公开(公告)号：US20140036456A1

公开(公告)日：2014-02-06

申请号：US13706622

申请日：2012-12-06

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： Byung-Goo JUNG ,  Joo-Yeon WON ,  Chong-Guk LEE ,  Sung-Dong PARK

IPC: H05K7/06

CPC classification number: H05K7/06 ,  G02F1/13452 ,  H01L23/49572 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2924/0002 ,  H05K1/0393 ,  H01L2924/00 ,  H01L2924/00014

Abstract: A tape package includes a base substrate, an input lead line disposed on the base substrate, the input lead line including a main input lead line and a sub input lead line, the sub input lead line branching off and extending from the main input lead line, an integrated circuit chip electrically connected to the sub input lead line, and a sealing part fixing the integrated circuit chip on the base substrate and overlapping a portion of the main input lead line.

Abstract translation: 一种带式封装，包括基底基板，设置在基底基板上的输入引线，输入引线包括主输入引线和副输入引线，副输入引线从主输入引线 电连接到子输入引线的集成电路芯片，以及将集成电路芯片固定在基底基板上并与主输入引线的一部分重叠的密封部件。