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    Highly conductive electrically conductive adhesives
    1.
    发明授权
    Highly conductive electrically conductive adhesives 有权
    高导电性导电胶

    公开(公告)号：US09490043B2

    公开(公告)日：2016-11-08

    申请号：US13403943

    申请日：2012-02-23

    Applicant: Rongwei Zhang ,  Ching-Ping Wong

    Inventor： Rongwei Zhang ,  Ching-Ping Wong

    IPC: H01B1/22 ,  C09J9/00 ,  C09J9/02

    CPC classification number: H01B1/22 ,  C09J9/02

    Abstract: The present invention provides for a relatively simple method to decrease the electrical resistivity of conductive adhesives by in-situ nanoparticle formation and sintering using a reducing agent. The reducing agent was found to cause sintering within the conductive adhesive by facilitating the reduction of the silver salts of fatty acids on the surface of silver flakes, leading to the formation of nano-/submicron-silver necks. These silver necks bridge neighboring silver flakes, decreasing the contact resistance between flakes within the conductive adhesives. The reducing agent also removes at least a portion of the lubricant commonly found on silver flakes used in conductive adhesives, thus reducing the tunneling resistance between the silver flakes.

    Abstract translation: 本发明提供了一种相对简单的方法，通过使用还原剂的原位纳米颗粒形成和烧结来降低导电粘合剂的电阻率。 发现还原剂通过促进银薄片表面上的脂肪酸的银盐的还原而导致导电粘合剂内的烧结，导致纳米/亚微米银颈部的形成。 这些银颈围绕相邻的银薄片，降低了导电胶粘剂中薄片之间的接触电阻。 还原剂还除去在导电粘合剂中使用的银薄片上通常发现的润滑剂的至少一部分，从而降低了银薄片之间的隧道阻力。

    HIGHLY CONDUCTIVE ELECTRICALLY CONDUCTIVE ADHESIVES
    2.
    发明申请
    HIGHLY CONDUCTIVE ELECTRICALLY CONDUCTIVE ADHESIVES 有权
    高导电性导电粘合剂

    公开(公告)号：US20130056689A1

    公开(公告)日：2013-03-07

    申请号：US13403943

    申请日：2012-02-23

    Applicant: Rongwei Zhang ,  Ching-Ping Wong

    Inventor： Rongwei Zhang ,  Ching-Ping Wong

    IPC: H01B1/02

    CPC classification number: H01B1/22 ,  C09J9/02

    Abstract: The present invention provides for a relatively simple method to decrease the electrical resistivity of conductive adhesives by in-situ nanoparticle formation and sintering using a reducing agent. The reducing agent was found to cause sintering within the conductive adhesive by facilitating the reduction of the silver salts of fatty acids on the surface of silver flakes, leading to the formation of nano-/submicron-silver necks. These silver necks bridge neighboring silver flakes, decreasing the contact resistance between flakes within the conductive adhesives. The reducing agent also removes at least a portion of the lubricant commonly found on silver flakes used in conductive adhesives, thus reducing the tunneling resistance between the silver flakes.

    Abstract translation: 本发明提供了一种相对简单的方法，通过使用还原剂的原位纳米颗粒形成和烧结来降低导电粘合剂的电阻率。 发现还原剂通过促进银薄片表面上的脂肪酸的银盐的还原而导致导电粘合剂内的烧结，导致纳米/亚微米银颈部的形成。 这些银颈围绕相邻的银薄片，降低了导电胶粘剂中薄片之间的接触电阻。 还原剂还除去在导电粘合剂中使用的银薄片上通常发现的润滑剂的至少一部分，从而降低了银薄片之间的隧道阻力。

    High dielectric constant nano-structure polymer-ceramic composite
    3.
    发明授权
    High dielectric constant nano-structure polymer-ceramic composite 失效
    高介电常数纳米结构聚合物陶瓷复合材料

    公开(公告)号：US06544651B2

    公开(公告)日：2003-04-08

    申请号：US09860856

    申请日：2001-05-18

    Applicant: Ching-Ping Wong ,  Yang Rao

    Inventor： Ching-Ping Wong ,  Yang Rao

    IPC: B32B2738

    CPC classification number: H01G4/206 ,  C08K3/24 ,  C08K5/0091 ,  C08K5/098 ,  C08K5/12 ,  H01L23/49894 ,  H01L2224/16 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2924/3011 ,  H05K1/162 ,  Y10T428/31511 ,  H01L2924/00014 ,  H01L2924/00012

    Abstract: The present invention is directed to polymer-ceramic composites having high dielectric constants formed using polymers containing a metal acetylacetonate (acacs) curing catalyst. In particular, it has been discovered that 5 weight percent Co(III) acac can increase the dielectric constant of DER661 epoxy by about 60%. The high dielectric polymers are combined with fillers, preferably ceramic fillers, to form two phase composites having high dielectric constants. Composites having about 30 to about 90% volume ceramic loading and a high dielectric base polymer, preferably epoxy, have been discovered to have a dielectric constants greater than about 60. Composites having dielectric constants greater than about 74 to about 150 are also disclosed. Also disclosed are embedded capacitors with capacitance densities of at least 25 nF/cm2, preferably at least 35 nF/cm2, most preferably 50 nF/cm2. Methods to increase the dielectric constant of the two phase composites having high dielectric constants are also provided.

    Abstract translation: 本发明涉及使用含有金属乙酰丙酮（acacs）固化催化剂的聚合物形成的具有高介电常数的聚合物 - 陶瓷复合材料。 特别地，已经发现5重量％的Co（III）acac可以使DER661环氧树脂的介电常数提高约60％。 高介电聚合物与填料（优选陶瓷填料）组合以形成具有高介电常数的两相复合材料。 已经发现具有大约30至大约90体积的陶瓷负载和高电介质基础聚合物，优选环氧树脂的复合材料具有大于约60的介电常数。还公开了具有大于约74至约150的介电常数的复合材料。 还公开了具有至少25nF / cm 2，优选至少35nF / cm 2，最优选50nF / cm 2的电容密度的嵌入式电容器。 还提供了增加具有高介电常数的两相复合材料的介电常数的方法。

    Methods for encapsulating electronic devices
    5.
    发明授权
    Methods for encapsulating electronic devices 失效
    封装电子设备的方法

    公开(公告)号：US5348913A

    公开(公告)日：1994-09-20

    申请号：US102926

    申请日：1993-08-06

    Applicant: Richard McBride ,  Ching-Ping Wong

    Inventor： Richard McBride ,  Ching-Ping Wong

    IPC: H01L21/48 ,  H01L21/56 ,  H01L21/60

    CPC classification number: H01L21/56 ,  H01L21/4803 ,  H01L21/4807 ,  H01L2924/0002 ,  Y10S148/017 ,  Y10T29/49146

    Abstract: In a preferred embodiment of the invention, a substrate (11) is cleaned by immersing it in an organic solvent (17) and subjecting it to acoustic energy, immersing it in alcohol, immersing it in a surfactant, subjecting it to a cascading rinse in deionized water, baking it (FIG. 3 ), and thereafter subjecting it to ultraviolet light in an ozone ambient (FIG. 4). When the foregoing steps are followed, the contact angle is significantly reduced, and an encapsulant (14) that is thereafter applied provides more reliable protection to an encapsulated device (12) from outside contaminants.

    Abstract translation: 在本发明的一个优选实施方案中，通过将基材（11）浸入有机溶剂（17）中并对其进行声能，将其浸入酒精中，将其浸入表面活性剂中，使其进行级联漂洗 去离子水，烘烤（图3），然后在臭氧环境中对其进行紫外线（图4）。 当遵循上述步骤时，接触角显着降低，此后施加的密封剂（14）为外部污染物对封装装置（12）提供更可靠的保护。

    Method for encapsulating integrated circuit
    6.
    发明授权
    Method for encapsulating integrated circuit 失效
    密封电子设备的方法

    公开(公告)号：US5275841A

    公开(公告)日：1994-01-04

    申请号：US921654

    申请日：1992-07-30

    Applicant: Ching-Ping Wong

    Inventor： Ching-Ping Wong

    IPC: H01L23/29 ,  H01L23/31 ,  B05D5/12

    CPC classification number: H01L23/3142 ,  H01L23/296 ,  H01L23/3135 ,  H01L2924/0002

    Abstract: A silicone gel encapsulated integrated circuit (12) is placed in a container, the container being partially filled with a silicone elastomer (16) which is much more rugged than the gel. After the elastomer (16) hardens, it completely covers the gel encapsulation (14) and protects it and the integrated circuit device from the effects of rough handling. The gel, however, gives all of the protection from the external environment that it would in the absence of the elastomer encapsulation.

    Abstract translation: 将硅胶封装的集成电路（12）放置在容器中，容器部分地填充有比硅胶更坚固的硅氧烷弹性体（16）。 弹性体（16）硬化后，完全覆盖凝胶封装（14），并保护其和集成电路器件免受粗糙处理的影响。 然而，凝胶在没有弹性体封装的情况下给予外部环境的所有保护。

    Devices featuring silicone elastomers
    7.
    发明授权
    Devices featuring silicone elastomers 失效

    公开(公告)号：US5217811A

    公开(公告)日：1993-06-08

    申请号：US944026

    申请日：1992-09-11

    Applicant: Robert W. Filas ,  Bertrand H. Johnson ,  Ching-Ping Wong

    Inventor： Robert W. Filas ,  Bertrand H. Johnson ,  Ching-Ping Wong

    IPC: C08K5/5419

    CPC classification number: C08K5/5419 ,  Y10T428/31663

    Abstract: Devices are described in which certain crosslinked silicone polymers are incorporated. These polymers have various functions such as encapsulating agents, surface protective agents or agents to index match optical components (e.g. optical fiber, optical waveguide, etc.) to other optical devices or articles. The polymer is a vinyl-terminated dimethyldiphenylsiloxane copolymer crosslinked with tri- or tetrafunctional silanes in the presence of a platinum catalyst. The phenyl group content of the crosslinked silicone copolymer is adjusted to change the index of refraction of the polymer to the optimum for the particular application contemplated. Polymer preparation procedures are described which yield good optical quality for the polymer as well as optimum physical and chemical properties.

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