-
公开(公告)号：US20230114892A1
公开(公告)日：2023-04-13
申请号：US17745601
申请日：2022-05-16
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： JONGWAN KIM , YONGKWAN LEE , KYONGHWAN KOH , SEUNGHWAN KIM , JUNGJOO KIM , JUNWOO PARK , TAEJUN JEON
IPC: H01L23/552 , H01L23/66 , H01L23/31 , H01L23/29
Abstract: A semiconductor package includes; a package substrate, a semiconductor chip on the package substrate, an electromagnetic shield structure on the package substrate and including an upper cover covering an upper surface of the semiconductor chip and a side cover surrounding the semiconductor chip, and a sealing member contacting the semiconductor chip and the electromagnetic shield structure, wherein the side cover includes first through holes and the upper cover includes second through holes.
-
公开(公告)号：US20240347401A1
公开(公告)日：2024-10-17
申请号：US18754605
申请日：2024-06-26
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： KYONG HWAN KOH , JONGWAN KIM , JUHYEON OH , YONGKWAN LEE
CPC classification number: H01L23/13 , H01L21/4803 , H01L21/561 , H01L23/3107 , H01L23/49838 , H01L23/49827 , H01L24/06 , H01L24/48 , H01L24/49 , H01L24/73 , H01L2224/06135 , H01L2224/48227 , H01L2224/49173 , H01L2224/73265
Abstract: A semiconductor package includes a base substrate that includes a first surface and a second surface that face each other, a plurality of first metal line patterns disposed on the first surface, a plurality of second metal line patterns disposed on the second surface, a plurality of vias that penetrate the base substrate and connect the first metal line patterns to the second metal line patterns, a semiconductor chip disposed on the first surface, and a molding member that covers the first surface and the semiconductor chip. The base substrate includes at least one recess at a corner of the base substrate. The recess extends from the first surface toward the second surface. The molding member includes a protrusion that fills the recess.
-
Search Results
2
records
(took 0.012 seconds)
