公开(公告)号：US20130243941A1

公开(公告)日：2013-09-19

申请号：US13889064

申请日：2013-05-07

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Seok Kyu LEE ,  Soon Oh Jung ,  Jong Kuk Hong ,  Soon Jin Cho

IPC: H05K3/00

CPC classification number: H05K3/00 ,  H05K1/113 ,  H05K3/0052 ,  H05K3/007 ,  H05K3/4007 ,  H05K3/426 ,  H05K3/4682 ,  H05K2201/0367 ,  H05K2201/09563 ,  H05K2201/096 ,  H05K2203/0156 ,  H05K2203/054 ,  H05K2203/1572

Abstract: A method of manufacturing a coreless substrate having filled via pads, including: forming a first insulating layer on one side of a carrier forming a build-up layer including a build-up insulating layer and a build-up circuit layer having a build-up via on the first insulating layer, and forming a second insulating layer on the build-up layer; removing the carrier, and forming via-holes in the first and second insulating layers; and conducting a filled plating process in the via-holes of the first and second insulating layers thus forming first and second filled via pads therein.

Abstract translation: 一种制造具有填充通孔焊盘的无芯基板的方法，包括：在载体的一侧上形成第一绝缘层，形成包含积聚绝缘层的堆积层和具有堆积层的积聚电路层 通过所述第一绝缘层，并且在所述积层上形成第二绝缘层; 移除所述载体，以及在所述第一和第二绝缘层中形成通孔; 并且在第一和第二绝缘层的通孔中进行填充电镀处理，从而在其中形成第一和第二填充的通孔焊盘。