公开(公告)号：US20230207487A1

公开(公告)日：2023-06-29

申请号：US17876099

申请日：2022-07-28

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jinhyun KANG ,  Haejung YU ,  Soohyun NAM ,  Ilbok LEE

IPC: H01L23/00

CPC classification number: H01L23/562 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204

Abstract: A semiconductor package including a substrate including, at an upper surface thereof, an inner area and an edge area surrounding the inner area, a chip set on the inner area of the substrate, a stiffener set on the edge area of the substrate, the stiffener set including a plurality of stiffeners spaced apart from one another, and an adhesive member attaching the plurality of stiffeners to the substrate may be provided.

公开(公告)号：US20230178469A1

公开(公告)日：2023-06-08

申请号：US18054225

申请日：2022-11-10

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Soohyun NAM ,  Haejung YU

IPC: H01L23/498 ,  H01L25/065 ,  H01L23/00 ,  H01L23/31

CPC classification number: H01L23/49838 ,  H01L23/3135 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49833 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L25/0652 ,  H01L2224/16145 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/182 ,  H01L2924/1431 ,  H01L2924/1436 ,  H01L2924/1811

Abstract: A semiconductor package includes an interposer including a base layer and a plurality of interposer through-electrodes penetrating the base layer; at least one stacked structure attached to the interposer and including a first semiconductor chip, a plurality of second semiconductor chips sequentially stacked on the first semiconductor chip, and a chip molding layer on a side surface of the plurality of second semiconductor chips; a plurality of third semiconductor chips attached to the interposer adjacent the at least one stacked structure; and a package molding layer extending around the at least one stacked structure and the plurality of third semiconductor chips on the interposer.