MULTILAYER ELECTRONIC COMPONENT
    1.
    发明公开

    公开(公告)号:US20240212935A1

    公开(公告)日:2024-06-27

    申请号:US18124713

    申请日:2023-03-22

    CPC classification number: H01G4/2325 H01G4/224 H01G4/252 H01G4/30

    Abstract: A multilayer electronic component according to an example embodiment of the present disclosure may include a body including a dielectric layer and internal electrodes alternately arranged in a first direction with the dielectric layer between the internal electrodes, and including first and second surfaces opposing each other in the first direction, third and fourth surfaces connected to the first and second surfaces and opposing each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other in a third direction; external electrodes disposed on the body; and a first inorganic material, including at least one inorganic material among sulfur (S) and fluorine (F), disposed in at least a portion between the body and the external electrodes.

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