公开(公告)号：US07828047B2

公开(公告)日：2010-11-09

申请号：US12003542

申请日：2007-12-28

申请人： Ryuuji Miyazaki ,  Masumi Suzuki ,  Minoru Hirano

发明人： Ryuuji Miyazaki ,  Masumi Suzuki ,  Minoru Hirano

IPC分类号： F28D15/00

CPC分类号： H01L23/427 ,  F28D15/0266 ,  H01L2924/0002 ,  H01L2924/00

摘要： A cooling unit has a heat receiving unit that receives heat from a body radiating heat; a radiator disposed at a distance from the heat receiving unit and radiating recovered heat; a liquid coolant transporting heat generated at the heat receiving unit to the radiator; and a hollow tube disposed so that the liquid coolant circulates between the heat receiving unit and the radiator, a circulating flow of the liquid coolant formed by an elevating force of air bubbles generated from the heat received at the heat receiving unit, the radiator having an air pocket forming one part of the circulation path of the liquid coolant together with the hollow tube and capable of collecting the air bubbles.

摘要翻译： 冷却单元具有从体内散发热量的热量接收单元， 散热器，其设置在与所述受热单元一定距离处，并且散热回收的热量; 将在所述热接收单元处产生的热量的热量输送到所述散热器; 以及中空管，其设置成使得所述液体冷却剂在所述受热单元和所述散热器之间循环，所述液体冷却剂的循环流由通过在所述受热单元处接收的热产生的气泡的升高力而形成，所述散热器具有 空气袋与中空管一起形成液体冷却剂的循环路径的一部分并且能够收集气泡。

公开(公告)号：US20080236797A1

公开(公告)日：2008-10-02

申请号：US12003542

申请日：2007-12-28

申请人： Ryuuji Miyazaki ,  Masumi Suzuki ,  Minoru Hirano

发明人： Ryuuji Miyazaki ,  Masumi Suzuki ,  Minoru Hirano

IPC分类号： F28D15/00 ,  F28D1/00

CPC分类号： H01L23/427 ,  F28D15/0266 ,  H01L2924/0002 ,  H01L2924/00

摘要： A cooling unit has a heat receiving unit that receives heat from a body radiating heat; a radiator disposed at a distance from the heat receiving unit and radiating recovered heat; a liquid coolant transporting heat generated at the heat receiving unit to the radiator; and a hollow tube disposed so that the liquid coolant circulates between the heat receiving unit and the radiator, a circulating flow of the liquid coolant formed by an elevating force of air bubbles generated from the heat received at the heat receiving unit, the radiator having an air pocket forming one part of the circulation path of the liquid coolant together with the hollow tube and capable of collecting the air bubbles.

摘要翻译： 冷却单元具有从体内散发热量的热量接收单元， 散热器，其设置在与所述受热单元一定距离处，并且散热回收的热量; 将在所述热接收单元处产生的热量的热量输送到所述散热器; 以及中空管，其设置成使得所述液体冷却剂在所述受热单元和所述散热器之间循环，所述液体冷却剂的循环流由通过在所述受热单元处接收的热产生的气泡的升高力而形成，所述散热器具有 空气袋与中空管一起形成液体冷却剂的循环路径的一部分并且能够收集气泡。

公开(公告)号：US06564861B1

公开(公告)日：2003-05-20

申请号：US09548426

申请日：2000-04-12

申请人： Ryuuji Miyazaki ,  Masumi Suzuki ,  Minoru Hirano

发明人： Ryuuji Miyazaki ,  Masumi Suzuki ,  Minoru Hirano

IPC分类号： F28D1500

CPC分类号： H01L23/427 ,  F28D15/0266 ,  H01L2924/0002 ,  H01L2924/00

摘要： A cooling unit has a heat receiving unit that receives heat from a body radiating heat; a radiator disposed at a distance from the heat receiving unit and radiating recovered heat; a liquid coolant transporting heat generated at the heat receiving unit to the radiator; and a hollow tube disposed so that the liquid coolant circulates between the heat receiving unit and the radiator, a circulating flow of the liquid coolant formed by an elevating force of air bubbles generated from the heat received at the heat receiving unit, the radiator having an air pocket forming one part of the circulation path of the liquid coolant together with the hollow tube and capable of collecting the air bubbles.

摘要翻译： 冷却单元具有从体内散发热量的热量接收单元， 散热器，其设置在与所述受热单元一定距离处，并且散热回收的热量; 将在所述热接收单元处产生的热量的热量输送到所述散热器; 以及中空管，其设置成使得所述液体冷却剂在所述受热单元和所述散热器之间循环，所述液体冷却剂的循环流由通过在所述受热单元处接收的热产生的气泡的升高力而形成，所述散热器具有 空气袋与中空管一起形成液体冷却剂的循环路径的一部分并且能够收集气泡。

公开(公告)号：US07337829B2

公开(公告)日：2008-03-04

申请号：US10407464

申请日：2003-04-07

申请人： Ryuuji Miyazaki ,  Masumi Suzuki ,  Minoru Hirano

发明人： Ryuuji Miyazaki ,  Masumi Suzuki ,  Minoru Hirano

IPC分类号： F28D15/00 ,  H05K7/20

CPC分类号： H01L23/427 ,  F28D15/0266 ,  H01L2924/0002 ,  H01L2924/00

摘要： A cooling unit has a heat receiving unit that receives heat from a body radiating heat; a radiator disposed at a distance from the heat receiving unit and radiating recovered heat; a liquid coolant transporting heat generated at the heat receiving unit to the radiator; and a hollow tube disposed so that the liquid coolant circulates between the heat receiving unit and the radiator, a circulating flow of the liquid coolant formed by an elevating force of air bubbles generated from the heat received at the heat receiving unit, the radiator having an air pocket forming one part of the circulation path of the liquid coolant together with the hollow tube and capable of collecting the air bubbles.

公开(公告)号：US20070107872A1

公开(公告)日：2007-05-17

申请号：US11648632

申请日：2007-01-03

申请人： Ryuuji Miyazaki ,  Masumi Suzuki

发明人： Ryuuji Miyazaki ,  Masumi Suzuki

IPC分类号： H05K7/20

CPC分类号： H01L23/3736 ,  H01L23/367 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat sink for a semiconductor device comprises a base which has a first surface on which a plurality of heat-radiating fins are arranged, and a second surface which contacts the semiconductor device directly. A heat spreader is provided on the second surface of the base so that the heat spreader does not contact the semiconductor device directly.

摘要翻译： 用于半导体器件的散热器包括具有布置有多个散热翅片的第一表面的基座和与半导体器件直接接触的第二表面。 散热器设置在基座的第二表面上，使得散热器不直接接触半导体器件。

公开(公告)号：US07431072B2

公开(公告)日：2008-10-07

申请号：US11648632

申请日：2007-01-03

申请人： Ryuuji Miyazaki ,  Masumi Suzuki

发明人： Ryuuji Miyazaki ,  Masumi Suzuki

IPC分类号： H05K7/20

CPC分类号： H01L23/3736 ,  H01L23/367 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat sink for a semiconductor device comprises a base which has a first surface on which a plurality of heat-radiating fins are arranged, and a second surface which contacts the semiconductor device directly. A heat spreader is provided on the second surface of the base so that the heat spreader does not contact the semiconductor device directly.

摘要翻译： 用于半导体器件的散热器包括具有布置有多个散热翅片的第一表面的基座和与半导体器件直接接触的第二表面。 散热器设置在基座的第二表面上，使得散热器不直接接触半导体器件。

公开(公告)号：US07219721B2

公开(公告)日：2007-05-22

申请号：US10500464

申请日：2002-01-16

申请人： Ryuuji Miyazaki ,  Masumi Suzuki

发明人： Ryuuji Miyazaki ,  Masumi Suzuki

IPC分类号： H05K7/20

CPC分类号： H01L23/3736 ,  H01L23/367 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat sink for a semiconductor device comprises a base which has a first surface on which a plurality of heat-radiating fins are arranged, and a second surface which contacts the semiconductor device directly. A heat spreader is provided on the second surface of the base so that the heat spreader does not contact the semiconductor device directly.

摘要翻译： 用于半导体器件的散热器包括具有布置有多个散热翅片的第一表面的基座和与半导体器件直接接触的第二表面。 散热器设置在基座的第二表面上，使得散热器不直接接触半导体器件。

公开(公告)号：US20050006054A1

公开(公告)日：2005-01-13

申请号：US10500464

申请日：2002-01-16

申请人： Ryuuji Miyazaki ,  Masumi Suzuki

发明人： Ryuuji Miyazaki ,  Masumi Suzuki

IPC分类号： H01L23/367 ,  H05K7/20

CPC分类号： H01L23/3736 ,  H01L23/367 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat sink for a semiconductor device comprises a base which has a first surface on which a plurality of heat-radiating fins are arranged, and a second surface which contacts the semiconductor device directly. A heat spreader is provided on the second surface of the base so that the heat spreader does not contact the semiconductor device directly.

摘要翻译： 用于半导体器件的散热器包括具有布置有多个散热翅片的第一表面的基座和与半导体器件直接接触的第二表面。 散热器设置在基座的第二表面上，使得散热器不直接接触半导体器件。