
Inventor： William Burgoyne , Ching-Ping Wong , Silvia Liong
CPC classification number: C08G65/40 , C08G65/48 , Y10T428/12528 , Y10T428/12569 , Y10T428/31678 , Y10T428/31681
Abstract: A poly(arylene ether) polymer includes polymer repeat units of the following structure: —(O—Ar1—O—Ar2—O—)m—(—O—Ar3—O—Ar4—O)n— where Ar1, Ar2, Ar3, and Ar4 are identical or different aryl radicals, m is 0.05 to 0.95, n is 1-m, and at least one of the aryl radicals is grafted to at least one hydroxyalkyl group, such as 2-undecanol. The polymer is especially useful in electrically conductive adhesives.
Abstract translation: 聚（亚芳基醚）聚合物包括以下结构的聚合物重复单元： - （O-Ar1-O-Ar2-O-）m - （ - O-Ar3-O-Ar4-O）n-其中Ar1，Ar2， Ar 3和Ar 4是相同或不同的芳基，m为0.05至0.95，n为1-m，并且至少一个芳基被接枝至至少一个羟烷基，如2-十一烷醇。 聚合物特别适用于导电粘合剂。
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