公开(公告)号：US10461400B2

公开(公告)日：2019-10-29

申请号：US15255568

申请日：2016-09-02

申请人： Samsung Electronics Co., Ltd.

发明人： Gi-Uk Gang ,  Byeonghwan Youm ,  Kyung Bin Kim

IPC分类号： H01Q1/24 ,  H01Q9/42 ,  H01Q5/371

摘要： Disclosed is an electronic device having a housing and including an antenna device, and a method of manufacturing the housing. When the antenna device requiring a plating process is applied to the housing, the housing has an antenna and provides exterior deposition and visual enhancement to the electronic device.

公开(公告)号：US09812768B2

公开(公告)日：2017-11-07

申请号：US14851580

申请日：2015-09-11

申请人： SAMSUNG ELECTRONICS CO., LTD.

发明人： Byeong-Hwan Youm ,  Gi-Uk Gang ,  Kyung-Bin Kim ,  Seung-Hwan Kim ,  Austin Kim ,  Joon-Ho Byun

IPC分类号： H01Q1/24 ,  H01Q1/40 ,  B29C45/16 ,  B29K69/00 ,  B29L31/34 ,  H04M1/02

CPC分类号： H01Q1/40 ,  B29C45/1671 ,  B29C2045/1673 ,  B29K2069/00 ,  B29K2995/0025 ,  B29K2995/0026 ,  B29L2031/3437 ,  B29L2031/3456 ,  B29L2031/3481 ,  H01Q1/243 ,  H04M1/026

摘要： An example antenna device may includes a base member, an antenna that is attached to the base member, and a cover member that is attached to surround at least a part of the base member and at least a part of the antenna. A first part of the base member that is attached to the cover member has a melting temperature equal to or lower than that of the cover member. A second part of the base member to which the antenna is attached has a higher melting temperature than the cover member.

公开(公告)号：US09722301B2

公开(公告)日：2017-08-01

申请号：US15256926

申请日：2016-09-06

申请人： SAMSUNG ELECTRONICS CO., LTD.

发明人： Kyung Bin Kim ,  Jinu Kim ,  Byeonghwan Youm ,  Gi-Uk Gang ,  Nak-Chung Choi

IPC分类号： H05K5/02 ,  H01Q1/24 ,  H05K5/03 ,  H05K5/00

CPC分类号： H01Q1/243 ,  H01Q9/42 ,  H01Q21/28 ,  H05K5/0217 ,  H05K5/0247

摘要： Various embodiments of the present disclosure may provide an electronic device that includes: a first cover configured to form a first surface of the electronic device; a second cover configured to form a second surface of the electronic device, the second cover being opposite to the first surface; a conductive sidewall configured to surround at least a part of a space formed between the first cover and the second cover; a conductive member located in the space and configured to integrally extend from the conductive sidewall, the conductive member including a first surface directed toward the first cover and a second surface directed toward the second cover; a non-conductive member located in the space to make contact with the conductive member, the non-conductive member including a first surface directed toward the first cover and a second surface directed toward the second cover; a conductive pattern disposed on the second surface of the non-conductive member and electrically connected to the conductive member; and a conductive structure disposed between the conductive pattern and the conductive member to electrically connect the conductive pattern to the conductive member. The non-conductive member may include a via hole that at least partially passes through the area between the first surface and the second surface thereof, and the conductive structure may include a first part having a first cross-sectional area and a second part having a second cross-sectional area that is larger than the first cross-sectional area, wherein at least a part of the conductive structure may be disposed within a through-hole of the non-conductive member, and the second part may be disposed closer to the second surface of the non-conductive member than the first part. Various other embodiments are possible.