公开(公告)号：US20140027047A1

公开(公告)日：2014-01-30

申请号：US14042616

申请日：2013-09-30

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jae Joon LEE ,  Jin Yong Ahn ,  Suk Hyeon Cho ,  Ki Hwan Kim ,  Seok Kyu Lee

IPC: H05K3/00

CPC classification number: H05K3/007 ,  B32B3/10 ,  B32B3/14 ,  B32B3/18 ,  B32B7/04 ,  B32B15/00 ,  B32B15/043 ,  B32B15/08 ,  B32B15/20 ,  B32B27/08 ,  B32B2457/08 ,  H05K3/0097 ,  H05K3/205 ,  H05K2201/0355 ,  Y10T156/10 ,  Y10T156/1052 ,  Y10T428/12 ,  Y10T428/12229 ,  Y10T428/12264 ,  Y10T428/12271 ,  Y10T428/161 ,  Y10T428/19 ,  Y10T428/192 ,  Y10T428/239 ,  Y10T428/24917

Abstract: Disclosed is a carrier for manufacturing a printed circuit board, which includes a first carrier including a first binder having a first opening and a first metal layer formed in the first opening of the first binder, and a second carrier, stacked with the first carrier and including a second binder having a second opening and a second metal layer which is formed in the second opening of the second binder and which partially overlaps with the first metal layer, so that the carrier is simply configured and the binders are formed not only on the lateral surfaces of the metal layers but also on the upper surfaces thereof, thus improving the reliability of bonding of the carrier at the periphery. A method of manufacturing the carrier and a method of manufacturing a printed circuit board using the carrier are also provided.

Abstract translation: 公开了一种用于制造印刷电路板的载体，其包括第一载体，其包括具有第一开口的第一粘合剂和形成在第一粘合剂的第一开口中的第一金属层，以及与第一载体堆叠的第二载体， 包括具有第二开口的第二粘合剂和形成在第二粘合剂的第二开口中并且与第一金属层部分重叠的第二金属层，使得载体被简单地构造，并且粘结剂不仅形成在 金属层的侧面，也在其上表面，从而提高载体在周边的接合的可靠性。 还提供了制造载体的方法和使用该载体制造印刷电路板的方法。

公开(公告)号：US20230170143A1

公开(公告)日：2023-06-01

申请号：US17693813

申请日：2022-03-14

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Je Jung KIM ,  Ji Won LEE ,  Ye Jin JEONG ,  Jae Joon LEE

IPC: H01G4/12 ,  H01G4/30 ,  H01G4/248 ,  H01G4/232

CPC classification number: H01G4/12 ,  H01G4/30 ,  H01G4/248 ,  H01G4/232

Abstract: A multilayer ceramic capacitor includes a body including a dielectric layer and first and second internal electrodes alternately disposed with the dielectric layer interposed therebetween, a first external electrode disposed on the body and connected to the first internal electrode, and a second external electrode disposed on the body and connected to the second internal electrode. The dielectric layer includes a first dielectric layer adjacent to the first internal electrode, a second dielectric layer adjacent to the second internal electrode, and a third dielectric layer disposed between the first and second dielectric layers. D1

公开(公告)号：US20170094786A1

公开(公告)日：2017-03-30

申请号：US15052222

申请日：2016-02-24

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Yu Hong OH ,  Ye Jun PARK ,  Jun Hyeon KIM ,  Jung Wook SEO ,  Young Joon OH ,  Jae Joon LEE ,  Byung Kun KIM

IPC: H05K1/02 ,  H05K1/03 ,  H05K3/00 ,  H05K1/11

CPC classification number: H05K1/0298 ,  H05K1/0373 ,  H05K1/111 ,  H05K3/0014 ,  H05K3/381 ,  H05K3/4676 ,  H05K2201/0209

Abstract: A printed circuit board according to the present invention includes at least one insulating layer and an interconnection. The insulating layer includes a first depression at an interface with the interconnection, and a second depression at a surface of the first depression.

公开(公告)号：US20150179340A1

公开(公告)日：2015-06-25

申请号：US14642229

申请日：2015-03-09

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Kang Heon HUR ,  Byung Gyun KIM ,  Sang Hoon KWON ,  Doo Young KIM ,  Hyun Tae KIM ,  Mi Young KIM ,  Eun Sang NA ,  Jae Joon LEE

IPC: H01G4/008 ,  H01G4/30 ,  H01G4/12 ,  H01G4/012

CPC classification number: H01G4/008 ,  H01G4/012 ,  H01G4/12 ,  H01G4/30 ,  H01G13/00 ,  Y10T29/43

Abstract: There is provided a multilayer ceramic capacitor including: a capacitor main body formed by alternately stacking an internal electrode including an internal electrode-forming material and a dielectric layer; and an external electrode formed on the external surface of the capacitor to be electrically connected to the internal electrode and having an external electrode-forming material, wherein the internal electrode includes a non-diffusion layer including the external electrode-forming material of 2 vol % to 20 vol % and a diffusion layer made of the external electrode-forming material on at least one of the both ends of the non-diffusion layer. The multilayer ceramic capacitor capable of preventing cracking due to the diffusion of electrode materials while stably securing capacitance and the method of fabricating the same can be provided.

Abstract translation: 提供了一种多层陶瓷电容器，包括：电容器主体，其通过交替堆叠包括内部电极形成材料和电介质层的内部电极而形成; 以及形成在所述电容器的外表面上以与内部电极电连接并具有外部电极形成材料的外部电极，其中所述内部电极包括包含2体积％的所述外部电极形成材料的非扩散层， 至20体积％以及由非扩散层的两端中的至少一方形成的外部电极形成材料的扩散层。 可以提供能够防止电极材料的扩散同时稳定地保持电容的开裂的多层陶瓷电容器及其制造方法。