-
公开(公告)号:US10206300B2
公开(公告)日:2019-02-12
申请号:US15621492
申请日:2017-06-13
Applicant: SAMSUNG DISPLAY CO., LTD.
Inventor: Sungrak Hong , Kyomin Kim , Dohyeon Park , Myoung-ha Jeon
IPC: H05K1/14 , H05K7/06 , H05K1/02 , H05K1/03 , H05K1/05 , H05K1/18 , H05K5/00 , H05K5/02 , H05K5/03 , H05K7/14 , H05K7/20
Abstract: A printed circuit board assembly includes a printed circuit board including a plurality of first conductive lines insulated from each other and an insulating layer disposed on the first conductive lines. The insulating layer having a recess disposed at a side surface of the insulating layer. The recess exposes the first conductive lines. The printed circuit board assembly further includes a flexible cable including a plurality of second conductive lines corresponding to the first conductive lines. The flexible cable is disposed in the recess.
-
公开(公告)号:US20180020563A1
公开(公告)日:2018-01-18
申请号:US15621492
申请日:2017-06-13
Applicant: SAMSUNG DISPLAY CO., LTD.
Inventor: Sungrak Hong , Kyomin Kim , Dohyeon Park , Myoung-Ha Jeon
IPC: H05K7/06 , H05K7/20 , H05K7/14 , H05K1/03 , H05K1/02 , H05K5/00 , H05K1/18 , H05K1/05 , H05K5/02 , H05K5/03
CPC classification number: H05K7/06 , G02F1/13452 , H05K1/0296 , H05K1/0393 , H05K1/05 , H05K1/188 , H05K5/0017 , H05K5/0247 , H05K5/03 , H05K7/1491 , H05K7/1494 , H05K7/20954 , H05K2201/10136
Abstract: A printed circuit board assembly includes a printed circuit board including a plurality of first conductive lines insulated from each other and an insulating layer disposed on the first conductive lines. The insulating layer having a recess disposed at a side surface of the insulating layer. The recess exposes the first conductive lines. The printed circuit board assembly further includes a flexible cable including a plurality of second conductive lines corresponding to the first conductive lines. The flexible cable is disposed in the recess.
-