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1.发明申请CIRCUIT BOARD, METHOD FOR MAKING THE SAME, AND PORTABLE ELECTRONIC DEVICE EMPLOYING THE SAME 有权电路板，制造该电路板的方法和使用其的便携式电子设备公开(公告)号：US20160366766A1
公开(公告)日：2016-12-15
申请号：US14886581
申请日：2015-10-19
申请人： HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd. , FuKui Precision Component (Shenzhen) Co., Ltd. , Zhen Ding Technology Co., Ltd.
发明人： TZU-CHIEN YEH
CPC分类号： H05K1/184 , H05K1/0298 , H05K1/0313 , H05K1/092 , H05K1/111 , H05K1/115 , H05K1/187 , H05K3/0097 , H05K3/188 , H05K3/4038 , H05K3/4602 , H05K3/4644 , H05K3/4697 , H05K2201/0203 , H05K2201/0391 , H05K2201/09545 , H05K2203/0278 , H05K2203/122 , H05K2203/1536 , Y10T29/49165
摘要： A circuit board includes a core layer, at least one passive component, a first and a second conductive wire layers, at least one contact pad, and a resin packing layer. The core layer defines at least one through hole to receive the passive component. The first and the second conductive wire layers are connected to two opposite surfaces of the core layer. Each contact pad is positioned between and connected to one passive component and the first conductive wire layer. The resin packing layer is filled among the core layer, each passive component, each contact pad, the first and the second conductive wire layers. The resin packing layer can connect the first and the second conductive wire layers to the core layer, and connect the core layer, each passive component, and each contact pads to each other.
摘要翻译： 电路板包括芯层，至少一个无源部件，第一和第二导线层，至少一个接触焊盘和树脂封装层。 芯层限定至少一个通孔以接收无源部件。 第一和第二导线层连接到芯层的两个相对的表面。 每个接触垫位于一个无源部件和第一导电层之间并连接到其上。 在芯层，每个无源部件，每个接触焊盘，第一和第二导线层中填充树脂填充层。 树脂填充层可以将第一和第二导线层连接到芯层，并且将芯层，每个无源部件和每个接触焊盘彼此连接。
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公开(公告)号：US20180255637A1
公开(公告)日：2018-09-06
申请号：US15446898
申请日：2017-03-01
发明人： Siyuan Ma , James David Holbery , Hanbit Jin
IPC分类号： H05K1/09 , B41F15/00 , H05K1/03 , H05K3/12 , C09D11/52 , C09D11/106 , C09D11/102 , C09D11/033
CPC分类号： C09D11/033 , B41F15/00 , B41F15/0868 , B41F19/005 , B41M1/12 , B41M1/30 , C09D11/037 , C09D11/102 , C09D11/106 , C09D11/52 , H05K1/038 , H05K1/097 , H05K3/1216 , H05K3/1225 , H05K3/125 , H05K2201/0145 , H05K2201/0203 , H05K2201/0245 , H05K2201/026 , H05K2201/0278 , H05K2201/029
摘要： One disclosed example comprises an ink formulated for printing an electrically conductive trace on a flexible fabric substrate. The ink includes an elastomer and a liquid vehicle capable of swelling the elastomer, the liquid vehicle having a boiling point of 150° C. or greater at one atmosphere. A plurality of non-spherical, electrically conductive particles are suspended in the liquid vehicle to impart electrical conductivity to the ink.
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3.发明申请公开(公告)号：US20170188455A1
公开(公告)日：2017-06-29
申请号：US14998263
申请日：2015-12-26
申请人： Intel Corporation
CPC分类号： H05K1/0393 , A41D1/002 , A41D13/0015 , A43B1/0054 , A43B3/0005 , H05K1/03 , H05K1/118 , H05K1/189 , H05K3/0011 , H05K3/007 , H05K3/32 , H05K2201/0129 , H05K2201/0203 , H05K2201/0215 , H05K2201/08 , H05K2201/083 , H05K2203/0152 , H05K2203/104
摘要： In accordance with disclosed embodiments, there are provided methods, systems, and apparatuses for implementing a magnetic particle embedded flexible substrate, a printed flexible substrate for a magnetic tray, or an electro-magnetic carrier for magnetized or ferromagnetic flexible substrates. For instance, in accordance with one embodiment, there are means disclosed for fabricating a flexible substrate having one or more electrical interconnects to couple with leads of an electrical device; integrating magnetic particles or ferromagnetic particles into the flexible substrate; supporting the flexible substrate with a carrier plate during one or more manufacturing processes for the flexible substrate, in which the flexible substrate is held flat against the carrier plate by an attractive magnetic force between the magnetic particles or ferromagnetic particles integrated with the flexible substrate and a complementary magnetic attraction of the carrier plate; and removing the flexible substrate from the carrier plate subsequent to completion of the one or more manufacturing processes for the flexible substrate. Other related embodiments are disclosed.
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公开(公告)号：US20170164484A1
公开(公告)日：2017-06-08
申请号：US15439555
申请日：2017-02-22
发明人： Oscar Khaselev , Nitin Desai , Michael T. Marczi , Bawa Singh
CPC分类号： H05K3/125 , H05K1/09 , H05K3/0011 , H05K3/1258 , H05K3/22 , H05K3/245 , H05K2201/0203 , H05K2201/0224 , H05K2201/09909 , H05K2203/013 , H05K2203/0568 , H05K2203/0769 , H05K2203/1131 , H05K2203/1476 , Y10T29/49155
摘要： Conductive patterns and methods of using and printing such conductive patterns are disclosed. In certain examples, the conductive patterns may be produced by disposing a conductive material between supports on a substrate. The supports may be removed to provide conductive patterns having a desired length and/or geometry.
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公开(公告)号：US09872393B2
公开(公告)日：2018-01-16
申请号：US14886581
申请日：2015-10-19
申请人： Avary Holding (Shenzhen) Co., Limited , HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd. , GARUDA TECHNOLOGY CO., LTD.
发明人： Tzu-Chien Yeh
IPC分类号： H01K3/10 , H05K1/18 , H05K1/11 , H05K1/02 , H05K1/09 , H05K1/03 , H05K3/18 , H05K3/46 , H05K3/40
CPC分类号： H05K1/184 , H05K1/0298 , H05K1/0313 , H05K1/092 , H05K1/111 , H05K1/115 , H05K1/187 , H05K3/0097 , H05K3/188 , H05K3/4038 , H05K3/4602 , H05K3/4644 , H05K3/4697 , H05K2201/0203 , H05K2201/0391 , H05K2201/09545 , H05K2203/0278 , H05K2203/122 , H05K2203/1536 , Y10T29/49165
摘要： A circuit board includes a core layer, at least one passive component, a first and a second conductive wire layers, at least one contact pad, and a resin packing layer. The core layer defines at least one through hole to receive the passive component. The first and the second conductive wire layers are connected to two opposite surfaces of the core layer. Each contact pad is positioned between and connected to one passive component and the first conductive wire layer. The resin packing layer is filled among the core layer, each passive component, each contact pad, the first and the second conductive wire layers. The resin packing layer can connect the first and the second conductive wire layers to the core layer, and connect the core layer, each passive component, and each contact pads to each other.
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公开(公告)号：US20080137316A1
公开(公告)日：2008-06-12
申请号：US11857871
申请日：2007-09-19
申请人： Oscar Khaselev , Nitin Desai , Michael T. Marczi , Bawa Singh
发明人： Oscar Khaselev , Nitin Desai , Michael T. Marczi , Bawa Singh
CPC分类号： H05K3/125 , H05K1/09 , H05K3/0011 , H05K3/1258 , H05K3/22 , H05K3/245 , H05K2201/0203 , H05K2201/0224 , H05K2201/09909 , H05K2203/013 , H05K2203/0568 , H05K2203/0769 , H05K2203/1131 , H05K2203/1476 , Y10T29/49155
摘要： Conductive patterns and methods of using and printing such conductive patterns are disclosed. In certain examples, the conductive patterns may be produced by disposing a conductive material between supports on a substrate. The supports may be removed to provide conductive patterns having a desired length and/or geometry.
摘要翻译： 公开了使用和印刷这种导电图案的导电图案和方法。 在某些实例中，导电图案可以通过在衬底上的支撑件之间设置导电材料来制造。 可以移除支撑件以提供具有期望长度和/或几何形状的导电图案。
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7.发明申请公开(公告)号：US20170144220A1
公开(公告)日：2017-05-25
申请号：US15318903
申请日：2015-06-16
申请人： OSAKA UNIVERSITY
发明人： Katsuaki SUGANUMA , Jinting JIU
CPC分类号： B22F1/0022 , B22F1/00 , B22F1/0014 , B22F9/24 , B22F2009/245 , B22F2301/255 , B22F2304/054 , B22F2304/056 , B22F2304/058 , B22F2304/10 , B22F2998/10 , C09D5/24 , C09D7/68 , C09D7/69 , H01B1/00 , H01B1/22 , H01B5/00 , H01B13/00 , H05K1/09 , H05K1/092 , H05K2201/0203
摘要： A silver particle synthesizing method includes reducing a dispersant from first silver particles each covered with the dispersant to obtain second silver particles. The method further includes synthesizing third silver particles each having a larger particle diameter than the second silver particles by causing a reaction between a silver compound and a reductant in a liquid phase containing the second silver particles.
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公开(公告)号：US09615463B2
公开(公告)日：2017-04-04
申请号：US11857871
申请日：2007-09-19
申请人： Oscar Khaselev , Nitin Desai , Michael T. Marczi , Bawa Singh
发明人： Oscar Khaselev , Nitin Desai , Michael T. Marczi , Bawa Singh
CPC分类号： H05K3/125 , H05K1/09 , H05K3/0011 , H05K3/1258 , H05K3/22 , H05K3/245 , H05K2201/0203 , H05K2201/0224 , H05K2201/09909 , H05K2203/013 , H05K2203/0568 , H05K2203/0769 , H05K2203/1131 , H05K2203/1476 , Y10T29/49155
摘要： Conductive patterns and methods of using and printing such conductive patterns are disclosed. In certain examples, the conductive patterns may be produced by disposing a conductive material between supports on a substrate. The supports may be removed to provide conductive patterns having a desired length and/or geometry.
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公开(公告)号：US20160381801A1
公开(公告)日：2016-12-29
申请号：US15112872
申请日：2015-01-13
发明人： Kenichi SARUYAMA , Yasushi AKUTSU
CPC分类号： H05K1/181 , C09J5/00 , C09J9/02 , C09J11/04 , C09J201/00 , C09J2203/326 , H01L2224/81203 , H01L2224/83101 , H01R4/04 , H05K3/323 , H05K2201/0203
摘要： Ensure conduction between an electronic component and a circuit substrate having reduced pitches in wiring of the circuit substrate or electrodes of the electronic component and prevent short circuits between electrode terminals of the electronic component. A connection body has an electronic component connected to a circuit substrate via an anisotropic conductive adhesive agent; the anisotropic conductive adhesive agent contains a binder resin layer in which conductive particles are regularly arranged; an inter-particle distance among the conductive particles in a space between connection electrodes formed on the electronic component being greater than the inter-particle distance among the conductive particles trapped between the connection electrodes and substrate electrodes formed on the circuit substrate.
摘要翻译： 确保电子部件与电路基板的布线中的间距减小的电路基板与电子部件的电极之间的导通，并防止电子部件的电极端子之间的短路。 连接体具有通过各向异性导电粘合剂连接到电路基板的电子部件; 各向异性导电粘合剂含有导电性粒子规则排列的粘合剂树脂层; 形成在电子部件上的连接电极之间的空间中的导电粒子之间的粒子间距离大于截留在形成于电路基板上的连接电极和基板电极之间的导电粒子之间的粒子间距离。
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10.发明申请公开(公告)号：US20160007477A1
公开(公告)日：2016-01-07
申请号：US14769574
申请日：2014-03-06
申请人： DIS CORPORATION
发明人： Sunao Yoshihara , Haruhiko Katsuta , Yoshinori Katayama , Jun Shirakami , Akira Murakawa , Wataru Fujikawa , Yukie Saitou
CPC分类号： H05K3/188 , C25D5/02 , C25D5/56 , C25D7/00 , H05K1/0313 , H05K1/097 , H05K3/12 , H05K3/207 , H05K3/246 , H05K2201/0203 , H05K2201/0224 , H05K2201/0257 , H05K2201/09218 , H05K2203/0108 , H05K2203/097
摘要： There is provided a method for forming an electrically conductive ultrafine pattern which has an excellent pattern cross-sectional shape is provided by a composite technique including a printing process and a plating process, and furthermore, by imparting excellent adhesion to each interface of a laminate including a plating core pattern, an electrically conductive ultrafine pattern which can be preferably used as a highly accurate electric circuit and a method for manufacturing the same are also provided. The method includes (1) a step of applying a resin composition to form a receiving layer on a substrate; (2) a step of printing an ink containing plating core particles by a reverse offset printing method to form a plating core pattern on the receiving layer; and (3) a step of depositing a metal on the plating core pattern formed in the step (2) by an electrolytic plating method.
摘要翻译： 提供了一种形成导电超细纹图案的方法，其具有优异的图案横截面形状，其通过包括印刷工艺和电镀工艺的复合技术提供，此外，通过赋予层压体的每个界面优异的粘附性，包括 还提供了电镀芯图案，可优选用作高精度电路的导电超细图案及其制造方法。 该方法包括（1）在基板上涂布树脂组合物以形成接收层的步骤; （2）通过反胶印方法印刷含有电镀芯颗粒的油墨的步骤，以在接收层上形成电镀芯图案; 和（3）通过电解电镀法在步骤（2）中形成的镀覆芯图案上沉积金属的步骤。
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