公开(公告)号：US10206300B2

公开(公告)日：2019-02-12

申请号：US15621492

申请日：2017-06-13

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： Sungrak Hong ,  Kyomin Kim ,  Dohyeon Park ,  Myoung-ha Jeon

IPC: H05K1/14 ,  H05K7/06 ,  H05K1/02 ,  H05K1/03 ,  H05K1/05 ,  H05K1/18 ,  H05K5/00 ,  H05K5/02 ,  H05K5/03 ,  H05K7/14 ,  H05K7/20

Abstract: A printed circuit board assembly includes a printed circuit board including a plurality of first conductive lines insulated from each other and an insulating layer disposed on the first conductive lines. The insulating layer having a recess disposed at a side surface of the insulating layer. The recess exposes the first conductive lines. The printed circuit board assembly further includes a flexible cable including a plurality of second conductive lines corresponding to the first conductive lines. The flexible cable is disposed in the recess.

公开(公告)号：US20180020563A1

公开(公告)日：2018-01-18

申请号：US15621492

申请日：2017-06-13

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： Sungrak Hong ,  Kyomin Kim ,  Dohyeon Park ,  Myoung-Ha Jeon

IPC: H05K7/06 ,  H05K7/20 ,  H05K7/14 ,  H05K1/03 ,  H05K1/02 ,  H05K5/00 ,  H05K1/18 ,  H05K1/05 ,  H05K5/02 ,  H05K5/03

CPC classification number: H05K7/06 ,  G02F1/13452 ,  H05K1/0296 ,  H05K1/0393 ,  H05K1/05 ,  H05K1/188 ,  H05K5/0017 ,  H05K5/0247 ,  H05K5/03 ,  H05K7/1491 ,  H05K7/1494 ,  H05K7/20954 ,  H05K2201/10136

Abstract: A printed circuit board assembly includes a printed circuit board including a plurality of first conductive lines insulated from each other and an insulating layer disposed on the first conductive lines. The insulating layer having a recess disposed at a side surface of the insulating layer. The recess exposes the first conductive lines. The printed circuit board assembly further includes a flexible cable including a plurality of second conductive lines corresponding to the first conductive lines. The flexible cable is disposed in the recess.