公开(公告)号：US20200185141A1

公开(公告)日：2020-06-11

申请号：US16567532

申请日：2019-09-11

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Ye Eun JEONG ,  Jin Ho HONG

IPC: H01F27/28 ,  H01F27/29 ,  H01F27/32 ,  H01F41/04

Abstract: A coil electronic component includes a body including a laminate structure including a plurality of coil layers, and external electrodes disposed externally on the body. Each of the plurality of coil layers includes an insulating layer, a base pattern, and a coil pattern disposed on the base pattern, and a conductive via connecting the coil pattern to an adjacent coil layer, and the base pattern includes an intermetallic compound of Cu and Sn, and the coil pattern includes a Cu component.

公开(公告)号：US20160086714A1

公开(公告)日：2016-03-24

申请号：US14686651

申请日：2015-04-14

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Je Ik MOON ,  Sung Soo KIM ,  Tae Young KIM ,  Ye Eun JEONG ,  Jong Hun KIM ,  Seong Min CHIN

IPC: H01F27/255 ,  H01F27/33 ,  H01F27/28

CPC classification number: H01F27/255 ,  H01F17/0013 ,  H01F27/2804 ,  H01F27/292 ,  H01F2017/048 ,  H01F2027/2809

Abstract: There is provided a chip electronic component including: a magnetic body containing magnetic metal powder particles and a thermosetting resin; an internal coil part embedded in the magnetic body; and a surface protection layer with which a surface of the magnetic body is coated. The surface protection layer may prevent a plating spreading phenomenon occurring on a surface of the chip electronic component at the time of forming external electrodes.

Abstract translation: 提供了一种芯片电子部件，包括：包含磁性金属粉末颗粒和热固性树脂的磁体; 嵌入在磁体内的内部线圈部分; 以及涂覆有磁体表面的表面保护层。 表面保护层可以防止在形成外部电极时在芯片电子部件的表面上发生的电镀扩展现象。