公开(公告)号：US20160176181A1

公开(公告)日：2016-06-23

申请号：US14731537

申请日：2015-06-05

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： Tae-Hwan KIM ,  Man-Hong NA ,  Jong-Hwan LEE

IPC: B32B43/00 ,  B32B38/10

CPC classification number: B32B43/006 ,  B32B38/10 ,  B32B2457/202 ,  Y10T156/1132 ,  Y10T156/1168 ,  Y10T156/1184 ,  Y10T156/1944 ,  Y10T156/1967 ,  Y10T156/1978 ,  Y10T156/1989

Abstract: A method of detaching a sub-substrate from a substrate includes providing a first sub-substrate attached to a first substrate having a rectangular shape with first and second sides extending in a first direction and third and fourth sides extending in a second direction crossing the first direction, inserting a separating member between the first sub-substrate and the first substrate to partially detach therebetween, attaching a plurality of pads arranged in a matrix pattern to the first sub-substrate, lifting first pads among the plurality of pads arranged in a third direction crossing the first and second directions, lifting second pads, at least two of the second pads being arranged in the second direction, and at least two of the second pads being arranged in the third direction, and lifting third pads arranged in the second direction.

Abstract translation: 从基板分离子基板的方法包括提供附接到具有矩形形状的第一基板的第一子基板，其中第一和第二边沿第一方向延伸，第三和第四侧沿与第一方向交叉的第二方向延伸 在所述第一子基板和所述第一基板之间插入分离构件以在其间部分地分离，将以矩阵图案排列的多个焊盘附接到所述第一子基板，提升布置在第三子基板中的所述多个焊盘中的第一焊盘 横向第一和第二方向的方向，提升第二焊盘，至少两个第二焊盘沿第二方向布置，并且至少两个第二焊盘沿第三方向布置，并且提升沿第二方向布置的第三焊盘 。