公开(公告)号：US20140312993A1

公开(公告)日：2014-10-23

申请号：US14327151

申请日：2014-07-09

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kuang-woo NAM ,  In-sang SONG ,  Chul-soo KIM ,  Yun-kwon PARK ,  Eun-seok PARK

IPC: H03H9/46 ,  H03H9/54 ,  H03H9/64

CPC classification number: H03H9/46 ,  H03H3/02 ,  H03H3/08 ,  H03H9/105 ,  H03H9/1092 ,  H03H9/54 ,  H03H9/64 ,  H03H9/703 ,  H03H9/706 ,  H03H9/72 ,  H03H9/725 ,  H03H2003/0071 ,  Y10T29/42

Abstract: A method of fabricating a multi-band filter module is provided. The method includes forming a Film Bulk Acoustic Resonator (FBAR) on a piezoelectric substrate by forming a resonant part on the piezoelectric substrate and then an air gap recessed on a surface of the piezoelectric substrate and positioned under the resonant part; and forming a Surface Acoustic Wave (SAW) device on the piezoelectric substrate in which the steps of forming the FBAR and the SAW are concurrently performed.

Abstract translation: 提供一种制造多频带滤波器模块的方法。 该方法包括通过在压电基片上形成共振部分，然后形成凹陷在压电基片的表面上且位于谐振部分下方的气隙，在压电基片上形成薄膜体声波谐振器（FBAR）; 并在压电基板上形成表面声波（SAW）器件，其中形成FBAR和SAW的步骤同时进行。