公开(公告)号：US11594443B2

公开(公告)日：2023-02-28

申请号：US16892492

申请日：2020-06-04

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hoechul Kim ,  Taeyeong Kim ,  Hakjun Lee ,  Hoonjoo Na

IPC: H01L21/683 ,  H01L21/50 ,  H01L23/00 ,  H01L21/603

Abstract: A substrate bonding apparatus includes a first bonding chuck configured to support a first substrate and a second bonding chuck configured to support a second substrate such that the second substrate faces the first substrate. The first bonding chuck includes a first base, a first deformable plate on the first base and configured to support the first substrate and configured to be deformed such that a distance between the first base and the first deformable plate is varied, and a first piezoelectric sheet on the first deformable plate and configured to be deformed in response to power applied thereto to deform the first deformable plate.

公开(公告)号：US10923452B2

公开(公告)日：2021-02-16

申请号：US16783342

申请日：2020-02-06

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Ilyoung Han ,  Taeyeong Kim ,  Jihoon Kang ,  Nohsung Kwak ,  Seokho Kim ,  Hoechul Kim ,  Ilhyoung Lee ,  Hakjun Lee

IPC: H01L23/00 ,  H01L21/67 ,  H01L21/687 ,  H01L21/683

Abstract: A substrate bonding apparatus for bonding a first substrate to a second substrate includes: a first bonding chuck including: a first base; a first deformable plate provided on the first base to support the first substrate; and a first pneumatic adjustor configured to deform the first deformable plate by adjusting a first pressure in a first cavity formed between the first deformable plate and the first base; and a second bonding chuck including: a second base; a second deformable plate provided on the second base to support the second substrate; and a second pneumatic adjustor configured to deform the second deformable plate by adjusting a second pressure in a second cavity formed between the second deformable plate and the second base. The first deformable plate is deformed such that a first distance between the first base and the first deformable plate is varied based on the first pressure, and the second deformable plate is deformed such that a second distance between the second base the second deformable plate is varied based on the second pressure.