Abstract:
A camera module includes a lens module having lenses; a reflection module disposed on an object side of the lens module, and changing a path of light so that the light incident inside is directed toward the lens module; and an image sensor disposed on an image side of the lens module. The reflection module can be rotated about a first axis and a second axis perpendicular to the first axis, and an imaging plane of the image sensor includes a curved surface.
Abstract:
A camera module includes: a plurality of lens modules disposed in a first direction and a second direction intersecting an optical axis; a first light blocking member configured to move in the first direction to selectively expose the plurality of lens modules; a second light blocking member configured to move in the second direction to selectively expose the plurality of lens modules; and a driving assembly configured to drive the first light blocking member and the second light blocking member.
Abstract:
A camera apparatus includes a camera body portion including a prism unit, a lens assembly, and an image sensor unit, a gyro sensor detecting a hand-shake with respect to the camera body portion and outputting gyro sensor information, a driver circuit generating at least one of a prism driving signal for image stabilization of the prism unit and a sensor driving signal for image stabilization of the image sensor unit based on the gyro sensor information, a prism actuator disposed in the camera body portion for driving the prism unit and performing image stabilization on the prism unit in response to the prism driving signal, and a sensor actuator disposed in the camera body portion for driving the image sensor unit and performing image stabilization on the image sensor unit in response to the sensor driving signal.
Abstract:
The present disclosure relates to an image sensor device including: a fan-out semiconductor package including a first semiconductor chip having an active surface on which a connection pad is disposed, a first connection member disposed on the active surface and including a redistribution layer electrically connected to the connection pad of the first semiconductor chip, and a sealing material disposed on the first connection member and sealing at least a portion of the first semiconductor chip, a second semiconductor chip disposed on the first connection member and electrically connected to the first connection member; and a third semiconductor chip disposed on the second semiconductor chip and electrically connected to the second semiconductor chip, in which at least one of the second semiconductor chip or the third semiconductor chip may be an image sensor. The present disclosure also relates to an image sensor module including the image sensor device.
Abstract:
An image capturing apparatus is provided. The image capturing apparatus includes a display member, configured to display an image, a camera module, disposed behind the display member, and a touch sensor member, configured to detect a touch input. The camera module is configured to capture a first image in a first position in front of the display member or the touch sensor member, and to capture a second image in a second position in front of the display member or in front of the touch sensor member, the second position being different from the first position. An image capturing position of the camera module is moved such that at least a portion of a non-captured region, covered with the display member or the touch sensor member in one of the first and second images, is not covered in the other of the first and second images.
Abstract:
In a system and a method of controlling an imaging direction and an angle of view of a camera according to an aspect of the present disclosure, infrared light may be irradiated toward pupils of eyes of a user, and a position of infrared light reflected from the pupils of the eyes of the user may be detected by a first camera to track a line of sight of the user and calculate a viewing angle of the user. In addition, an imaging direction of a second camera may coincide with the line of sight of the user and an angle of view of the second camera may coincide with the viewing angle of the user to allow an image actually viewed by the user and an image captured by the camera to coincide with each other.
Abstract:
A camera module is provided. The camera module includes an image sensor, a lens assembly disposed on the image sensor and including a plurality of lenses, and an optical path member disposed between the image sensor and the lens assembly, wherein the optical path member is configured to be at least partially in contact with a first surface of a first lens adjacent to the image sensor among the plurality of lenses of the lens assembly.
Abstract:
A camera module device includes: a base plate; one or more cameras fixed to and disposed on one surface of the base plate; a plurality of movable cameras movably disposed on the one surface of the base plate and configured to move individually or collectively; a driving gear disposed on the base plate; and a plurality of sub-gears engaged with the driving gear, wherein positions of the plurality of sub-gears are configured to change to selectively transfer power to one or more of the plurality of movable cameras.
Abstract:
A camera module is provided. The camera module includes a base plate and a plurality of cameras provided on the base plate, wherein one of the plurality of cameras is configured to be moved by a driver, and wherein the other cameras of the plurality of cameras are configured to move while being interlocked with the one of the plurality of cameras.
Abstract:
A substrate for a camera module includes: a first substrate; an image sensor installed on the first substrate and a memory chip installed to be embedded in the first substrate. The first substrate includes a soft substrate portion disposed at a central portion of the first substrate, and a hard substrate portion formed on upper and lower portions of the soft substrate portion, and at least a portion of the memory chip is disposed in an installation hole formed in the soft substrate portion.