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公开(公告)号：US20110206939A1
公开(公告)日：2011-08-25
申请号：US13033144
申请日：2011-02-23
申请人： Takuo IMAI , Kouji Zusi , Kentaro Tujimoto
发明人： Takuo IMAI , Kouji Zusi , Kentaro Tujimoto
IPC分类号： B32B15/01
CPC分类号： C22C9/00 , B22F2301/10 , B22F2301/35 , B22F2302/05 , B22F2302/10 , B22F2302/20 , B22F2302/45 , B22F2303/01 , B22F2303/05 , B22F2303/40 , B22F2303/405 , B22F2998/10 , B32B15/013 , C22C32/0047 , F16C33/121 , F16C2204/18 , Y10T428/12063 , Y10T428/12139 , B22F9/082 , C22C1/05 , B22F3/10 , B22F3/18
摘要： Provided is a copper-based sliding material including a steel back-metal layer and a Cu alloy layer. The Cu alloy layer contains, by mass %, 10 to 30% of Bi, 0.5 to 5% of an inorganic compound, and the balance being Cu and inevitable impurities. The Cu alloy layer may further contain 0.5 to 5% of Sn and/or at least one element selected from the group consisting of Ni, Fe, P and Ag in a total amount of 0.1 to 10%. The inorganic compound has an average particle size of 1 to 5 μm and a specific gravity of 70 to 130% relative to the specific gravity of Bi. Bi phase is formed in the Cu alloy layer in an average particle size of 2 to 15 μm, and the Bi phase is dispersed in the Cu alloy layer and isotropic.
摘要翻译： 提供一种铜基滑动材料，其包括钢背金属层和Cu合金层。 Cu合金层以质量％计含有10〜30％的Bi，0.5〜5％的无机化合物，余量为Cu和不可避免的杂质。 Cu合金层可以进一步含有0.5〜5％的Sn和/或至少一种选自Ni，Fe，P和Ag的元素，总量为0.1〜10％。 无机化合物的平均粒径为1〜5μm，比重为Bi比的70〜130％。 在Cu合金层中形成平均粒径为2〜15μm的Bi相，将Bi相分散在Cu合金层中，各向同性。
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2.发明授权公开(公告)号：US11980943B2
公开(公告)日：2024-05-14
申请号：US17382850
申请日：2021-07-22
IPC分类号： B22F5/04 , B22F3/00 , B22F7/06 , B22F10/28 , B22F12/57 , B22F12/58 , B29C64/153 , B33Y10/00 , B33Y30/00 , B33Y40/00 , B33Y40/10 , B22F10/73 , B22F12/63
CPC分类号： B22F5/04 , B22F3/003 , B22F7/06 , B22F10/28 , B22F12/57 , B22F12/58 , B29C64/153 , B33Y10/00 , B33Y30/00 , B33Y40/00 , B33Y40/10 , B22F10/73 , B22F12/63 , B22F2203/15 , B22F2207/01 , B22F2301/15 , B22F2303/405 , B22F2998/10 , B22F2999/00 , Y02P10/25 , B22F2999/00 , B22F12/57 , B22F1/00 , B22F2999/00 , B22F10/28 , B22F2207/01 , B22F2999/00 , B22F12/58 , B22F2203/15 , B22F2999/00 , B22F12/00 , B22F1/09
摘要： A device for fabricating a three-dimensional part by selectively melting a powder bed, the device including a first tank for containing a first powder and provided with a first powder dispenser valve, a second tank for containing a second different powder and provided with a second powder dispenser valve, a first and a second monitoring device for monitoring the quantity of first powder delivered by the first valve and the quantity of second powder delivered by the second valve, a mixer chamber in communication with the first and second valves and including a third powder dispenser valve, and a mixer for mixing the powder particles in the chamber, a support for receiving the powder delivered by the third valve and on which the parts is to be fabricated, a powder spreader for spreading powder on the support, and a heater member for locally melting the powder spread on the support.
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公开(公告)号：US08871354B2
公开(公告)日：2014-10-28
申请号：US13033144
申请日：2011-02-23
申请人： Takuo Imai , Kouji Zusi , Kentaro Tujimoto
发明人： Takuo Imai , Kouji Zusi , Kentaro Tujimoto
CPC分类号： C22C9/00 , B22F2301/10 , B22F2301/35 , B22F2302/05 , B22F2302/10 , B22F2302/20 , B22F2302/45 , B22F2303/01 , B22F2303/05 , B22F2303/40 , B22F2303/405 , B22F2998/10 , B32B15/013 , C22C32/0047 , F16C33/121 , F16C2204/18 , Y10T428/12063 , Y10T428/12139 , B22F9/082 , C22C1/05 , B22F3/10 , B22F3/18
摘要： Provided is a copper-based sliding material including a steel back-metal layer and a Cu alloy layer. The Cu alloy layer contains, by mass %, 10 to 30% of Bi, 0.5 to 5% of an inorganic compound, and the balance being Cu and inevitable impurities. The Cu alloy layer may further contain 0.5 to 5% of Sn and/or at least one element selected from the group consisting of Ni, Fe, P and Ag in a total amount of 0.1 to 10%. The inorganic compound has an average particle size of 1 to 5 μm and a specific gravity of 70 to 130% relative to the specific gravity of Bi. Bi phase is formed in the Cu alloy layer in an average particle size of 2 to 15 μm, and the Bi phase is dispersed in the Cu alloy layer and isotropic.
摘要翻译： 提供一种铜基滑动材料，其包括钢背金属层和Cu合金层。 Cu合金层以质量％计含有10〜30％的Bi，0.5〜5％的无机化合物，余量为Cu和不可避免的杂质。 Cu合金层可以进一步含有0.5〜5％的Sn和/或至少一种选自Ni，Fe，P和Ag的元素，总量为0.1〜10％。 无机化合物的平均粒径为1〜5μm，比重为Bi比的70〜130％。 在Cu合金层中形成平均粒径为2〜15μm的Bi相，将Bi相分散在Cu合金层中，各向同性。
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公开(公告)号：US20180238178A1
公开(公告)日：2018-08-23
申请号：US15554727
申请日：2015-03-27
CPC分类号： F01D5/284 , B22F3/1055 , B22F7/02 , B22F7/06 , B22F2303/405 , B23K26/342 , B23P15/04 , B32B3/266 , B32B18/00 , B32B2603/00 , B33Y10/00 , B33Y80/00 , C04B37/003 , C04B2235/6026 , C04B2237/12 , C04B2237/343 , C04B2237/38 , C04B2237/62 , C04B2237/68 , F01D5/282 , F01D9/041 , F05D2230/31 , F05D2300/211 , F05D2300/6033 , Y10T428/24347
摘要： A hybrid component (45) is provided including a plurality of laminates (10) stacked on one another to define a stacked laminate structure (58). The laminates (10) include a ceramic matrix composite material (22) and at least one opening (24) defined therein. A metal support structure (56) may be additively manufactured through each opening (24) so as to extend through the stacked laminate structure (58).
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公开(公告)号：US20180142522A1
公开(公告)日：2018-05-24
申请号：US15571618
申请日：2016-05-06
CPC分类号： E21B10/5735 , B22F3/14 , B22F3/15 , B22F3/24 , B22F5/00 , B22F7/008 , B22F7/06 , B22F7/08 , B22F2003/244 , B22F2005/001 , B22F2301/15 , B22F2301/30 , B22F2302/10 , B22F2302/15 , B22F2302/406 , B22F2303/30 , B22F2303/405 , B22F2998/10 , B22F2999/00 , B24D3/08 , B24D18/0009 , B24D99/005 , C22C11/00 , C22C12/00 , C22C19/07 , C22C26/00 , C22C29/08 , C22C2026/006 , E21B10/54 , B22F3/26
摘要： Cutting elements having accelerated leaching rates and methods of making the same are disclosed herein. In one embodiment, a method of forming a cutting element includes assembling a reaction cell having diamond particles, a non-catalyst material, a catalyst material, and a substrate within a refractory metal container, where the non-catalyst material is generally immiscible in the catalyst material at a sintering temperature and pressure. The method also includes subjecting the reaction cell and its contents to a high pressure high temperature sintering process to form a polycrystalline diamond body that is attached to the substrate. The method further includes contacting at least a portion of the polycrystalline diamond body with a leaching agent to remove catalyst material and non-catalyst material from the diamond body, where a leaching rate of the catalyst material and the non-catalyst material exceeds a conventional leaching rate profile by at least about 30%.
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公开(公告)号：US20160204449A1
公开(公告)日：2016-07-14
申请号：US14915877
申请日：2014-08-29
发明人： Nawal Kishor Mal , Anirban Ghosh , Alkesh Ahire
CPC分类号： C22C5/04 , B22F1/0018 , B22F1/0044 , B22F1/0062 , B22F1/025 , B22F9/24 , B22F2009/245 , B22F2301/25 , B22F2302/40 , B22F2302/45 , B22F2303/30 , B22F2303/405 , B22F2304/05 , B22F2998/10 , B82Y30/00 , B82Y40/00 , C22C1/0466 , H01M4/9008 , H01M4/921 , H01M4/923 , H01M4/926
摘要： A modified bimetallic nanoparticle comprising a first metal consisting of platinum and a second metal selected from the group consisting of Iridium (Ir), Ruthenium (Ru), Copper (Cu), Cobalt (Co), Titanium (Ti), Zirconium (Zr), Hafnium (Hf), Vanadium (V), Niobium (Nb), Tantalum (Ta), Chromium (Cr), Molybdenum (Mo), Tungsten (W), Iron (Fe), Osmium (Os), Nickel (Ni), Palladium (Pd), Rhodium (Rh), Silver (Ag) and Gold (Au) having at least one mercapto alkyl acid attached thereon, wherein the molar ratio of the first metal and the second metal to mercapto alkyl acid is at least 16:1 is disclosed. A process of preparing a modified bimetallic nanoparticle is also disclosed.
摘要翻译： 1.一种改性双金属纳米粒子，其特征在于，包括由铂和由选自铱（Ir），钌（Ru），铜（Cu），钴（Co），钛（Ti），锆（Zr） ，铪（Hf），钒（V），铌（Nb），钽（Ta），铬（Cr），钼（Mo） ，具有至少一个巯基烷基酸的钯（Pd），铑（Rh），银（Ag）和金（Au），其中第一金属和第二金属与巯基烷基酸的摩尔比为至少16 ：1。 还公开了制备改性双金属纳米颗粒的方法。
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