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公开(公告)号：US09437363B2
公开(公告)日：2016-09-06
申请号：US14321059
申请日：2014-07-01
发明人： Woon Chul Choi , Sung Hyun Kim , Hye Yeon Cha
CPC分类号： H01F27/2804 , H01F17/0013 , H01F27/292 , H01F41/042
摘要： An inductor may include: a body, and a first and a second external electrode formed on end surfaces of the body. The body may include a coil support layer, a conductive coil formed on at least one surface of the coil support layer, a lamination part formed in a gap of the conductive coil and on an upper surface thereof, an insulating coating part formed to enclose an overall surface of the conductive coil on which the lamination part is formed, and upper and lower cover layers covering the overall surface of the conductive coil on which the insulating coating part is formed.
摘要翻译： 电感器可以包括：主体，以及形成在主体的端表面上的第一和第二外部电极。 主体可以包括线圈支撑层，形成在线圈支撑层的至少一个表面上的导电线圈，形成在导电线圈的间隙中并在其上表面上的层叠部分，形成为封闭 形成有层叠部的导电线圈的整个表面，以及覆盖形成有绝缘涂层部的导电线圈的整个表面的上下覆盖层。
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公开(公告)号：US09318234B2
公开(公告)日：2016-04-19
申请号：US14013568
申请日：2013-08-29
发明人： Chung Hee Lee , Jae Choon Cho , Jong Yoon Jang , Hee Sun Chun , Jong Su Park , Sung Hyun Kim
CPC分类号： H01B3/002 , H01B3/40 , H01B17/60 , H01B19/04 , H05K1/036 , H05K1/0366 , H05K1/0373 , H05K2201/0209 , Y10T428/265 , Y10T428/31511
摘要： Disclosed herein are an insulating film and a producing method of the insulating film which can address problems caused by dents by providing a reinforcing layer having the weight ratio of the silica of 60 to 80 wt % on one surface of the insulating film.
摘要翻译： 这里公开了绝缘膜和绝缘膜的制造方法，其可以通过在绝缘膜的一个表面上设置二氧化硅重量比为60〜80重量％的增强层来解决由凹痕引起的问题。
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公开(公告)号：US10332670B2
公开(公告)日：2019-06-25
申请号：US15728161
申请日：2017-10-09
发明人： Woon Chul Choi , Sung Hyun Kim , Hye Yeon Cha
摘要： An inductor may include: a body, and a first and a second external electrode formed on end surfaces of the body. The body may include a coil support layer, a conductive coil formed on at least one surface of the coil support layer, a lamination part formed in a gap of the conductive coil and on an upper surface thereof, an insulating coating part formed to enclose an overall surface of the conductive coil on which the lamination part is formed, and upper and lower cover layers covering the overall surface of the conductive coil on which the insulating coating part is formed.
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公开(公告)号：US09773611B2
公开(公告)日：2017-09-26
申请号：US14516151
申请日：2014-10-16
发明人： Sung Hyun Kim , Myoung Soon Park , Sung Hee Kim , Tae Young Kim , Hye Yeon Cha
CPC分类号： H01F41/12 , H01F17/0013 , H01F2017/0066 , H01F2017/048
摘要： A chip electronic component may include: a magnetic body having a coil conductive pattern part embedded therein; and an oxide insulating film formed on a surface of the coil conductive pattern part. Even in the case that the insulating film is formed to be thinner than an insulating film, it may prevent the coil conductive pattern part from being exposed, whereby a magnetic material and the coil conductive pattern part may not contact each other. Therefore, a waveform defect may be prevented at a high frequency.
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公开(公告)号：US10014102B2
公开(公告)日：2018-07-03
申请号：US15221968
申请日：2016-07-28
发明人： Woon Chul Choi , Sung Hyun Kim , Hye Yeon Cha
CPC分类号： H01F27/2804 , H01F17/0013 , H01F27/292 , H01F41/042
摘要： An inductor may include: a body, and a first and a second external electrode formed on end surfaces of the body. The body may include a coil support layer, a conductive coil formed on at least one surface of the coil support layer, a lamination part formed in a gap of the conductive coil and on an upper surface thereof, an insulating coating part formed to enclose an overall surface of the conductive coil on which the lamination part is formed, and upper and lower cover layers covering the overall surface of the conductive coil on which the insulating coating part is formed.
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公开(公告)号：US20150155093A1
公开(公告)日：2015-06-04
申请号：US14475000
申请日：2014-09-02
发明人： Sung Hee KIM , Tae Young Kim , Myoung Soon Park , Sung Hyun Kim , Hye Yeon Cha
CPC分类号： H01F27/327 , H01F17/0013 , H01F17/04 , H01F27/292 , H01F41/042 , H01F41/046 , H01F41/127 , H01F2017/048
摘要： The present application provides a chip electronic component and a manufacturing method thereof. More particularly, there is provided a chip electronic component including a thin insulating film having a reduced width and extended up to a lower portion of a coil pattern without exposing the coil pattern such that the coil pattern has no direct contact with a magnetic material, thereby preventing a poor waveform at high frequency and increasing inductance.
摘要翻译： 本申请提供了一种芯片电子部件及其制造方法。 更具体地，提供了一种芯片电子部件，其包括具有减小的宽度的薄绝缘膜，并且延伸到线圈图案的下部，而不暴露线圈图案，使得线圈图案不与磁性材料直接接触，由此 防止高频波形较差，增加电感。
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7.发明申请EPOXY RESIN COMPOSITION FOR BUILD-UP INSULATING FILM, INSULATING FILM FORMED THEREFROM, AND MULTILAYER PRINTED CIRCUIT BOARD HAVING THE SAME 审中-公开用于建立绝缘膜的环氧树脂组合物，其形成的膜的绝缘膜，以及具有该膜的多层印刷电路板公开(公告)号：US20140014402A1
公开(公告)日：2014-01-16
申请号：US13939743
申请日：2013-07-11
发明人： Jae Choon Cho , Jong Yoon Jang , Chung Hee Lee , Hee Sun Chun , Sung Hyun Kim , Choon Keun Lee
CPC分类号： H01B3/40 , H01L24/19 , H01L2224/04105 , H01L2224/12105 , H05K1/0326 , H05K1/0373 , H05K1/162 , H05K1/165 , H05K1/185 , H05K3/4676
摘要： This invention relates to an epoxy resin composition, an insulating film formed therefrom, and a printed circuit board, and more particularly to an epoxy resin composition including an epoxy resin, an acid anhydride curing agent, etc., which exhibits improved dielectric properties by decreasing permittivity, dielectric tangent, etc. in a build-up type multilayer printed circuit board, and to an insulating film manufactured using the epoxy resin composition, and to a multilayer printed circuit board in which inner circuits formed of copper (Cu) are insulated by virtue of the insulating film to thus form multiple layers.
摘要翻译： 本发明涉及环氧树脂组合物，由其形成的绝缘膜和印刷电路板，更具体地说，涉及包含环氧树脂，酸酐固化剂等的环氧树脂组合物，其通过减少显示出改进的介电性能 积层型多层印刷电路板中的介电常数，介电切线等，以及使用该环氧树脂组合物制造的绝缘膜，以及由铜（Cu）形成的内部电路被绝缘的多层印刷电路板 绝缘膜的优点因此形成多层。
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公开(公告)号：US10811358B2
公开(公告)日：2020-10-20
申请号：US16513171
申请日：2019-07-16
发明人： Job Ha , Sung Hyun Kim , Ji Na Jeung
IPC分类号： H01L23/538 , H01L23/00 , H01L23/14 , H01L23/15
摘要： A semiconductor package includes an organic frame having first and second surfaces opposing each other, having a cavity, and having a wiring structure connecting the first and second surfaces, a connection structure disposed on the first surface of the organic frame and having a first redistribution layer connected to the wiring structure, at least one inorganic interposer having first and second surfaces, and having an interconnection wiring connecting the first and second surfaces of the at least one inorganic interposer to each other, an encapsulant encapsulating at least a portion of the at least one inorganic interposer, an insulating layer disposed on the second surface of the organic frame and the second surface of the at least one inorganic interposer, a second redistribution layer having portions provided as a plurality of pads, and at least one semiconductor chip having connection electrodes respectively connected to the plurality of pads.
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公开(公告)号：US09899143B2
公开(公告)日：2018-02-20
申请号：US15339622
申请日：2016-10-31
发明人： Sung Hee Kim , Tae Young Kim , Myoung Soon Park , Sung Hyun Kim , Hye Yeon Cha
IPC分类号： H01F5/00 , H01F27/28 , H01F27/32 , H01F17/00 , H01F27/29 , H01F41/04 , H01F41/12 , H01F17/04
CPC分类号： H01F27/327 , H01F17/0013 , H01F17/04 , H01F27/292 , H01F41/042 , H01F41/046 , H01F41/127 , H01F2017/048
摘要： The present application provides a chip electronic component and a manufacturing method thereof. More particularly, there is provided a chip electronic component including a thin insulating film having a reduced width and extended up to a lower portion of a coil pattern without exposing the coil pattern such that the coil pattern has no direct contact with a magnetic material, thereby preventing a poor waveform at high frequency and increasing inductance.
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10.发明申请APPARATUS FOR MEASURING DRYING RATE AND METHOD FOR MEASURING DRYING RATE USING THE SAME 审中-公开用于测量干燥速度的装置和使用其测量干燥速率的方法公开(公告)号：US20140041445A1
公开(公告)日：2014-02-13
申请号：US13937595
申请日：2013-07-09
发明人： Hee Sun Chun , Jae Choon Cho , Jong Yoon Jang , Dong Joo Shin , Sung Hyun Kim , Choon Keun Lee
IPC分类号： G01N33/32
CPC分类号： G01N33/32 , G01N21/84 , G01N21/892
摘要： There are provided an apparatus for measuring a drying rate and a method for measuring a drying rate using the same in order to measure the drying rate of a substrate material for manufacturing an electronic apparatus, the apparatus for measuring a drying rate, including a support part having a substrate seated thereon, and a marking part disposed above the substrate while being vertically and horizontally movable, and forming a marking on the substrate while being in contact with the substrate.
摘要翻译： 提供了一种用于测量干燥速度的装置以及用于测量用于制造电子设备的基板材料的干燥速率的方法，用于测量干燥速率的装置，包括支撑部分 具有安装在其上的基板，以及标记部，其设置在所述基板上方，同时能够垂直和水平移动，并且在与所述基板接触的同时在所述基板上形成标记。
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