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    MULTILAYER ELECTRONIC COMPONENT
    1.
    发明公开
    MULTILAYER ELECTRONIC COMPONENT 审中-公开

    公开(公告)号：US20240212933A1

    公开(公告)日：2024-06-27

    申请号：US18527814

    申请日：2023-12-04

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Won Hee YOO ,  Young Hoon SONG ,  Hyun Woo KIM

    IPC: H01G4/012 ,  H01G4/30

    CPC classification number: H01G4/012 ,  H01G4/30

    Abstract: A multilayer electronic component includes a body including two or more unit electrode stacks, each unit electrode stack including a dielectric layer and internal electrodes alternately disposed with the dielectric layer in a first direction, wherein the two or more unit electrode stacks are arranged in a line in the first direction, a width of internal electrodes disposed in an upper portion of each unit electrode stack in the first direction among the internal electrodes and a width of internal electrodes disposed in a lower portion of each unit electrode stack in the first direction among the internal electrodes are smaller than a width of the internal electrodes disposed in a central portion in the first direction.

    ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME
    2.
    发明申请
    ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME 有权

    公开(公告)号：US20220157523A1

    公开(公告)日：2022-05-19

    申请号：US17380343

    申请日：2021-07-20

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Sang Moon LEE ,  Jae Young NA ,  Eun Kwang LEE ,  Won Hee YOO

    IPC: H01G4/008 ,  H01G4/12 ,  H01G4/012 ,  H01G4/30 ,  H01G2/06

    Abstract: An electronic component includes a body including a plurality of dielectric layers, and a plurality of internal electrodes disposed with a corresponding one of the dielectric layers interposed therebetween; and an external electrode disposed on the body and connected to at least one of the plurality of internal electrodes. One of the plurality of internal electrodes includes an alloy metal including nickel, tin and aluminum. One of the plurality of internal electrodes includes a core internal electrode including a first surface and a second surface opposing each other, and a capping internal electrode disposed on the first surface of the core internal electrode and the second surface of the core internal electrode. The capping internal electrode includes a first alloy region including an alloy of nickel and aluminum.

    MULTILAYER CAPACITOR
    5.
    发明公开
    MULTILAYER CAPACITOR 审中-公开

    公开(公告)号：US20230145815A1

    公开(公告)日：2023-05-11

    申请号：US17752249

    申请日：2022-05-24

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Sang Moon LEE ,  Taek Jung LEE ,  Won Hee YOO ,  Seol Gyeong PARK

    IPC: H01G4/232 ,  H01G4/30

    CPC classification number: H01G4/2325 ,  H01G4/30

    Abstract: A multilayer capacitor includes a body including a dielectric layer and a plurality of internal electrodes stacked on each other interposing the dielectric layer therebetween, and external electrodes disposed externally on the body, respectively including a first layer connected to the internal electrode and a second layer covering the first layer, wherein the first layer includes a metal particle including an element A and a Z-A-O phase formed in the metal particle, and here, the element Z is an alkali metal.

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