摘要:
A plastic molded semiconductor integrated circuit device, includes: a semiconductor substrate in which circuit elements are fabricated, metal wirings for transmitting the power supply voltage or signals of internal circuits provided on the semiconductor substrate via an insulating film, a plurality of apertures produced at portions of the insulating film directly below the metal wirings, and a nail section provided integrally with the metal wiring in the aperture, wherein the nail section is provided without being electrically connected with any of the circuit elements or the other metal wirings.
摘要:
A field effect transistor comprises a source region (42) annularly formed to encompass and spaced apart from a drain region (41), whereby a second channel region is formed between the drain region and the source region in the vicinity of the former, while a first channel region is formed in the remaining area thereof, an annular first gate (43) formed bridging above the first channel region and the source region, a second annular gate (45) formed bridging above the first gate and the drain region, and an isolating film (47) formed contiguous to the source region at the side opposite to the channel region. As a result any region is eliminated where the channel region in the vicinity of the drain side end of the first gate (43) is in contact with the isolating film (47). Accordingly, no withstand voltage is restricted thereby and the withstand voltage of the field effect transistor is considerably enhanced.