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    Electronic device including antenna supporting structure
    1.
    发明授权
    Electronic device including antenna supporting structure 有权

    公开(公告)号：US12272863B2

    公开(公告)日：2025-04-08

    申请号：US18109006

    申请日：2023-02-13

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Yonghee An ,  Pilwon Seo ,  Bitna Kim ,  Haewon Sung ,  Yongwon Cho ,  Junhee Han ,  Jeongseob Kim ,  Hyunsuk Choi

    IPC: H01Q1/24 ,  H01Q5/307 ,  H01Q9/04

    Abstract: An electronic device includes a housing, an antenna structure disposed in an inner space of the housing, a wireless communication circuit disposed in the inner space, and a first bracket. The antenna structure includes a substrate having a first substrate surface facing in a first direction and a second substrate surface facing in a second direction opposite to the first substrate surface, and a plurality of chip antennas sequentially arranged on the first substrate surface in a third direction perpendicular to the first direction. Each of the plurality of chip antennas includes an antenna element and is separated in the third direction from remaining chip antennas by separation spaces. The first bracket includes first and second protrusions that protrude in the second direction to correspond to the first substrate surface of the substrate. The protrusions are aligned, in the third direction, with the separation spaces.

    Electronic device including connector to which accessory device is attachable
    3.
    发明授权
    Electronic device including connector to which accessory device is attachable 有权

    公开(公告)号：US11733741B2

    公开(公告)日：2023-08-22

    申请号：US17309455

    申请日：2019-11-28

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Haewon Sung ,  Jungbae Park ,  Samyeol Kang ,  Bitna Kim

    IPC: G06F1/16 ,  G06F3/0354

    CPC classification number: G06F1/1684 ,  G06F3/03545 ,  G06F1/169

    Abstract: An electronic device to which an accessory device is attachable according to various embodiments of the disclosure includes a housing including a first opening and a second opening and a connector at least partially exposed through the first opening and the second opening. The connector includes a main body, a button part seated on the main body so as to be movable in a first direction or a second direction, a first elastic member mounted between the main body and the button part, a movable part seated on the main body, and a second elastic member mounted between the main body and the movable part. A portion of the button part is exposed through the first opening, and a portion of the movable part is exposed through the second opening.

    SEMICONDUCTOR DEVICES
    4.
    发明申请
    SEMICONDUCTOR DEVICES 有权

    公开(公告)号：US20250169064A1

    公开(公告)日：2025-05-22

    申请号：US18735338

    申请日：2024-06-06

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Bitna Kim ,  Jinbum Kim ,  Kyeonggyu Lee ,  Sunguk Jang ,  Sunghwan Jang ,  Wonhee Choi

    IPC: H10B12/00

    Abstract: A semiconductor device includes a bit line on a substrate, a channel on the bit line, a first gate structure on a first sidewall of the channel, a contact structure between the bit line and the channel, the contact structure contacting the bit line and the channel, the contact structure including: a first contact including a semiconductor material doped with first impurities, the first impurities including a first diffusion coefficient, and a second contact on the first contact, the second contact contacting the first contact, the second contact including a semiconductor material doped with second impurities, the second impurities including a second diffusion coefficient, the second diffusion coefficient being less than the first diffusion coefficient, and a capacitor on and electrically connected to the channel.

    PROTECTIVE COVER AND MANUFACTURING METHOD THEREOF
    5.
    发明申请
    PROTECTIVE COVER AND MANUFACTURING METHOD THEREOF 审中-公开
    保护罩及其制造方法

    公开(公告)号：US20160249731A1

    公开(公告)日：2016-09-01

    申请号：US15056151

    申请日：2016-02-29

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Joonyoung JO ,  Taeseuk Kang ,  Donghyeon Kim ,  Bitna Kim ,  Hosung Bang ,  Haewon Sung

    IPC: A45F5/00 ,  A45C11/00

    CPC classification number: A45C11/00 ,  A45C5/02 ,  A45C2011/001 ,  A45C2011/002 ,  A45C2011/003 ,  G06F1/1626 ,  G06F2200/1633 ,  H04B1/3888 ,  H04M1/0214 ,  H04M1/185

    Abstract: A method of manufacturing a protective cover for an electronic device is disclosed. The method includes forming an inner skin by blanking, blanking an outer skin of a fabric member in a shape corresponding to the blanked inner skin, forming a preform of a protective cover by laminating the inner skin and the outer skin with each other, thermo-compressing the laminated preform along an outer peripheral edge of the protective cover and forming the protective cover by cutting at least a portion of a region where the preform is thermo-compressing by the blanking.

    Abstract translation: 公开了一种制造电子设备用保护罩的方法。 该方法包括通过消隐来形成内皮，以对应于被冲切的内皮的形状冲切织物的外皮，通过将内皮和外皮相互层压形成保护罩的预成型件， 沿着保护盖的外周边缘压缩层叠的预制件，并通过切割预成型件通过冲裁来热压缩的区域的至少一部分来形成保护盖。

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