Multilayer ceramic capacitor
    1.
    发明授权

    公开(公告)号:US11410815B2

    公开(公告)日:2022-08-09

    申请号:US16817783

    申请日:2020-03-13

    摘要: A multilayer ceramic capacitor includes a body including a dielectric layer and first and second internal electrodes disposed with the dielectric layer interposed therebetween; first and second through electrodes penetrating the body, connected to the first and second internal electrodes, respectively, and including nickel; first and second external electrodes, and connected to the first through electrode; and third and fourth external electrodes spaced apart from the first and second external electrodes, and connected to the second through electrode. Each of the first to fourth external electrodes includes a sintered electrode including nickel, and a first plating layer and a second plating layer stacked on the sintered electrode in order.

    Capacitor component
    2.
    发明授权

    公开(公告)号:US11217393B2

    公开(公告)日:2022-01-04

    申请号:US16549292

    申请日:2019-08-23

    摘要: A capacitor component includes a body including a dielectric layer and first and second internal electrodes disposed to face each other in a first direction while having the dielectric layer interposed therebetween, and including first and second surfaces, third and fourth surfaces, and fifth and sixth surfaces; first and second margin portions disposed on the fifth and sixth surfaces, respectively; first and second connection parts disposed on the third and fourth surfaces, respectively, and including metal layers connected to the first internal electrode and ceramic layers disposed on the metal layers; a connection electrode penetrating through the body and connected to the second internal electrode; a first external electrode disposed on one surface of the first connection part; a second external electrode disposed on one surface of the second connection part in the first direction; and a third external electrode disposed on the body and connected to the connection electrode.

    Multilayer ceramic electronic part to be embedded in board and printed circuit board having multilayer ceramic electronic part embedded therein
    5.
    发明授权
    Multilayer ceramic electronic part to be embedded in board and printed circuit board having multilayer ceramic electronic part embedded therein 有权
    要嵌入板中的多层陶瓷电子部件和嵌入其中的多层陶瓷电子部件的印刷电路板

    公开(公告)号:US09390852B2

    公开(公告)日:2016-07-12

    申请号:US14174591

    申请日:2014-02-06

    摘要: There is provided a multilayer ceramic electronic part to be embedded in a board, the multilayer ceramic electronic part including: a ceramic body including dielectric layers; first and second internal electrodes disposed in the ceramic body; first and second external electrodes formed on the respective end portions of the ceramic body, and a third external electrode formed on first and second main surfaces of the ceramic body, wherein an outermost first internal electrode among the first internal electrodes is connected to the first and second external electrodes through at least one first via, and the second internal electrodes are connected to the third external electrode through at least one second via.

    摘要翻译: 提供了一种要嵌入板中的多层陶瓷电子部件,所述多层陶瓷电子部件包括:陶瓷体,包括电介质层; 布置在陶瓷体中的第一和第二内部电极; 形成在陶瓷体的各个端部的第一外部电极和第二外部电极,以及形成在陶瓷体的第一和第二主表面上的第三外部电极,其中,第一内部电极中的最外部第一内部电极连接到第一内部电极, 通过至少一个第一通孔的第二外部电极,并且所述第二内部电极通过至少一个第二通孔连接到所述第三外部电极。

    Multilayer ceramic capacitor
    6.
    发明授权

    公开(公告)号:US11657979B2

    公开(公告)日:2023-05-23

    申请号:US17698415

    申请日:2022-03-18

    摘要: A multilayer ceramic capacitor includes a body including a dielectric layer and first and second internal electrodes disposed with the dielectric layer interposed therebetween and disposed in point-symmetry with each other; first and second connection electrodes penetrating the body in a direction perpendicular to the dielectric layer and connected to the first internal electrode; third and fourth connection electrodes penetrating the body in a direction perpendicular to the dielectric layer and connected to the second internal electrode; first and second external electrodes disposed on both surfaces of the body and connected to the first and second connection electrodes; and third and fourth external electrodes spaced apart from the first and second external electrodes and connected to the third and fourth connection electrodes, and the first and second internal electrodes include a region in which an electrode is not disposed.

    Multilayer ceramic capacitor
    7.
    发明授权

    公开(公告)号:US11282648B2

    公开(公告)日:2022-03-22

    申请号:US16808674

    申请日:2020-03-04

    摘要: A multilayer ceramic capacitor includes a body including dielectric layers and first and second internal electrodes disposed with respective dielectric layers interposed therebetween to be point-symmetrical to each other, first and second connection electrodes penetrating through the body in a direction perpendicular to the dielectric layer, and connected to the first internal electrode, third and fourth connection electrodes penetrating through the body in the direction perpendicular to the dielectric layer, and connected to the second internal electrode, first and second external electrodes disposed on both external surfaces of the body and connected to the first and second connection electrodes, and third and fourth external electrodes spaced apart from the first and second external electrodes and connected to the third and fourth connection electrodes. Each of the first and second internal electrodes includes an electrode-unformed region.

    Multilayer ceramic electronic component

    公开(公告)号:US10957488B2

    公开(公告)日:2021-03-23

    申请号:US16170499

    申请日:2018-10-25

    摘要: A multilayer ceramic electronic component includes: a ceramic body and first and second external electrodes on external surfaces of the ceramic body. The ceramic body includes first and second internal electrodes facing each other with dielectric layers interposed therebetween. The ceramic body includes an active portion in which capacitance is formed and cover portions on upper and lower surfaces of the active portion, respectively. The ratio of the thickness of the first and second external electrodes to the thickness of the cover portion is proportional to the inverse of the cube root of the ratio of the Young's Modulus of each of the first and second external electrodes to the Young's modulus of the cover portion.

    MULTILAYER CERAMIC CAPACITOR
    9.
    发明申请

    公开(公告)号:US20210057159A1

    公开(公告)日:2021-02-25

    申请号:US16812900

    申请日:2020-03-09

    摘要: A multilayer ceramic capacitor includes a body including a dielectric layer and first and second internal electrodes disposed with the dielectric layer interposed therebetween; first and second connection electrodes penetrating the body in a direction perpendicular to the dielectric layer and connected to the first internal electrode; third and fourth connection electrodes penetrating the body in a in a direction perpendicular to the dielectric layer and connected to the second internal electrode; first and second external electrodes disposed on both surfaces of the body, and connected to the first and second connection electrodes; and third and fourth external electrodes connected to the third and fourth connection electrodes, and at least a portion of the first and second connection electrodes is exposed to the surface of the body.

    Multilayer ceramic electronic component

    公开(公告)号:US10784047B2

    公开(公告)日:2020-09-22

    申请号:US16198473

    申请日:2018-11-21

    摘要: A multilayer ceramic electronic component includes a ceramic body including a dielectric layer, and a first internal electrode and a second internal electrode facing each other with the dielectric layer interposed therebetween, and a first external electrode electrically connected to the first internal electrode, and a second external electrode electrically connected to the second internal electrode, disposed in an outer portion of the ceramic body, the first and second external electrodes comprise a first electrode layer including a conductive metal, a first plating layer disposed on the first electrode layer and including nickel (Ni), and a second plating layer disposed on the first plating layer and including tin (Sn), and a ratio (t1/t2) is within a range from 1.0 to 9.0, where t1 is a thickness of the first plating layer including nickel (Ni), and t2 is a thickness of the second plating layer including tin (Sn).