公开(公告)号：US20190200447A1

公开(公告)日：2019-06-27

申请号：US16227723

申请日：2018-12-20

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： MUNSIK CHOI ,  Kl-SOO NAM ,  HANYUL YU

IPC: H05K1/02 ,  H05K1/09 ,  H05K1/03 ,  H05K1/14 ,  G02F1/1335 ,  G02F1/1368 ,  G02F1/1345 ,  G02F1/1333

CPC classification number: H05K1/028 ,  G02F1/133308 ,  G02F1/133514 ,  G02F1/13452 ,  G02F1/1368 ,  G02F2001/133331 ,  H05K1/0393 ,  H05K1/09 ,  H05K1/144 ,  H05K2201/0154 ,  H05K2201/0162 ,  H05K2201/041 ,  H05K2201/056 ,  H05K2201/10136

Abstract: A printed circuit board includes: a first flexible base member; a first metal line disposed on the first flexible base member; a first plating line disposed on the first metal line and including a first connecting portion, a first interconnection portion extending from the first connecting portion, and a first bending portion extending from the first interconnection portion; a first protective layer covering the first interconnection portion and exposing the first connecting portion and the first bending portion; a connection part disposed on the first bending portion and connected to the first bending portion; a second protective layer extending from a side surface of the connection part; a second plating line disposed on the second protective layer; a second metal line disposed on the second plating line; and a second flexible base member disposed on the second metal line.