公开(公告)号：US20230215663A1

公开(公告)日：2023-07-06

申请号：US17988298

申请日：2022-11-16

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jin Ho HONG ,  Young Seuck YOO ,  Hee Sung CHOI ,  Young June LEE

IPC: H01G9/052 ,  H01G9/025

CPC classification number: H01G9/052 ,  H01G9/025 ,  H01G2009/05

Abstract: A tantalum capacitor includes a tantalum body comprising a tantalum sintered body containing tantalum powder, a conductive polymer layer disposed on the tantalum sintered body and including a first filler as a non-conductive particle, and a tantalum wire. The first filler includes a core including at least one metal oxide among BaTiO3, Al2O3, SiO2 and ZrO2, and a coating film disposed on a surface of the core.

公开(公告)号：US20140080941A1

公开(公告)日：2014-03-20

申请号：US14026134

申请日：2013-09-13

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Sa Yong LEE ,  Jin Young KIM ,  Jin Ho HONG ,  Keun Yong LEE

IPC: H01B3/40

CPC classification number: H01B3/40 ,  C08J5/18 ,  C08J5/24 ,  C08K2201/011 ,  C09K19/3809 ,  C09K19/404 ,  H05K1/0373 ,  H05K3/4676 ,  H05K2201/0209 ,  C08K3/346 ,  C08L63/00 ,  C08K9/02

Abstract: The present invention relates to an insulating composition for a multilayer printed circuit board including: nanoclay 0.5 to 10 wt %, a soluble liquid crystal oligomer 5 to 50 wt %, an epoxy resin 5 to 50 wt %, a solvent 5 to 40 wt %, and an inorganic filler 50 to 80 wt %, a prepreg and an insulating film using the composition, and a multilayer printed circuit board including the prepreg and the insulating film as an interlayer insulating layer. Accordingly, the composition prepared by mixing nanoclay with the soluble liquid crystal oligomer (LCO), the epoxy resin, and the inorganic filler having excellent thermal, electrical, and mechanical characteristics can be implemented as a substrate insulating material such as a prepreg or a film which can implement a low efficient of thermal expansion, high rigidity, and high thermal characteristics required for a package substrate with advanced specifications.

Abstract translation: 本发明涉及一种多层印刷电路板用绝缘组合物，其包含：0.5〜10重量％的纳米粘土，5〜50重量％的可溶性液晶低聚物，5〜50重量％的环氧树脂，5〜40重量％ ，无机填料50〜80重量％，使用该组合物的预浸料和绝缘膜，以及包含预浸料和绝缘膜作为层间绝缘层的多层印刷电路板。 因此，通过将纳米粘土与可溶性液晶低聚物（LCO），环氧树脂和具有优异的热，电和机械特性的无机填料混合制备的组合物可以实现为基材绝缘材料如预浸料或薄膜 这可以实现具有先进规格的封装衬底所需的低热膨胀，高刚性和高热特性。

公开(公告)号：US20200185141A1

公开(公告)日：2020-06-11

申请号：US16567532

申请日：2019-09-11

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Ye Eun JEONG ,  Jin Ho HONG

IPC: H01F27/28 ,  H01F27/29 ,  H01F27/32 ,  H01F41/04

Abstract: A coil electronic component includes a body including a laminate structure including a plurality of coil layers, and external electrodes disposed externally on the body. Each of the plurality of coil layers includes an insulating layer, a base pattern, and a coil pattern disposed on the base pattern, and a conductive via connecting the coil pattern to an adjacent coil layer, and the base pattern includes an intermetallic compound of Cu and Sn, and the coil pattern includes a Cu component.

公开(公告)号：US20200090848A1

公开(公告)日：2020-03-19

申请号：US16693960

申请日：2019-11-25

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Sa Yong LEE ,  Yong Il KWON ,  Jin Ho HONG ,  Sung Han KIM ,  Keun Yong LEE

IPC: H01F17/00

Abstract: A chip component includes a magnetic substrate having ferrite layers, and an insulating layer disposed on the magnetic substrate and having an electrode disposed therein. An external electrode is connected to the electrode on the insulating layer. The magnetic substrate and the insulating layer have a chemical coupling structure formed on an interface therebetween. The chemical coupling structure includes Si—O—C or Si—O—N.

公开(公告)号：US20220013302A1

公开(公告)日：2022-01-13

申请号：US17095104

申请日：2020-11-11

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Youn Soo KIM ,  Hyun Sub OH ,  Hee Sung CHOI ,  Hong Kyu SHIN ,  Jin Ho HONG ,  Yong Sam LEE ,  Jung Youn KIM ,  Ran Suk YANG

IPC: H01G9/15 ,  H01G9/048 ,  H01G9/042

Abstract: The present disclosure relates to a solid electrolytic capacitor, including a body comprising a tantalum wire disposed on one end thereof; a substrate, on which the body is disposed, comprising an insulating layer, first and second wiring layers respectively disposed on a first surface and a second surface, facing each other, of the insulating layer, and a via electrode penetrating the insulating layer to connect the first and second wiring layers to each other; and a connection portion connecting the tantalum wire to the first wiring layer.

公开(公告)号：US20150114691A1

公开(公告)日：2015-04-30

申请号：US14525037

申请日：2014-10-27

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jin Ho HONG ,  Sang Hyun Shin ,  Sa Yong Lee ,  Sung Han Kim ,  Keun Yong Lee

IPC: H05K1/03 ,  H05K1/18 ,  H05K1/11

CPC classification number: H05K1/0306 ,  H05K1/0366 ,  H05K1/188 ,  H05K3/022 ,  H05K2201/0116 ,  H05K2201/10015 ,  H05K2203/1126 ,  Y10T29/4913

Abstract: Disclosed herein are a core substrate and a method for manufacturing the same. According to a preferred embodiment of the present invention, a core substrate includes: a porous scaffold formed with a void; an insulating material formed to fill a void of the porous scaffold; and an electronic device embedded into the porous scaffold and the insulating material and having internal electrodes exposed on both surfaces thereof.

Abstract translation: 这里公开了核心基板及其制造方法。 根据本发明的优选实施例，芯基板包括：形成有空隙的多孔支架; 形成为填充多孔支架的空隙的绝缘材料; 以及嵌入到所述多孔支架中的电子装置和所述绝缘材料，并且在其两个表面上露出内部电极。

公开(公告)号：US20150027763A1

公开(公告)日：2015-01-29

申请号：US14143681

申请日：2013-12-30

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Jin Ho HONG ,  Geum Hee Yun ,  Dae Hui Jo ,  Sa Yong Lee ,  Jin Young Kim ,  Keun Yong Lee

IPC: H05K1/03 ,  H05K1/02 ,  C09C1/40

CPC classification number: H05K1/0373 ,  C01P2004/61 ,  C01P2004/62 ,  C01P2004/64 ,  C01P2004/80 ,  C01P2006/22 ,  C09C1/405 ,  C09C3/063 ,  C09C3/12 ,  H05K1/036 ,  H05K1/0366 ,  H05K3/4676 ,  H05K2201/0191 ,  H05K2201/0195 ,  H05K2201/0209 ,  H05K2201/0227 ,  H05K2201/0239 ,  H05K2201/068

Abstract: An inorganic filler has a negative coefficient of thermal expansion, and a shell thereon that decreases diffusion of ions contained in the inorganic filler to outside of the shell and organic filler.

Abstract translation: 无机填料具有负的热膨胀系数和其上的壳，其使包含在无机填料中的离子的扩散减少到壳外部和有机填料。