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公开(公告)号:US20240212935A1
公开(公告)日:2024-06-27
申请号:US18124713
申请日:2023-03-22
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor: Hiroki OKADA , Jong Rock LEE , Jun Il KANG , Hee Jung JUNG , Chung Yeol LEE , Cheong KIM
CPC classification number: H01G4/2325 , H01G4/224 , H01G4/252 , H01G4/30
Abstract: A multilayer electronic component according to an example embodiment of the present disclosure may include a body including a dielectric layer and internal electrodes alternately arranged in a first direction with the dielectric layer between the internal electrodes, and including first and second surfaces opposing each other in the first direction, third and fourth surfaces connected to the first and second surfaces and opposing each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other in a third direction; external electrodes disposed on the body; and a first inorganic material, including at least one inorganic material among sulfur (S) and fluorine (F), disposed in at least a portion between the body and the external electrodes.
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公开(公告)号:US20240331946A1
公开(公告)日:2024-10-03
申请号:US18235064
申请日:2023-08-17
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor: Chung Yeol LEE , Jun Il KANG , Hee Jung JUNG , Jong Rock LEE , Cheong KIM , Hiroki OKADA
Abstract: A multilayer electronic component, may include: a body including a dielectric layer and internal electrodes; and an external electrode disposed on the body, in which a lattice-type groove shape having a plurality of grooves arranged in a lattice form may be formed in at least a portion of a surface of the body.
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