利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

6 条记录 (耗时 0.018 秒)

    COPPER-BASED SLIDING MATERIAL
    1.
    发明申请
    COPPER-BASED SLIDING MATERIAL 有权
    铜基滑动材料

    公开(公告)号：US20130052473A1

    公开(公告)日：2013-02-28

    申请号：US13572915

    申请日：2012-08-13

    申请人： Ryo SATO ,  Takuo Imai ,  Kentaro Tujimoto

    发明人： Ryo SATO ,  Takuo Imai ,  Kentaro Tujimoto

    IPC分类号： B32B15/01 ,  B32B5/16 ,  F16C33/12 ,  B32B15/20

    CPC分类号： C23C30/00 ,  B22F7/04 ,  B22F9/082 ,  B32B15/015 ,  C22C1/0425 ,  C22C9/00 ,  C22C9/02 ,  F16C33/121 ,  F16C2204/18 ,  F16C2240/48 ,  F16C2240/70 ,  Y10T428/12063 ,  Y10T428/12139 ,  Y10T428/12924 ,  Y10T428/12972

    摘要： In a copper-based sliding material in which a Cu alloy layer contains 5% to 30% by mass of Bi, and the balance consisting of Cu and an unavoidable impurity, Bi is dispersed as particles of a Bi phase in the Cu alloy layer, and the mass ratio of the particles having a particle size of 2 to 50 μm and a circularity of 0.1 to 0.7 is 30% or more in the entire Bi phase in the Cu alloy layer, so that the particles of the Bi phase are uniformly dispersed in the Cu alloy layer. Therefore, the particles of the Bi phase in the Cu alloy layer are sequentially exposed to a sliding surface as wear of the sliding material progresses while excessive flow-out of molten Bi is prevented, so that improved seizure resistance is achieved.

    摘要翻译： 在Cu合金层含有5质量％〜30质量％的Bi的铜基滑动材料中，余量由Cu和不可避免的杂质构成，Bi作为Bi相的粒子分散在Cu合金层中， 在Cu合金层的整个Bi相中，粒径为2〜50μm，圆形度为0.1〜0.7的粒子的质量比为30％以上，Bi相的粒子均匀分散 在Cu合金层中。 因此，随着滑动材料的磨损进行而Cu合金层中的Bi相的颗粒依次暴露于滑动表面，同时防止熔融Bi的过量流出，从而获得改善的耐咬合性。

    Copper-based sliding material
    2.
    发明授权
    Copper-based sliding material 有权
    铜基滑动材料

    公开(公告)号：US08623517B2

    公开(公告)日：2014-01-07

    申请号：US13572915

    申请日：2012-08-13

    申请人： Ryo Sato ,  Takuo Imai ,  Kentaro Tujimoto

    发明人： Ryo Sato ,  Takuo Imai ,  Kentaro Tujimoto

    IPC分类号： B32B15/04 ,  B32B15/18 ,  B32B15/20 ,  F16J15/00 ,  F16C33/02

    CPC分类号： C23C30/00 ,  B22F7/04 ,  B22F9/082 ,  B32B15/015 ,  C22C1/0425 ,  C22C9/00 ,  C22C9/02 ,  F16C33/121 ,  F16C2204/18 ,  F16C2240/48 ,  F16C2240/70 ,  Y10T428/12063 ,  Y10T428/12139 ,  Y10T428/12924 ,  Y10T428/12972

    摘要： In a copper-based sliding material in which a Cu alloy layer contains 5% to 30% by mass of Bi, and the balance consisting of Cu and an unavoidable impurity, Bi is dispersed as particles of a Bi phase in the Cu alloy layer, and the mass ratio of the particles having a particle size of 2 to 50 μm and a circularity of 0.1 to 0.7 is 30% or more in the entire Bi phase in the Cu alloy layer, so that the particles of the Bi phase are uniformly dispersed in the Cu alloy layer. Therefore, the particles of the Bi phase in the Cu alloy layer are sequentially exposed to a sliding surface as wear of the sliding material progresses while excessive flow-out of molten Bi is prevented, so that improved seizure resistance is achieved.

    摘要翻译： 在Cu合金层含有5质量％〜30质量％的Bi的铜基滑动材料中，余量由Cu和不可避免的杂质构成，Bi作为Bi相的粒子分散在Cu合金层中， 在Cu合金层的整个Bi相中，粒径为2〜50μm，圆形度为0.1〜0.7的粒子的质量比为30％以上，使得Bi相的粒子均匀分散 在Cu合金层中。 因此，随着滑动材料的磨损进行而Cu合金层中的Bi相的颗粒依次暴露于滑动表面，同时防止熔融Bi的过量流出，从而获得改善的耐咬合性。

    COPPER-BASED SLIDING MATERIAL
    5.
    发明申请
    COPPER-BASED SLIDING MATERIAL 有权
    铜基滑动材料

    公开(公告)号：US20130052480A1

    公开(公告)日：2013-02-28

    申请号：US13591724

    申请日：2012-08-22

    申请人： Kentaro Tujimoto ,  Kazuaki Toda

    发明人： Kentaro Tujimoto ,  Kazuaki Toda

    IPC分类号： B32B15/01

    CPC分类号： B22F7/06 ,  B22F3/1017 ,  B22F3/18 ,  B22F3/24 ,  C22C9/02 ,  C22C9/04 ,  F16C33/121 ,  Y10T428/12924 ,  Y10T428/12972

    摘要： A copper-based sliding material including a steel back metal layer and a Cu alloy layer is provided. The Cu alloy layer contains 0.5 to 15 mass % of Sn, 0.2 to 5 mass % of inorganic compound particles and the balance being Cu and unavoidable impurities. The inorganic compound particles are dispersed in a Cu alloy matrix and have an average size of 1 to 10 μm. A ratio of a true density of the Cu alloy matrix in relation to that of the inorganic compound particles is 0.6 to 1.4 and a ratio of a thermal expansion coefficient of the Cu alloy matrix in relation to that of the inorganic compound particles is 1.5 to 3.0. An average distance between the inorganic compound particles dispersed in the Cu alloy matrix is 5 to 50 μm.

    摘要翻译： 提供了包括钢背金属层和Cu合金层的铜基滑动材料。 Cu合金层含有0.5〜15质量％的Sn，0.2〜5质量％的无机化合物粒子，余量为Cu和不可避免的杂质。 无机化合物颗粒分散在Cu合金基体中，平均粒径为1〜10μm。 Cu合金基体的真密度与无机化合物粒子的真密度的比例为0.6〜1.4，Cu合金基体的热膨胀系数与无机化合物粒子的热膨胀系数的比为1.5〜3.0 。 分散在Cu合金基体中的无机化合物颗粒之间的平均距离为5〜50μm。

    Copper-based sliding material
    6.
    发明授权
    Copper-based sliding material 有权
    铜基滑动材料

    公开(公告)号：US08623518B2

    公开(公告)日：2014-01-07

    申请号：US13591724

    申请日：2012-08-22

    申请人： Kentaro Tujimoto ,  Kazuaki Toda

    发明人： Kentaro Tujimoto ,  Kazuaki Toda

    IPC分类号： B32B15/04 ,  B32B15/18 ,  B32B15/20 ,  F16J15/00 ,  F16C33/02

    CPC分类号： B22F7/06 ,  B22F3/1017 ,  B22F3/18 ,  B22F3/24 ,  C22C9/02 ,  C22C9/04 ,  F16C33/121 ,  Y10T428/12924 ,  Y10T428/12972

    摘要： A copper-based sliding material including a steel back metal layer and a Cu alloy layer is provided. The Cu alloy layer contains 0.5 to 15 mass % of Sn, 0.2 to 5 mass % of inorganic compound particles and the balance being Cu and unavoidable impurities. The inorganic compound particles are dispersed in a Cu alloy matrix and have an average size of 1 to 10 μm. A ratio of a true density of the Cu alloy matrix in relation to that of the inorganic compound particles is 0.6 to 1.4 and a ratio of a thermal expansion coefficient of the Cu alloy matrix in relation to that of the inorganic compound particles is 1.5 to 3.0. An average distance between the inorganic compound particles dispersed in the Cu alloy matrix is 5 to 50 μm.

    摘要翻译： 提供了包括钢背金属层和Cu合金层的铜基滑动材料。 Cu合金层含有0.5〜15质量％的Sn，0.2〜5质量％的无机化合物粒子，余量为Cu和不可避免的杂质。 无机化合物颗粒分散在Cu合金基质中，平均粒径为1-10μm。 Cu合金基体的真密度与无机化合物粒子的真密度的比例为0.6〜1.4，Cu合金基体的热膨胀系数与无机化合物粒子的热膨胀系数的比为1.5〜3.0 。 分散在Cu合金基质中的无机化合物颗粒之间的平均距离为5〜50μm。