公开(公告)号：US20240215165A1

公开(公告)日：2024-06-27

申请号：US18200224

申请日：2023-05-22

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Myong Keun Jung ,  Hyun Woo Kwon

IPC: H05K1/11 ,  H05K1/02 ,  H05K3/46

CPC classification number: H05K1/115 ,  H05K1/0298 ,  H05K3/4652 ,  H05K2201/09563

Abstract: A printed circuit board includes: a first board unit including a first insulating layer having a first via hole, a first wiring layer disposed on or in the first insulating layer, and a first via including a first metal layer substantially filling the first via hole; and a second board unit including a second insulating layer having a second via hole, a second wiring layer disposed on or in the second insulating layer, and a second via including a second metal layer substantially filling the second via hole. The second board unit is disposed on the first board unit, the second wiring layer has a higher wiring density than that of the first wiring layer, and the second metal layer has a plating structure different from that of the first metal layer.

公开(公告)号：US11856701B2

公开(公告)日：2023-12-26

申请号：US17673405

申请日：2022-02-16

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Hyun Woo Kwon ,  Ki Ran Park ,  Kyeong Yub Jung ,  Jin Uk Lee ,  Jae Heun Lee

IPC: H05K1/18 ,  H05K3/46 ,  H05K1/11

CPC classification number: H05K1/185 ,  H05K1/112 ,  H05K1/183 ,  H05K3/4697

Abstract: A printed circuit board includes: a first insulating layer including a first cavity and a second cavity; a first electronic component disposed in the first cavity and including a first pad disposed in a first surface direction of the first insulating layer; a second electronic component disposed in the second cavity and including a second pad disposed in a second surface direction, facing the first surface direction, of the first insulating layer; a second insulating layer disposed on each of first and second surfaces of the first insulating layer and in the first cavity to cover the first electronic component; and a third insulating layer disposed on the first surface of the first insulating layer and in the second cavity to cover the second electronic component.