公开(公告)号：US20220039254A1

公开(公告)日：2022-02-03

申请号：US17443390

申请日：2021-07-26

Applicant: SAINT-GOBAIN PERFORMANCE PLASTICS CORPORATION

Inventor： Jennifer ADAMCHUK ,  Gerard T. BUSS ,  Theresa M. BESOZZI

IPC: H05K1/03 ,  H05K1/05 ,  H05K1/09

Abstract: The present disclosure relates to a dielectric substrate that may include a polyimide layer and a first filled polymer layer overlying the polyimide layer. The first filled polymer layer may include a resin matrix component, and a first ceramic filler component. The first ceramic filler component may include a first filler material. The first filler material may further have a mean particle size of at not greater than about 10 microns.

公开(公告)号：US20240023242A1

公开(公告)日：2024-01-18

申请号：US18471816

申请日：2023-09-21

Applicant: SAINT-GOBAIN PERFORMANCE PLASTICS CORPORATION

Inventor： Jennifer ADAMCHUK ,  Gerard T. BUSS ,  Theresa M. BESOZZI

IPC: H05K1/03 ,  H05K1/09 ,  H05K1/05

CPC classification number: H05K1/0373 ,  H05K1/09 ,  H05K1/05 ,  H05K2201/0358

Abstract: The present disclosure relates to a dielectric substrate that may include a polyimide layer and a first filled polymer layer overlying the polyimide layer. The first filled polymer layer may include a resin matrix component, and a first ceramic filler component. The first ceramic filler component may include a first filler material. The first filler material may further have a mean particle size of at not greater than about 10 microns.