MULTILAYER ELECTRONIC COMPONENT
    1.
    发明公开

    公开(公告)号:US20240212935A1

    公开(公告)日:2024-06-27

    申请号:US18124713

    申请日:2023-03-22

    CPC classification number: H01G4/2325 H01G4/224 H01G4/252 H01G4/30

    Abstract: A multilayer electronic component according to an example embodiment of the present disclosure may include a body including a dielectric layer and internal electrodes alternately arranged in a first direction with the dielectric layer between the internal electrodes, and including first and second surfaces opposing each other in the first direction, third and fourth surfaces connected to the first and second surfaces and opposing each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other in a third direction; external electrodes disposed on the body; and a first inorganic material, including at least one inorganic material among sulfur (S) and fluorine (F), disposed in at least a portion between the body and the external electrodes.

    COIL COMPONENT
    2.
    发明申请

    公开(公告)号:US20230014633A1

    公开(公告)日:2023-01-19

    申请号:US17848814

    申请日:2022-06-24

    Abstract: A coil component includes: a body containing magnetic metal particles and an insulating resin; a coil portion disposed in the body; and first and second external electrodes disposed on the body while being spaced apart from each other and connected to opposite end portions of the coil portion, respectively, wherein a surface of the body has first and second regions in which the first and second external electrodes are disposed, respectively, and a third region in which the first and second external electrodes are not disposed, some of the magnetic metal particles are exposed to the third region of the body, and a monomolecular organic material having a hydrophobic portion is disposed at an exposed surface of the magnetic metal particle exposed to the third region of the body.

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