公开(公告)号：US11936969B2

公开(公告)日：2024-03-19

申请号：US17752262

申请日：2022-05-24

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Se Yeon Hwang ,  Hyun Sang Kwak ,  Yeo Ok Jeon ,  Joon Woo Gi ,  Seok Hwan Kim

IPC: H04N23/54 ,  H04N23/57 ,  H05K1/18

CPC classification number: H04N23/54 ,  H04N23/57 ,  H05K1/181 ,  H05K2201/05 ,  H05K2201/10151

Abstract: A camera module includes: a first substrate on which an image sensor configured to convert an optical signal incident through a lens module into an electrical signal is disposed and a first connection terminal is disposed; a second substrate spaced apart from the first substrate and including a second connection terminal formed in a position facing the first connection terminal; and a terminal connector electrically connecting the first connection terminal and the second connection terminal to each other and configured to maintain a preset distance between the first substrate and the second substrate. In the camera module, the terminal connector includes: a connecting member including a first connection portion, a second connection portion, and a deformable portion; and a support member configured to maintain the preset distance between the first substrate and the second substrate.

公开(公告)号：US12295264B2

公开(公告)日：2025-05-06

申请号：US17741352

申请日：2022-05-10

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Sung Han Kim ,  Se Yeon Hwang ,  Joon Woo Gi ,  Jong Ho Chung ,  Han Kim

IPC: H10N10/17 ,  H10N10/01 ,  H10N10/855

Abstract: A thermoelectric module includes a stack structure of a plurality of insulating layers, a plurality of thermoelectric elements formed with the insulating layer interposed therebetween and including a first-type semiconductor device, a second-type semiconductor device, a first electrode connected to the first-type semiconductor device, a second electrode connected to the second-type semiconductor device, and a connection electrode connecting the first-type and second-type semiconductor devices, and a conductive via penetrating through the insulating layer to connect thermoelectric elements adjacent to each other, among the plurality of thermoelectric elements.