WEARABLE ELECTRONIC DEVICE INCLUDING PLURALITY OF ANTENNAS AND COMMUNICATION METHOD THEREOF

    公开(公告)号:US20220285828A1

    公开(公告)日:2022-09-08

    申请号:US17702173

    申请日:2022-03-23

    Abstract: An electronic device includes a main body, a pair of glass lenses configured to be supported by the main body, at least one display module configured to be disposed on the pair of glass lenses, a first support configured to be rotatably connected to the main body, a second support configured to be rotatably connected to the main body and configured to be disposed to be spaced apart from the first support, a communication module configured to be disposed in the first support, a processor configured to be operatively connected to the communication module, a relay module configured to be disposed in the second support and configured to relay at least one signal, and a first antenna configured to be disposed in the second support and configured to be electrically connected to the relay module.

    INSPECTION APPARATUS OF WAFER
    9.
    发明申请

    公开(公告)号:US20210366102A1

    公开(公告)日:2021-11-25

    申请号:US17102700

    申请日:2020-11-24

    Abstract: An inspection apparatus includes a measurement device disposed to be spaced apart from an upper surface of a wafer, an image capturing device configured to capture an image of at least a portion of the measurement device and at least a portion of the upper surface of the wafer, a memory storing an algorithm to measure a distance between the measurement device and the upper surface of the wafer based on the image, and a controller configured to measure the distance between the measurement device and the upper surface of the wafer based on the algorithm, wherein the image includes a measurement region in which the measurement device is displayed, a wafer region in which the wafer is displayed, and a reflective region in which the measurement device being reflected on the upper surface of the wafer is displayed, and wherein the wafer region and the reflective region overlap with each other.

    Inspection apparatus and method of inspecting wafer

    公开(公告)号:US12196669B2

    公开(公告)日:2025-01-14

    申请号:US17882673

    申请日:2022-08-08

    Abstract: An inspection apparatus includes: a first probe including a receiver antenna configured to detect the terahertz wave emitted by an inspection signal source and that has passed through the wafer, wherein the first probe includes: a first probe tip in which the receiver antenna is embedded, the receiver antenna including a first photoconductive switch; a first printed circuit board on which the first probe tip is mounted; a first optical bracket coupled to the first printed circuit board; a first optical connector configured to transmit a first laser beam into the first probe, and coupled to the first optical bracket, wherein the first laser beam is configured to excite the first photoconductive switch.

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