Semiconductor sensor having heater on insulation film and manufacturing method of the same
    1.
    发明授权
    Semiconductor sensor having heater on insulation film and manufacturing method of the same 有权
    具有隔热膜加热器的半导体传感器及其制造方法

    公开(公告)号:US08006553B2

    公开(公告)日:2011-08-30

    申请号:US12458272

    申请日:2009-07-07

    IPC分类号: G01F1/68

    摘要: A sensor includes: a silicon substrate having a hollow portion, which is arranged on a backside of the substrate; an insulation film disposed on a front side of the substrate and covering the hollow portion; a heater disposed on the insulation film, made of a semiconductor layer, and configured to generate heat; and an anti-stripping film for protecting the insulation film from being removed from the silicon substrate. The silicon substrate, the insulation film and the semiconductor layer provide a SOI substrate. The hollow portion has a sidewall and a bottom. The anti-stripping film covers at least a boundary between the sidewall and the bottom of the hollow portion.

    摘要翻译: 传感器包括:具有中空部分的硅衬底,其设置在衬底的背面; 绝缘膜,设置在所述基板的前侧并覆盖所述中空部; 设置在绝缘膜上的加热器,由半导体层制成,并且被配置为产生热量; 以及用于保护绝缘膜不被从硅衬底移除的防剥离膜。 硅衬底,绝缘膜和半导体层提供SOI衬底。 中空部分具有侧壁和底部。 防剥离膜至少覆盖中空部分的侧壁和底部之间的边界。

    Semiconductor sensor having heater on insulation film and manufacturing method of the same
    2.
    发明申请
    Semiconductor sensor having heater on insulation film and manufacturing method of the same 有权
    具有隔热膜加热器的半导体传感器及其制造方法

    公开(公告)号:US20100005877A1

    公开(公告)日:2010-01-14

    申请号:US12458272

    申请日:2009-07-07

    IPC分类号: G01F1/68 H01L21/30

    摘要: A sensor includes: a silicon substrate having a hollow portion, which is arranged on a backside of the substrate; an insulation film disposed on a front side of the substrate and covering the hollow portion; a heater disposed on the insulation film, made of a semiconductor layer, and configured to generate heat; and an anti-stripping film for protecting the insulation film from being removed from the silicon substrate. The silicon substrate, the insulation film and the. semiconductor layer provide a SOI substrate. The hollow portion has a sidewall and a bottom. The anti-stripping film covers at least a boundary between the sidewall and the bottom of the hollow portion.

    摘要翻译: 传感器包括:具有中空部分的硅衬底,其设置在衬底的背面; 绝缘膜,设置在所述基板的前侧并覆盖所述中空部; 设置在绝缘膜上的加热器,由半导体层制成,并且被配置为产生热量; 以及用于保护绝缘膜不被从硅衬底移除的防剥离膜。 硅衬底,绝缘膜和。 半导体层提供SOI衬底。 中空部分具有侧壁和底部。 防剥离膜至少覆盖中空部分的侧壁和底部之间的边界。

    Differential amplifier circuit having low noise input transistors
    3.
    发明授权
    Differential amplifier circuit having low noise input transistors 失效
    差分放大电路具有低噪声输入晶体管

    公开(公告)号:US5812022A

    公开(公告)日:1998-09-22

    申请号:US715610

    申请日:1996-09-18

    IPC分类号: H03F1/26 H03F3/45

    CPC分类号: H03F3/45076

    摘要: A differential amplifier circuit whose noise is reduced when used in a CMOS operational amplifier without increasing its cost includes a differential input stage circuit in which gate lengths of load transistors and gate lengths of differential input transistors are set to an optimal ratio to minimize internal transistor noise components.

    摘要翻译: 在不增加成本的情况下,在CMOS运算放大器中使用噪声降低的差分放大器电路包括差分输入级电路,其中负载晶体管的栅极长度和差分输入晶体管的栅极长度被设置为使最小化内部晶体管噪声的最佳比率 组件。