公开(公告)号：US20250115785A1

公开(公告)日：2025-04-10

申请号：US18771727

申请日：2024-07-12

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Wonki HUR ,  Seokjoo KIM ,  Daehoon YANG ,  Sanghyun PARK ,  Gayoung KIM ,  Sangkyun KIM ,  Inkwon KIM ,  Eunho SONG ,  Jaekwang CHOI

IPC: C09G1/02 ,  B24B37/04 ,  C09K3/14 ,  C09K15/30 ,  H01L21/321

Abstract: A slurry composition for chemical mechanical metal polishing includes a corrosion inhibitor, abrasive particles, an oxidizing agent, and a solvent. The corrosion inhibitor includes a C2 to C30 aliphatic heterocyclic compound including at least one nitrogen atom in the ring and at least one functional group selected from a halogen, an amine group, a cyclic amine group, a nitro group, an amide group, a carboxyl group, a hydroxy group, a thiol group, an alkoxy group, a C10 to C30 alkyl group, or an ester group; or a C2 to C30 aromatic heterocyclic compound including at least one nitrogen atom in the ring and at least one functional group selected from a halogen, an amine group, a cyclic amine group, a nitro group, an amide group, a carboxyl group, a hydroxy group, a thiol group, an alkoxy group, a C10 to C30 alkyl group, and an ester group; or a combination thereof.