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    Semiconductor package
    1.
    发明授权
    Semiconductor package 有权

    公开(公告)号：US11329014B2

    公开(公告)日：2022-05-10

    申请号：US16703279

    申请日：2019-12-04

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Myungsam Kang ,  Changbae Lee ,  Bongju Cho ,  Younggwan Ko ,  Yongkoon Lee ,  Moonil Kim ,  Youngchan Ko

    IPC: H01L23/66 ,  H01L23/31 ,  H01L23/498 ,  H01L23/00 ,  H01L23/522

    Abstract: A semiconductor package includes: a connection structure including one or more redistribution layers; a core structure disposed on a surface of the connection structure; a semiconductor chip disposed on the surface and including connection pads electrically connected to the redistribution layers of the connection structure; a first encapsulant disposed on the surface and covering at least a portion of each of the core structure and the semiconductor chip; an antenna substrate disposed on the first encapsulant and including one or more wiring layers, at least a portion of the wiring layers including an antenna pattern; and a through via penetrating at least a portion of each of the connection structure, the core structure, the first encapsulant, and the antenna substrate.

    Apparatus and method for generating moving image data including multiple section images in electronic device
    2.
    发明授权
    Apparatus and method for generating moving image data including multiple section images in electronic device 有权

    公开(公告)号：US11159739B2

    公开(公告)日：2021-10-26

    申请号：US16534081

    申请日：2019-08-07

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Dongsoo Kim ,  Shuichi Shimokawa ,  Kawang Kang ,  Hwayong Kang ,  Yeongeun Kim ,  Yeotak Youn ,  Youngkwon Yoon ,  Changbae Lee ,  Jonghoon Won ,  Kihuk Lee

    IPC: H04N5/235

    Abstract: According to various embodiments, an electronic device includes an image sensor, a memory, and a processor. The processor is configured to control the electronic device to: obtain a plurality of image frames including external light and an external object at a first designated frame rate using the image sensor, based on a capturing signal; identify a frequency of a flicker related to the external light source; generate first section images for at least a part of a time for which the plurality of image frames are obtained using frames selected from the plurality of image frames corresponding to a second designated frame rate based at least on the frequency, the second designated frame rate being lower than the first designated frame rate; generate second section images for at least a part of the time for which the plurality of image frames are obtained in response at least to a designated input using image frames obtained at the first designated frame rate after the designated input from among the plurality of image frames; and generate moving image data including at least the first section images and the second section images.

    SEMICONDUCTOR PACKAGE
    3.
    发明申请
    SEMICONDUCTOR PACKAGE 有权

    公开(公告)号：US20220262748A1

    公开(公告)日：2022-08-18

    申请号：US17737472

    申请日：2022-05-05

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Myungsam KANG ,  Changbae Lee ,  Bongju Cho ,  Younggwan Ko ,  Yongkoon Lee ,  Moonil Kim ,  Youngchan Ko

    IPC: H01L23/66 ,  H01L23/31 ,  H01L23/498 ,  H01L23/00 ,  H01L23/522

    Abstract: A semiconductor package includes: a connection structure having a first surface and a second, and including a redistribution layer; a passive component disposed on the first surface of the connection structure, and electrically connected to the redistribution layer; a semiconductor chip disposed on the first surface of the connection structure, and electrically connected to the redistribution layer; a first encapsulant disposed on the first surface of the connection structure and covering at least a portion of the semiconductor chip; a second encapsulant disposed on the first surface of the connection structure and covering at least a portion of the passive component; an antenna substrate disposed on the first encapsulant and including a wiring layer, at least a portion of the wiring layer including an antenna pattern; and a through via penetrating at least a portion of each of the connection structure, the first encapsulant, and the antenna substrate.

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