公开(公告)号：US12069818B2

公开(公告)日：2024-08-20

申请号：US17715385

申请日：2022-04-07

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Ilhan Yun ,  Sungki Lee ,  Suin Kim

IPC: H05K5/02

CPC classification number: H05K5/0208

Abstract: A solid state drive case includes a lower cover having a sidewall defining an internal space. The sidewall includes a protrusion disposed on an end portion of the sidewall. An upper cover has a first surface directly contacting the sidewall of the lower cover and a second surface opposite to the first surface. The upper cover has a hole overlapping the protrusion and configured to receive the protrusion. A sealing label is attached to the second surface of the upper cover. The sealing label has an area that is less than an area of an entirety of the second surface of the cover. At least a portion of the sealing label is attached to an end portion of the protrusion.

公开(公告)号：US10320105B2

公开(公告)日：2019-06-11

申请号：US15785571

申请日：2017-10-17

Applicant: Samsung Electronics Co., Ltd.

Inventor： Ilhan Yun

IPC: H05K5/00 ,  H01R12/72 ,  H01R12/70 ,  H05K1/11 ,  H05K1/18

Abstract: Printed circuit boards and solid state drives including the same are provided. The printed circuit boards may include a base portion including chip pads that are configured to be connected to semiconductor chips, an edge portion extending from one side of the base portion and including interface pads, guide portions, and protrusions. Each of the guide portions may protrude from a respective one of opposing ends of the edge portion in a first direction and may have a first width, and the guide portions may be spaced apart from each other. Each of the protrusions may protrude from a respective one of the guide portions and may have a second width that is less than the first width. A distance between the protrusions may be substantially equal to a distance between the guide portions.

公开(公告)号：US20180109023A1

公开(公告)日：2018-04-19

申请号：US15785571

申请日：2017-10-17

Applicant: Samsung Electronics Co., Ltd.

Inventor： Ilhan Yun

IPC: H01R12/72 ,  H05K1/11 ,  H05K1/18 ,  H01R12/70

CPC classification number: H01R12/724 ,  H01R12/7005 ,  H01R12/725 ,  H05K1/111 ,  H05K1/117 ,  H05K1/181 ,  H05K2201/09036 ,  H05K2201/10159 ,  H05K2201/10189 ,  H05K2201/10325 ,  H05K2201/10522 ,  Y02P70/611

Abstract: Printed circuit hoards and solid state drives including the same are provided. The printed circuit boards may include a base portion including chip pads that are configured to be connected to semiconductor chips, an edge portion extending from one side of the base portion and including it pads, guide portions, and, protrusions. Each of the guide portions may protrude from a respective one of opposing ends of the edge portion in :a first direction and may have a first width, and the guide portions may be spaced apart from each other. Each of the protrusions may protrude from a respective one of the guide portions and may have a second width that is less than the first width. A distance between the protrusions may be substantially equal to a distance between the guide portions.