公开(公告)号：US20160264819A1

公开(公告)日：2016-09-15

申请号：US15056273

申请日：2016-02-29

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sang Soo JEE ,  Min Sang KIM ,  Hyunjeong JEON ,  Hongkyoon CHOI ,  Byunghee SOHN

IPC: C09D179/08 ,  B05D1/26

CPC classification number: C09D179/08 ,  B05D1/26 ,  B05D1/265 ,  C08G73/1042 ,  C08G73/1067 ,  C08K3/36

Abstract: A slot extrusion coating method includes: preparing a composition including a condensation polymerization product of a diamine and a mixture of an acid dianhydride or an acid dianhydride and a reactive carbonyl compound, an imidized product thereof, or a mixture thereof, wherein the composition has a viscoelasticity having a tan δ of less than about 96 at a strain of about 1 percent and an angular frequency of more than about 0 to less than about 10 radians per second, and coating the composition on a substrate using a slit coater.

Abstract translation: 狭缝挤出涂布方法包括：制备包含二胺与酸二酐或酸二酐与反应性羰基化合物的混合物的缩聚产物，其酰亚胺化产物或其混合物的组合物，其中组合物具有 在大约1％的应变和大于约0至小于约10弧度/秒的角频率下具有小于约96的tanδ的粘弹性，并使用狭缝涂布机将该组合物涂覆在基底上。

公开(公告)号：US20170130004A1

公开(公告)日：2017-05-11

申请号：US15346876

申请日：2016-11-09

Applicant: SAMSUNG ELECTRONICS CO., LTD. ,  Samsung SDI Co., Ltd.

Inventor： Hongkyoon CHOI ,  Chanjae AHN ,  Hyunjeong JEON ,  Sang Soo JEE ,  Sungwon CHOI ,  Sung Woo HONG ,  Byunghee SOHN

IPC: C08G73/14 ,  C09J179/08 ,  C09D179/08

CPC classification number: C08G73/14 ,  C08G73/1039 ,  C08G73/1042 ,  C08G73/1067 ,  C09D179/08 ,  C09J179/08

Abstract: A poly(imide-amide) copolymer including a structural unit represented by Chemical Formula 1; a structural unit represented by Chemical Formula 2; and any one of a structural unit represented by Chemical Formula 3, an amic acid precursor of the structural unit represented by Chemical Formula 3, and a combination thererof; wherein a cured material of the poly(imide-amide) copolymer may have a tensile modulus of greater than or equal to about 5.5 GPa, and a yellowness index of less than or equal to about 5: wherein, groups and variables in Chemical Formulae 1 and 3 are the same as described in the specification.

公开(公告)号：US20170121460A1

公开(公告)日：2017-05-04

申请号：US15341318

申请日：2016-11-02

Applicant: SAMSUNG ELECTRONICS CO., LTD. ,  Samsung SDI Co., Ltd.

Inventor： Sung Woo HONG ,  Chanjae AHN ,  Hyunjeong JEON ,  Sang Soo JEE ,  Hongkyoon CHOI ,  Byunghee SOHN ,  Sungwon CHOI

IPC: C08G73/14

CPC classification number: C08G73/14 ,  C08G73/1028 ,  C08G73/1039 ,  C08G73/1042 ,  C08G73/1067

Abstract: A poly(imide-amide) copolymer, which is a product of a reaction between a diamine including an amide structural unit-containing oligomer represented by Chemical Formula 1 and a dianhydride represented by Chemical Formula 3: wherein, groups and variables in Chemical Formulae 1 and 3 are the same as described in the specification.

公开(公告)号：US20200223983A1

公开(公告)日：2020-07-16

申请号：US16837193

申请日：2020-04-01

Applicant: SAMSUNG ELECTRONICS CO., LTD. ,  Samsung SDI Co., Ltd.

Inventor： Sung Woo HONG ,  Chanjae AHN ,  Hyunjeong JEON ,  Sang Soo JEE ,  Hongkyoon CHOI ,  Byunghee SOHN ,  Sungwon CHOI

IPC: C08G73/14 ,  C08G73/10

Abstract: A poly(imide-amide) copolymer, which is a product of a reaction between a diamine including an amide structural unit-containing oligomer represented by Chemical Formula 1 and a dianhydride represented by Chemical Formula 3: wherein, groups and variables in Chemical Formulae 1 and 3 are the same as described in the specification.

公开(公告)号：US20170218200A1

公开(公告)日：2017-08-03

申请号：US15419019

申请日：2017-01-30

Applicant: SAMSUNG ELECTRONICS CO., LTD. ,  Samsung SDI Co., Ltd.

Inventor： Chanjae AHN ,  Sungwon CHOI ,  Byunghee SOHN ,  A Ra JO ,  Kyeong-sik JU ,  Sang Soo JEE ,  Hongkyoon CHOI

IPC: C08L79/08 ,  C08G73/10 ,  C08G73/14

Abstract: A composition for preparing an article including a polyimide or poly(imide-amide) copolymer, the composition including (1) a solution including at least one of (i) a polymer including at least one selected from a structural unit represented by Chemical Formula 1 and a structural unit represented by Chemical Formula 2; and (ii) a copolymer including at least one selected from a structural unit represented by Chemical Formula 1 and a structural unit represented by Chemical Formula 2, and a structural unit represented by Chemical Formula 3, and (2) a metallic salt soluble in the solution of the polymer and/or the copolymer, wherein the metallic salt is a salt of a metal selected from a Group 1 element, a Group 11 element, a Group 13 element, and a Group 14 element: wherein in Chemical Formulae 1 to 3, A, B, D, and E are the same as defined in the detailed description.

公开(公告)号：US20170145166A1

公开(公告)日：2017-05-25

申请号：US15356952

申请日：2016-11-21

Applicant: SAMSUNG ELECTRONICS CO., LTD. ,  Samsung SDI Co., Ltd.

Inventor： Hyunjeong JEON ,  Sang Soo JEE ,  Hongkyoon CHOI ,  Byunghee SOHN ,  Kyeong-Sik JU

IPC: C08G83/00

CPC classification number: C08G83/001 ,  C08K5/549 ,  C08L79/08 ,  C09D179/08 ,  H01L51/5253 ,  C08L83/04

Abstract: A composition for preparing an organic/inorganic hybrid poly(amide-imide) copolymer including a poly(amide-imide) copolymer, a poly(amide-amic acid) copolymer, or a poly(amide-imide/amic acid) copolymer including a structural unit represented by Chemical Formula 1; and a structural unit represented by Chemical Formula 2, a structural unit represented by Chemical Formula 3, or a combination thereof, and a polyhedral oligomeric silsesquioxane including a functional group capable of forming a hydrogen bond: wherein in Chemical Formulae 1 to 3, A, B, D, and E are the same as defined in the detailed description.