Poly(phenylene ether) copolymer compositions and associated methods and articles

    公开(公告)号:US11279824B2

    公开(公告)日:2022-03-22

    申请号:US16497547

    申请日:2018-03-27

    Abstract: A solution of a poly(phenylene ether) copolymer derived from 2-methyl-6-phenylphenol and a dihydric phenol in a non-halogenated solvent is useful in curable compositions. The copolymer has less than 0.5 weight percent monohydric phenols having identical substituents in the 2- and 6-positions of the phenolic ring, and an absolute number average molecular weight of 1,000 to 10,000 grams/mole. A solution of a poly(phenylene ether) copolymer derived from 2-methyl-6-phenylphenol, 2,6-dimethylphenol, and a dihydric phenol in a non-halogenated solvent is also useful in curable compositions. This copolymer has an absolute number average molecular weight of 1,000 to 5,000 grams/mole. A cured composition is obtained by heating curable compositions composed of the poly(phenylene ether) copolymer solutions and thermoset resins for a time and temperature sufficient to evaporate the non-halogenated solvent and effect curing. The compositions can be used for preparation of composites for printed circuit boards.

    POLY(PHENYLENE ETHER) COPOLYMER COMPOSITIONS AND ASSOCIATED METHODS AND ARTICLES

    公开(公告)号:US20200172729A1

    公开(公告)日:2020-06-04

    申请号:US16497547

    申请日:2018-03-27

    Abstract: A solution of a poly(phenylene ether) copolymer derived from 2-methyl-6-phenylphenol and a dihydric phenol in a non-halogenated solvent is useful in curable compositions. The copolymer has less than 0.5 weight percent monohydric phenols having identical substituents in the 2- and 6-positions of the phenolic ring, and an absolute number average molecular weight of 1,000 to 10,000 grams/mole. A solution of a poly(phenylene ether) copolymer derived from 2-methyl-6-phenylphenol, 2,6-dimethylphenol, and a dihydric phenol in a non-halogenated solvent is also useful in curable compositions. This copolymer has an absolute number average molecular weight of 1,000 to 5,000 grams/mole. A cured composition is obtained by heating curable compositions composed of the poly(phenylene ether) copolymer solutions and thermoset resins for a time and temperature sufficient to evaporate the non-halogenated solvent and effect curing. The compositions can be used for preparation of composites for printed circuit boards.

    Method of forming phenylene ether oligomer

    公开(公告)号:US10259762B2

    公开(公告)日:2019-04-16

    申请号:US16061764

    申请日:2016-11-10

    Abstract: A phenylene ether oligomer is prepared by a process that includes partially converting 2,6-dimethylphenol to 3,3′,5,5′-tetramethyl-4,4′-dihydroxybiphenyl and/or 3,3′,5,5′-tetramethyldiphenoquinone, converting the residual 2,6 dimethylphenol to poly(2,6-dimethyl-1,4-phenylene ether) and any 3,3′,5,5′-tetramethyl-4,4′-dihydroxybiphenyl to 3,3′,5,5′-tetramethyldiphenoquinone, and reacting the poly(2,6-dimethyl-1,4-phenylene ether) and 3,3′,5,5′-tetramethyldiphenoquinone to form the phenylene ether oligomer. The preparation can be conducted without isolation of intermediates.

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