公开(公告)号：US20160366766A1

公开(公告)日：2016-12-15

申请号：US14886581

申请日：2015-10-19

Applicant: HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd. ,  FuKui Precision Component (Shenzhen) Co., Ltd. ,  Zhen Ding Technology Co., Ltd.

Inventor： TZU-CHIEN YEH

IPC: H05K1/18 ,  H05K1/02 ,  H05K3/40 ,  H05K1/03 ,  H05K3/18 ,  H05K3/46 ,  H05K1/11 ,  H05K1/09

CPC classification number: H05K1/184 ,  H05K1/0298 ,  H05K1/0313 ,  H05K1/092 ,  H05K1/111 ,  H05K1/115 ,  H05K1/187 ,  H05K3/0097 ,  H05K3/188 ,  H05K3/4038 ,  H05K3/4602 ,  H05K3/4644 ,  H05K3/4697 ,  H05K2201/0203 ,  H05K2201/0391 ,  H05K2201/09545 ,  H05K2203/0278 ,  H05K2203/122 ,  H05K2203/1536 ,  Y10T29/49165

Abstract: A circuit board includes a core layer, at least one passive component, a first and a second conductive wire layers, at least one contact pad, and a resin packing layer. The core layer defines at least one through hole to receive the passive component. The first and the second conductive wire layers are connected to two opposite surfaces of the core layer. Each contact pad is positioned between and connected to one passive component and the first conductive wire layer. The resin packing layer is filled among the core layer, each passive component, each contact pad, the first and the second conductive wire layers. The resin packing layer can connect the first and the second conductive wire layers to the core layer, and connect the core layer, each passive component, and each contact pads to each other.

Abstract translation: 电路板包括芯层，至少一个无源部件，第一和第二导线层，至少一个接触焊盘和树脂封装层。 芯层限定至少一个通孔以接收无源部件。 第一和第二导线层连接到芯层的两个相对的表面。 每个接触垫位于一个无源部件和第一导电层之间并连接到其上。 在芯层，每个无源部件，每个接触焊盘，第一和第二导线层中填充树脂填充层。 树脂填充层可以将第一和第二导线层连接到芯层，并且将芯层，每个无源部件和每个接触焊盘彼此连接。

公开(公告)号：US20180255637A1

公开(公告)日：2018-09-06

申请号：US15446898

申请日：2017-03-01

Applicant: Microsoft Technology Licensing, LLC

Inventor： Siyuan Ma ,  James David Holbery ,  Hanbit Jin

IPC: H05K1/09 ,  B41F15/00 ,  H05K1/03 ,  H05K3/12 ,  C09D11/52 ,  C09D11/106 ,  C09D11/102 ,  C09D11/033

CPC classification number: C09D11/033 ,  B41F15/00 ,  B41F15/0868 ,  B41F19/005 ,  B41M1/12 ,  B41M1/30 ,  C09D11/037 ,  C09D11/102 ,  C09D11/106 ,  C09D11/52 ,  H05K1/038 ,  H05K1/097 ,  H05K3/1216 ,  H05K3/1225 ,  H05K3/125 ,  H05K2201/0145 ,  H05K2201/0203 ,  H05K2201/0245 ,  H05K2201/026 ,  H05K2201/0278 ,  H05K2201/029

Abstract: One disclosed example comprises an ink formulated for printing an electrically conductive trace on a flexible fabric substrate. The ink includes an elastomer and a liquid vehicle capable of swelling the elastomer, the liquid vehicle having a boiling point of 150° C. or greater at one atmosphere. A plurality of non-spherical, electrically conductive particles are suspended in the liquid vehicle to impart electrical conductivity to the ink.

公开(公告)号：US09872393B2

公开(公告)日：2018-01-16

申请号：US14886581

申请日：2015-10-19

Applicant: Avary Holding (Shenzhen) Co., Limited ,  HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd. ,  GARUDA TECHNOLOGY CO., LTD.

Inventor： Tzu-Chien Yeh

IPC: H01K3/10 ,  H05K1/18 ,  H05K1/11 ,  H05K1/02 ,  H05K1/09 ,  H05K1/03 ,  H05K3/18 ,  H05K3/46 ,  H05K3/40

CPC classification number: H05K1/184 ,  H05K1/0298 ,  H05K1/0313 ,  H05K1/092 ,  H05K1/111 ,  H05K1/115 ,  H05K1/187 ,  H05K3/0097 ,  H05K3/188 ,  H05K3/4038 ,  H05K3/4602 ,  H05K3/4644 ,  H05K3/4697 ,  H05K2201/0203 ,  H05K2201/0391 ,  H05K2201/09545 ,  H05K2203/0278 ,  H05K2203/122 ,  H05K2203/1536 ,  Y10T29/49165

Abstract: A circuit board includes a core layer, at least one passive component, a first and a second conductive wire layers, at least one contact pad, and a resin packing layer. The core layer defines at least one through hole to receive the passive component. The first and the second conductive wire layers are connected to two opposite surfaces of the core layer. Each contact pad is positioned between and connected to one passive component and the first conductive wire layer. The resin packing layer is filled among the core layer, each passive component, each contact pad, the first and the second conductive wire layers. The resin packing layer can connect the first and the second conductive wire layers to the core layer, and connect the core layer, each passive component, and each contact pads to each other.

公开(公告)号：US20080137316A1

公开(公告)日：2008-06-12

申请号：US11857871

申请日：2007-09-19

Applicant: Oscar Khaselev ,  Nitin Desai ,  Michael T. Marczi ,  Bawa Singh

Inventor： Oscar Khaselev ,  Nitin Desai ,  Michael T. Marczi ,  Bawa Singh

IPC: H01R9/00 ,  H05K3/10

CPC classification number: H05K3/125 ,  H05K1/09 ,  H05K3/0011 ,  H05K3/1258 ,  H05K3/22 ,  H05K3/245 ,  H05K2201/0203 ,  H05K2201/0224 ,  H05K2201/09909 ,  H05K2203/013 ,  H05K2203/0568 ,  H05K2203/0769 ,  H05K2203/1131 ,  H05K2203/1476 ,  Y10T29/49155

Abstract: Conductive patterns and methods of using and printing such conductive patterns are disclosed. In certain examples, the conductive patterns may be produced by disposing a conductive material between supports on a substrate. The supports may be removed to provide conductive patterns having a desired length and/or geometry.

Abstract translation: 公开了使用和印刷这种导电图案的导电图案和方法。 在某些实例中，导电图案可以通过在衬底上的支撑件之间设置导电材料来制造。 可以移除支撑件以提供具有期望长度和/或几何形状的导电图案。

公开(公告)号：US20240276640A1

公开(公告)日：2024-08-15

申请号：US18386053

申请日：2023-11-01

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Young-Gon Kim ,  Hokwon Yoon ,  Eunseok Kang

IPC: H05K1/11 ,  H05K1/02 ,  H05K3/40

CPC classification number: H05K1/111 ,  H05K1/0254 ,  H05K3/4015 ,  H05K2201/0203 ,  H05K2201/099

Abstract: An electronic component package according to an embodiment includes a circuit board including an insulating layer, a circuit wiring disposed inside the insulating layer, a plurality of first conductive pads disposed in a first region on the insulating layer and connected to the circuit wiring, an auxiliary pad disposed over the first conductive pad and having a diameter smaller than that of the first conductive pad, and a solder resist layer disposed over the insulating layer, having a first opening overlapping the first region, and spaced apart from the auxiliary pad; an electronic component spaced apart from the solder resist layer and disposed over the first opening; and a conductive adhesive member electrically connecting the auxiliary pad and the electronic component.

公开(公告)号：US20170188455A1

公开(公告)日：2017-06-29

申请号：US14998263

申请日：2015-12-26

Applicant: Intel Corporation

Inventor： Yoshihiro Tomita ,  Joshua D. Heppner ,  Shawna M. Liff ,  Pramod Malatkar

IPC: H05K1/03 ,  H05K1/18 ,  A41D13/00 ,  H05K3/00 ,  A41D1/00 ,  A43B3/00 ,  H05K1/11 ,  H05K3/32

CPC classification number: H05K1/0393 ,  A41D1/002 ,  A41D13/0015 ,  A43B1/0054 ,  A43B3/0005 ,  H05K1/03 ,  H05K1/118 ,  H05K1/189 ,  H05K3/0011 ,  H05K3/007 ,  H05K3/32 ,  H05K2201/0129 ,  H05K2201/0203 ,  H05K2201/0215 ,  H05K2201/08 ,  H05K2201/083 ,  H05K2203/0152 ,  H05K2203/104

Abstract: In accordance with disclosed embodiments, there are provided methods, systems, and apparatuses for implementing a magnetic particle embedded flexible substrate, a printed flexible substrate for a magnetic tray, or an electro-magnetic carrier for magnetized or ferromagnetic flexible substrates. For instance, in accordance with one embodiment, there are means disclosed for fabricating a flexible substrate having one or more electrical interconnects to couple with leads of an electrical device; integrating magnetic particles or ferromagnetic particles into the flexible substrate; supporting the flexible substrate with a carrier plate during one or more manufacturing processes for the flexible substrate, in which the flexible substrate is held flat against the carrier plate by an attractive magnetic force between the magnetic particles or ferromagnetic particles integrated with the flexible substrate and a complementary magnetic attraction of the carrier plate; and removing the flexible substrate from the carrier plate subsequent to completion of the one or more manufacturing processes for the flexible substrate. Other related embodiments are disclosed.

公开(公告)号：US20170164484A1

公开(公告)日：2017-06-08

申请号：US15439555

申请日：2017-02-22

Applicant: Alpha Assembly Solutions Inc.

Inventor： Oscar Khaselev ,  Nitin Desai ,  Michael T. Marczi ,  Bawa Singh

IPC: H05K3/12 ,  H05K3/00 ,  H05K3/22 ,  H05K1/09

CPC classification number: H05K3/125 ,  H05K1/09 ,  H05K3/0011 ,  H05K3/1258 ,  H05K3/22 ,  H05K3/245 ,  H05K2201/0203 ,  H05K2201/0224 ,  H05K2201/09909 ,  H05K2203/013 ,  H05K2203/0568 ,  H05K2203/0769 ,  H05K2203/1131 ,  H05K2203/1476 ,  Y10T29/49155

Abstract: Conductive patterns and methods of using and printing such conductive patterns are disclosed. In certain examples, the conductive patterns may be produced by disposing a conductive material between supports on a substrate. The supports may be removed to provide conductive patterns having a desired length and/or geometry.

公开(公告)号：US11830640B2

公开(公告)日：2023-11-28

申请号：US17382980

申请日：2021-07-22

Applicant: Alpha Assembly Solutions Inc.

Inventor： Narahari Pujari ,  Bawa Singh ,  Ravi Bhatkal ,  Siuli Sarkar ,  Anubhav Rustogi

IPC: H01B1/22 ,  H05K1/09 ,  B22F1/17 ,  B22F1/052 ,  B22F1/068 ,  B22F1/107 ,  B23K35/02 ,  B23K35/30 ,  B23K35/36 ,  B23K35/362 ,  H05K3/12 ,  H05K1/18

CPC classification number: H01B1/22 ,  B22F1/052 ,  B22F1/068 ,  B22F1/107 ,  B22F1/17 ,  B23K35/025 ,  B23K35/3006 ,  B23K35/362 ,  B23K35/3613 ,  H05K1/095 ,  H05K3/1216 ,  H05K3/1241 ,  B22F2301/255 ,  B22F2302/45 ,  B22F2304/10 ,  H05K1/189 ,  H05K2201/0133 ,  H05K2201/0203 ,  H05K2201/0245 ,  H05K2201/10106

Abstract: A conductive paste and method of manufacturing thereof. The conductive paste comprises conductive particles dispersed in an organic medium, the organic medium comprising: (a) a solvent; and (b) a binder comprising a polyester. The conductive paste typically comprises silver and may contain various other additives. A stretchable conductive layer can be formed by curing the conductive paste.

公开(公告)号：US20170144220A1

公开(公告)日：2017-05-25

申请号：US15318903

申请日：2015-06-16

Applicant: OSAKA UNIVERSITY

Inventor： Katsuaki SUGANUMA ,  Jinting JIU

IPC: B22F1/00 ,  H01B1/22 ,  C09D7/12 ,  H05K1/09 ,  B22F9/24 ,  C09D5/24

CPC classification number: B22F1/0022 ,  B22F1/00 ,  B22F1/0014 ,  B22F9/24 ,  B22F2009/245 ,  B22F2301/255 ,  B22F2304/054 ,  B22F2304/056 ,  B22F2304/058 ,  B22F2304/10 ,  B22F2998/10 ,  C09D5/24 ,  C09D7/68 ,  C09D7/69 ,  H01B1/00 ,  H01B1/22 ,  H01B5/00 ,  H01B13/00 ,  H05K1/09 ,  H05K1/092 ,  H05K2201/0203

Abstract: A silver particle synthesizing method includes reducing a dispersant from first silver particles each covered with the dispersant to obtain second silver particles. The method further includes synthesizing third silver particles each having a larger particle diameter than the second silver particles by causing a reaction between a silver compound and a reductant in a liquid phase containing the second silver particles.

公开(公告)号：US09615463B2

公开(公告)日：2017-04-04

申请号：US11857871

申请日：2007-09-19

Applicant: Oscar Khaselev ,  Nitin Desai ,  Michael T. Marczi ,  Bawa Singh

Inventor： Oscar Khaselev ,  Nitin Desai ,  Michael T. Marczi ,  Bawa Singh

IPC: H05K3/22 ,  H05K3/24 ,  H05K3/12

CPC classification number: H05K3/125 ,  H05K1/09 ,  H05K3/0011 ,  H05K3/1258 ,  H05K3/22 ,  H05K3/245 ,  H05K2201/0203 ,  H05K2201/0224 ,  H05K2201/09909 ,  H05K2203/013 ,  H05K2203/0568 ,  H05K2203/0769 ,  H05K2203/1131 ,  H05K2203/1476 ,  Y10T29/49155

Abstract: Conductive patterns and methods of using and printing such conductive patterns are disclosed. In certain examples, the conductive patterns may be produced by disposing a conductive material between supports on a substrate. The supports may be removed to provide conductive patterns having a desired length and/or geometry.