公开(公告)号：US20240276640A1

公开(公告)日：2024-08-15

申请号：US18386053

申请日：2023-11-01

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Young-Gon Kim ,  Hokwon Yoon ,  Eunseok Kang

IPC: H05K1/11 ,  H05K1/02 ,  H05K3/40

CPC classification number: H05K1/111 ,  H05K1/0254 ,  H05K3/4015 ,  H05K2201/0203 ,  H05K2201/099

Abstract: An electronic component package according to an embodiment includes a circuit board including an insulating layer, a circuit wiring disposed inside the insulating layer, a plurality of first conductive pads disposed in a first region on the insulating layer and connected to the circuit wiring, an auxiliary pad disposed over the first conductive pad and having a diameter smaller than that of the first conductive pad, and a solder resist layer disposed over the insulating layer, having a first opening overlapping the first region, and spaced apart from the auxiliary pad; an electronic component spaced apart from the solder resist layer and disposed over the first opening; and a conductive adhesive member electrically connecting the auxiliary pad and the electronic component.