Abstract:
An integrated circuit device includes a substrate including a first region and a second region, a first transistor in the first region, the first transistor being an N-type transistor and including a first silicon-germanium layer on the substrate, and a first gate electrode on the first silicon-germanium layer, and a second transistor in the second region and including a second gate electrode, the second transistor not having a silicon-germanium layer between the substrate and the second gate electrode.
Abstract:
A capacitor structure comprises a substrate extending in a horizontal direction of extension. A first gate insulating film is on the substrate and a first gate pattern is on the first gate insulating film. A first finger-shaped electrode is on the first gate pattern, and a second finger-shaped electrode is on the first gate pattern and alternately disposed with the first electrode to be spaced apart from the first electrode in the horizontal direction. The first electrode is connected to the first gate pattern, and the second electrode and the first gate pattern are insulated from each other.
Abstract:
A capacitor structure comprises a substrate extending in a horizontal direction of extension. A first gate insulating film is on the substrate and a first gate pattern is on the first gate insulating film. A first finger-shaped electrode is on the first gate pattern, and a second finger-shaped electrode is on the first gate pattern and alternately disposed with the first electrode to be spaced apart from the first electrode in the horizontal direction. The first electrode is connected to the first gate pattern, and the second electrode and the first gate pattern are insulated from each other.