公开(公告)号：US07828047B2

公开(公告)日：2010-11-09

申请号：US12003542

申请日：2007-12-28

申请人： Ryuuji Miyazaki ,  Masumi Suzuki ,  Minoru Hirano

发明人： Ryuuji Miyazaki ,  Masumi Suzuki ,  Minoru Hirano

IPC分类号： F28D15/00

CPC分类号： H01L23/427 ,  F28D15/0266 ,  H01L2924/0002 ,  H01L2924/00

摘要： A cooling unit has a heat receiving unit that receives heat from a body radiating heat; a radiator disposed at a distance from the heat receiving unit and radiating recovered heat; a liquid coolant transporting heat generated at the heat receiving unit to the radiator; and a hollow tube disposed so that the liquid coolant circulates between the heat receiving unit and the radiator, a circulating flow of the liquid coolant formed by an elevating force of air bubbles generated from the heat received at the heat receiving unit, the radiator having an air pocket forming one part of the circulation path of the liquid coolant together with the hollow tube and capable of collecting the air bubbles.

摘要翻译： 冷却单元具有从体内散发热量的热量接收单元， 散热器，其设置在与所述受热单元一定距离处，并且散热回收的热量; 将在所述热接收单元处产生的热量的热量输送到所述散热器; 以及中空管，其设置成使得所述液体冷却剂在所述受热单元和所述散热器之间循环，所述液体冷却剂的循环流由通过在所述受热单元处接收的热产生的气泡的升高力而形成，所述散热器具有 空气袋与中空管一起形成液体冷却剂的循环路径的一部分并且能够收集气泡。

公开(公告)号：US20080236797A1

公开(公告)日：2008-10-02

申请号：US12003542

申请日：2007-12-28

申请人： Ryuuji Miyazaki ,  Masumi Suzuki ,  Minoru Hirano

发明人： Ryuuji Miyazaki ,  Masumi Suzuki ,  Minoru Hirano

IPC分类号： F28D15/00 ,  F28D1/00

CPC分类号： H01L23/427 ,  F28D15/0266 ,  H01L2924/0002 ,  H01L2924/00

摘要： A cooling unit has a heat receiving unit that receives heat from a body radiating heat; a radiator disposed at a distance from the heat receiving unit and radiating recovered heat; a liquid coolant transporting heat generated at the heat receiving unit to the radiator; and a hollow tube disposed so that the liquid coolant circulates between the heat receiving unit and the radiator, a circulating flow of the liquid coolant formed by an elevating force of air bubbles generated from the heat received at the heat receiving unit, the radiator having an air pocket forming one part of the circulation path of the liquid coolant together with the hollow tube and capable of collecting the air bubbles.

摘要翻译： 冷却单元具有从体内散发热量的热量接收单元， 散热器，其设置在与所述受热单元一定距离处，并且散热回收的热量; 将在所述热接收单元处产生的热量的热量输送到所述散热器; 以及中空管，其设置成使得所述液体冷却剂在所述受热单元和所述散热器之间循环，所述液体冷却剂的循环流由通过在所述受热单元处接收的热产生的气泡的升高力而形成，所述散热器具有 空气袋与中空管一起形成液体冷却剂的循环路径的一部分并且能够收集气泡。

公开(公告)号：US06564861B1

公开(公告)日：2003-05-20

申请号：US09548426

申请日：2000-04-12

申请人： Ryuuji Miyazaki ,  Masumi Suzuki ,  Minoru Hirano

发明人： Ryuuji Miyazaki ,  Masumi Suzuki ,  Minoru Hirano

IPC分类号： F28D1500

CPC分类号： H01L23/427 ,  F28D15/0266 ,  H01L2924/0002 ,  H01L2924/00

摘要： A cooling unit has a heat receiving unit that receives heat from a body radiating heat; a radiator disposed at a distance from the heat receiving unit and radiating recovered heat; a liquid coolant transporting heat generated at the heat receiving unit to the radiator; and a hollow tube disposed so that the liquid coolant circulates between the heat receiving unit and the radiator, a circulating flow of the liquid coolant formed by an elevating force of air bubbles generated from the heat received at the heat receiving unit, the radiator having an air pocket forming one part of the circulation path of the liquid coolant together with the hollow tube and capable of collecting the air bubbles.

摘要翻译： 冷却单元具有从体内散发热量的热量接收单元， 散热器，其设置在与所述受热单元一定距离处，并且散热回收的热量; 将在所述热接收单元处产生的热量的热量输送到所述散热器; 以及中空管，其设置成使得所述液体冷却剂在所述受热单元和所述散热器之间循环，所述液体冷却剂的循环流由通过在所述受热单元处接收的热产生的气泡的升高力而形成，所述散热器具有 空气袋与中空管一起形成液体冷却剂的循环路径的一部分并且能够收集气泡。

公开(公告)号：US07337829B2

公开(公告)日：2008-03-04

申请号：US10407464

申请日：2003-04-07

申请人： Ryuuji Miyazaki ,  Masumi Suzuki ,  Minoru Hirano

发明人： Ryuuji Miyazaki ,  Masumi Suzuki ,  Minoru Hirano

IPC分类号： F28D15/00 ,  H05K7/20

CPC分类号： H01L23/427 ,  F28D15/0266 ,  H01L2924/0002 ,  H01L2924/00

摘要： A cooling unit has a heat receiving unit that receives heat from a body radiating heat; a radiator disposed at a distance from the heat receiving unit and radiating recovered heat; a liquid coolant transporting heat generated at the heat receiving unit to the radiator; and a hollow tube disposed so that the liquid coolant circulates between the heat receiving unit and the radiator, a circulating flow of the liquid coolant formed by an elevating force of air bubbles generated from the heat received at the heat receiving unit, the radiator having an air pocket forming one part of the circulation path of the liquid coolant together with the hollow tube and capable of collecting the air bubbles.

公开(公告)号：US07431072B2

公开(公告)日：2008-10-07

申请号：US11648632

申请日：2007-01-03

申请人： Ryuuji Miyazaki ,  Masumi Suzuki

发明人： Ryuuji Miyazaki ,  Masumi Suzuki

IPC分类号： H05K7/20

CPC分类号： H01L23/3736 ,  H01L23/367 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat sink for a semiconductor device comprises a base which has a first surface on which a plurality of heat-radiating fins are arranged, and a second surface which contacts the semiconductor device directly. A heat spreader is provided on the second surface of the base so that the heat spreader does not contact the semiconductor device directly.

摘要翻译： 用于半导体器件的散热器包括具有布置有多个散热翅片的第一表面的基座和与半导体器件直接接触的第二表面。 散热器设置在基座的第二表面上，使得散热器不直接接触半导体器件。

公开(公告)号：US07219721B2

公开(公告)日：2007-05-22

申请号：US10500464

申请日：2002-01-16

申请人： Ryuuji Miyazaki ,  Masumi Suzuki

发明人： Ryuuji Miyazaki ,  Masumi Suzuki

IPC分类号： H05K7/20

CPC分类号： H01L23/3736 ,  H01L23/367 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat sink for a semiconductor device comprises a base which has a first surface on which a plurality of heat-radiating fins are arranged, and a second surface which contacts the semiconductor device directly. A heat spreader is provided on the second surface of the base so that the heat spreader does not contact the semiconductor device directly.

摘要翻译： 用于半导体器件的散热器包括具有布置有多个散热翅片的第一表面的基座和与半导体器件直接接触的第二表面。 散热器设置在基座的第二表面上，使得散热器不直接接触半导体器件。

公开(公告)号：US20050006054A1

公开(公告)日：2005-01-13

申请号：US10500464

申请日：2002-01-16

申请人： Ryuuji Miyazaki ,  Masumi Suzuki

发明人： Ryuuji Miyazaki ,  Masumi Suzuki

IPC分类号： H01L23/367 ,  H05K7/20

CPC分类号： H01L23/3736 ,  H01L23/367 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat sink for a semiconductor device comprises a base which has a first surface on which a plurality of heat-radiating fins are arranged, and a second surface which contacts the semiconductor device directly. A heat spreader is provided on the second surface of the base so that the heat spreader does not contact the semiconductor device directly.

摘要翻译： 用于半导体器件的散热器包括具有布置有多个散热翅片的第一表面的基座和与半导体器件直接接触的第二表面。 散热器设置在基座的第二表面上，使得散热器不直接接触半导体器件。

公开(公告)号：US20070107872A1

公开(公告)日：2007-05-17

申请号：US11648632

申请日：2007-01-03

申请人： Ryuuji Miyazaki ,  Masumi Suzuki

发明人： Ryuuji Miyazaki ,  Masumi Suzuki

IPC分类号： H05K7/20

CPC分类号： H01L23/3736 ,  H01L23/367 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat sink for a semiconductor device comprises a base which has a first surface on which a plurality of heat-radiating fins are arranged, and a second surface which contacts the semiconductor device directly. A heat spreader is provided on the second surface of the base so that the heat spreader does not contact the semiconductor device directly.

摘要翻译： 用于半导体器件的散热器包括具有布置有多个散热翅片的第一表面的基座和与半导体器件直接接触的第二表面。 散热器设置在基座的第二表面上，使得散热器不直接接触半导体器件。

公开(公告)号：US06781846B1

公开(公告)日：2004-08-24

申请号：US09482518

申请日：2000-01-14

申请人： Masumi Suzuki ,  Minoru Hirano

发明人： Masumi Suzuki ,  Minoru Hirano

IPC分类号： H05K114

CPC分类号： H05K5/0269 ,  G06F1/203 ,  G06F2200/201

摘要： An IC card adapted to be removably inserted into a slot of an IC card mountable device, including a card housing formed like a substantially rectangular card with an inside space defined therein, the card housing having a plurality of openings through a wall of the card housing; a printed wiring board accommodated in the card housing; and a plurality of electronic components mounted on the printed wiring board.

摘要翻译： 一种适于可拆卸地插入到IC卡可安装装置的槽中的IC卡，包括形成为具有限定在其中的内部空间的大致矩形卡的卡壳体，卡壳体具有穿过卡壳体的壁的多个开口 ; 容纳在卡壳体中的印刷线路板; 以及安装在印刷电路板上的多个电子部件。

公开(公告)号：US06454362B1

公开(公告)日：2002-09-24

申请号：US09475773

申请日：1999-12-30

申请人： Tadashi Katsui ,  Keizo Takemura ,  Minoru Hirano ,  Masumi Suzuki ,  Yoshiaki Udagawa ,  Masuo Ohnishi ,  Kenichi Fujii

发明人： Tadashi Katsui ,  Keizo Takemura ,  Minoru Hirano ,  Masumi Suzuki ,  Yoshiaki Udagawa ,  Masuo Ohnishi ,  Kenichi Fujii

IPC分类号： H01H3514

CPC分类号： G06F1/203 ,  G06F1/206 ,  G06F2200/201 ,  Y02D10/16

摘要： A cooling device for a portable electronic comprises a radiation plate and a fin for radiating the heat from the CPU. When the plug of an external power. supply is attached to the body of the portable electronic, the CPU may operate at a high clock frequency. The cooling device achieves a high cooling performance by operating a ventilation fan directed to the fin, for example. When the plug is removed from the body of the portable electronic, the CPU may operate at a low clock frequency. Power consumption can be reduced, so that the electric power stored in the built-in battery can be saved. The duration time of the operation can be extended. Calorific power generated at the CPU can also be reduced, so that the cooling device is adapted to suppress the rise in the temperature of the CPU without operation of the ventilation fan.

摘要翻译： 用于便携式电子的冷却装置包括辐射板和用于从CPU辐射热量的翅片。 当外插电源时。 电源连接到便携式电子的主体，CPU可以以高时钟频率工作。 例如，冷却装置通过操作指向翅片的通风扇来实现高冷却性能。 当插头从便携式电子的主体移除时，CPU可以以低时钟频率工作。 可以降低功耗，从而可以节省存储在内置电池中的电力。 可以延长操作的持续时间。 也可以减少在CPU产生的热量，从而冷却装置适于在不使用通风扇的情况下抑制CPU的温度上升。