公开(公告)号：US20230111961A1

公开(公告)日：2023-04-13

申请号：US18063355

申请日：2022-12-08

Applicant: SAINT-GOBAIN PERFORMANCE PLASTICS CORPORATION

Inventor： Jennifer ADAMCHUK ,  Dale THOMAS ,  Meghann WHITE ,  Sethumadhavan RAVICHANDRAN ,  Gerard T. BUSS

IPC: C09J7/24 ,  C09J11/04 ,  B32B15/20 ,  C09J7/38 ,  H05K1/09 ,  B32B7/12 ,  B32B15/08 ,  B32B27/20 ,  B32B27/28 ,  H05K1/03

Abstract: The present disclosure relates to a dielectric substrate that may include a polymer based core film, and a fluoropolymer based adhesive layer. The polymer based core film may include a resin matrix component, and a ceramic filler component. The ceramic filler component may include a first filler material. The particle size distribution of the first filler material may have a D10 of at least about 1.0 microns and not greater than about 1.7, a D50 of at least about 1.0 microns and not greater than about 3.5 microns, and a D90 of at least about 2.7 microns and not greater than about 6 microns.

公开(公告)号：US20230191750A1

公开(公告)日：2023-06-22

申请号：US18065989

申请日：2022-12-14

Applicant: SAINT-GOBAIN PERFORMANCE PLASTICS CORPORATION

Inventor： Jennifer ADAMCHUK ,  Dale THOMAS ,  Meghann WHITE ,  Sethumadhavan RAVICHANDRAN

IPC: B32B15/085 ,  B32B15/20 ,  B32B27/20 ,  B32B27/32

CPC classification number: B32B15/085 ,  B32B15/20 ,  B32B27/20 ,  B32B27/322 ,  B32B2264/107 ,  B32B2262/124 ,  B32B2264/12 ,  B32B2264/303

Abstract: The present disclosure relates to a dielectric substrate that may include a resin matrix component, and a ceramic filler component. The ceramic filler component may include a first filler material. The particle size distribution of the first filler material may have a D10 of at least about 1.0 microns and not greater than about 1.7, a D50 of at least about 1.0 microns and not greater than about 3.5 microns, and a D90 of at least about 2.7 microns and not greater than about 6 microns.

公开(公告)号：US20220186081A1

公开(公告)日：2022-06-16

申请号：US17643446

申请日：2021-12-09

Applicant: SAINT-GOBAIN PERFORMANCE PLASTICS CORPORATION

Inventor： Jennifer ADAMCHUK ,  Dale THOMAS ,  Meghann White ,  Sethumadhavan Ravichandran ,  Gerard T. Buss

IPC: C09J7/24 ,  C09J11/04 ,  C09J7/38 ,  H05K1/09 ,  H05K1/03 ,  B32B7/12 ,  B32B27/20 ,  B32B15/20 ,  B32B15/08 ,  B32B27/28

Abstract: The present disclosure relates to a dielectric substrate that may include a polymer based core film, and a fluoropolymer based adhesive layer. The polymer based core film may include a resin matrix component, and a ceramic filler component. The ceramic filler component may include a first filler material. The particle size distribution of the first filler material may have a D10 of at least about 1.0 microns and not greater than about 1.7, a D50 of at least about 1.0 microns and not greater than about 3.5 microns, and a D90 of at least about 2.7 microns and not greater than about 6 microns.