公开(公告)号：US20140347834A1

公开(公告)日：2014-11-27

申请号：US14285882

申请日：2014-05-23

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Seok Kyu LEE ,  Takayuki HAZE ,  Soon Jin CHO

IPC: H05K1/18 ,  H05K1/03 ,  H05K3/30 ,  H05K1/02

CPC classification number: H05K1/185 ,  H01L21/568 ,  H01L24/19 ,  H01L2224/04105 ,  H05K3/007 ,  H05K3/305 ,  H05K3/4602 ,  H05K2201/0187 ,  H05K2201/10015 ,  H05K2201/10537 ,  H05K2201/10636 ,  H05K2201/10727 ,  Y02P70/611 ,  Y10T29/4913

Abstract: An electronic component embedded printed circuit board and a method for manufacturing the same. The printed circuit board includes: a core having a cavity formed therein; an electronic component unit embedded in the cavity, including a plurality of electronic components, and having a coating layer formed on an outer peripheral surface of the electronic component unit to fix the plurality of electronic components; and an insulating layer laminated at least on the top of the core. An outer layer circuit pattern may be formed on the insulating layer.

Abstract translation: 一种电子元件嵌入式印刷电路板及其制造方法。 印刷电路板包括：形成有腔的芯; 嵌入在所述空腔中的电子部件单元，包括多个电子部件，并且具有形成在所述电子部件单元的外周面上的被覆层，以固定所述多个电子部件; 以及至少层叠在芯的顶部上的绝缘层。 可以在绝缘层上形成外层电路图案。

公开(公告)号：US20160212856A1

公开(公告)日：2016-07-21

申请号：US15081108

申请日：2016-03-25

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Hong Won KIM ,  Seok Kyu LEE ,  Tae Gon LEE ,  Byung Hak KANG ,  Jung Soo BYUN ,  Yeon Seop YU ,  Sang Mi YOON

IPC: H05K1/18 ,  H05K1/02 ,  H05K1/11

CPC classification number: H05K1/185 ,  H05K1/0298 ,  H05K1/0373 ,  H05K1/115 ,  H05K3/0017 ,  H05K3/4602 ,  H05K2203/0156 ,  H05K2203/1469 ,  H05K2203/1476 ,  Y10T29/4913

Abstract: Disclosed herein are a method for manufacturing an electronic component embedding substrate and an electronic component embedding substrate. The method for manufacturing an electronic component embedding substrate includes: inserting an electronic component into a cavity formed in a core substrate; stacking a first insulating layer on one side of the core substrate into which the electronic component is inserted; performing surface treatment on the other side of the core substrate opposite to a direction in which the first insulating layer is stacked to improve a surface roughness of at least an exposed surface of the first insulating layer; and stacking a second insulating layer on the other side of the core substrate so as to be bonded to the exposed surface of the first insulating layer of which the surface roughness is improved. In addition, disclosed herein is the electronic component embedding substrate.

公开(公告)号：US20130243995A1

公开(公告)日：2013-09-19

申请号：US13888241

申请日：2013-05-06

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jin Ho KIM ,  Jin Yong AHN ,  Ki Hwan KIM ,  Byung Moon KIM ,  Seok Kyu LEE

IPC: H05K13/04

CPC classification number: H05K13/04 ,  B32B2457/08 ,  H05K3/0097 ,  H05K3/4682 ,  H05K2203/1536 ,  H05K2203/1572 ,  Y10T156/1043 ,  Y10T156/1142 ,  Y10T428/2804

Abstract: Disclosed herein is a carrier for manufacturing a substrate, including: a base plate; adhesive layers formed on one side or both sides of the base plate; auxiliary adhesive layers, each of which is buried in one side of each of the adhesive layers, has a smaller area than each of the adhesive layers and has lower adhesivity than each of the adhesive layers; and metal layers, each of which is formed on one side of each of the auxiliary adhesive layers, whose edges are attached to the adhesive layers, and whose other portions excluding the edges are attached to the auxiliary adhesive layers. The carrier is advantageous in that a metal layer and an auxiliary adhesive layer are attached to each other by the adhesivity of the auxiliary adhesive layer, so that it is not required to use vacuum adsorption, with the result that a process of manufacturing a substrate can be performed more stably.

Abstract translation: 本文公开了一种用于制造基板的载体，包括：基板; 形成在基板的一侧或两侧的粘合剂层; 每个粘合剂层的一侧的辅助粘合剂层具有比每个粘合剂层更小的面积，并且具有比每个粘合剂层更低的粘附性; 以及金属层，其各自形成在每个辅助粘合剂层的一侧上，其边缘附着到粘合剂层，并且除了边缘之外的其它部分附着到辅助粘合剂层。 载体的优点在于，金属层和辅助粘合剂层通过辅助粘合剂层的粘合性彼此附接，使得不需要使用真空吸附，结果是制造基材的工艺可以 更稳定地进行。

公开(公告)号：US20140186581A1

公开(公告)日：2014-07-03

申请号：US14140398

申请日：2013-12-24

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Seok Kyu LEE ,  Takayuki HAZE ,  Soon Jin CHO

IPC: H05K1/05 ,  H05K3/00

CPC classification number: H05K3/381 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/73267 ,  H01L2924/3511 ,  H05K1/185 ,  H05K3/022 ,  H05K3/4655 ,  Y10T428/24355

Abstract: Disclosed herein are a primer-coated copper foil and a method for producing the same. The primer-coated copper foil includes a copper foil layer; and a primer resin layer having a first surface on which the copper foil layer is coated and a second surface as a counter side on which a roughness is formed, so that the primer-coated copper foil can exhibit excellent adhesive strength.

Abstract translation: 本文公开了底漆涂覆铜箔及其制备方法。 底漆涂布铜箔包括铜箔层; 以及具有涂布有铜箔层的第一表面和形成有粗糙度的对置面的第二表面的底漆树脂层，使得底漆涂布的铜箔可以表现出优异的粘合强度。

公开(公告)号：US20130243941A1

公开(公告)日：2013-09-19

申请号：US13889064

申请日：2013-05-07

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Seok Kyu LEE ,  Soon Oh Jung ,  Jong Kuk Hong ,  Soon Jin Cho

IPC: H05K3/00

CPC classification number: H05K3/00 ,  H05K1/113 ,  H05K3/0052 ,  H05K3/007 ,  H05K3/4007 ,  H05K3/426 ,  H05K3/4682 ,  H05K2201/0367 ,  H05K2201/09563 ,  H05K2201/096 ,  H05K2203/0156 ,  H05K2203/054 ,  H05K2203/1572

Abstract: A method of manufacturing a coreless substrate having filled via pads, including: forming a first insulating layer on one side of a carrier forming a build-up layer including a build-up insulating layer and a build-up circuit layer having a build-up via on the first insulating layer, and forming a second insulating layer on the build-up layer; removing the carrier, and forming via-holes in the first and second insulating layers; and conducting a filled plating process in the via-holes of the first and second insulating layers thus forming first and second filled via pads therein.

Abstract translation: 一种制造具有填充通孔焊盘的无芯基板的方法，包括：在载体的一侧上形成第一绝缘层，形成包含积聚绝缘层的堆积层和具有堆积层的积聚电路层 通过所述第一绝缘层，并且在所述积层上形成第二绝缘层; 移除所述载体，以及在所述第一和第二绝缘层中形成通孔; 并且在第一和第二绝缘层的通孔中进行填充电镀处理，从而在其中形成第一和第二填充的通孔焊盘。